Semiconductor IC device having a RAM interposed between different logic sections and by-pass signal lines extending over the RAM for mutually connecting the logic sections

Claim 2

A semiconductor integrated circuit device comprising: a semiconductor substrate having a main surface; a first logic circuit block and a separate, second logic circuit block being disposed on said main surface of said substrate, respectively, each of said first and second logic circuit blocks including a plurality of logic gates; a RAM type memory mat and a peripheral circuit thereof being provided on said main surface between said first and second logic circuit blocks, said RAM type memory mat including a plurality of memory cells, a plurality of first signal lines of a first level wiring layer and a plurality of second signal lines of a second level wiring layer, said second level wiring layer being arranged at a relatively higher level, of a multi-layer wiring arrangement, than said first level wiring layer with respect to the main surface of said semiconductor substrate, and said first and second signal lines being disposed in a coupling arrangement so that each memory cell is coupled to a first signal line and a second signal line; and a plurality of third signal lines of a third level wiring layer, for connecting said first logic circuit block with said second logic circuit block, being disposed over said main surface, said third level wiring layer being arranged at a higher level wiring layer than said second level wiring layer with respect to the main surface of said semiconductor substrate, wherein said third signal lines and said second signal lines are disposed to intersect each other, with respect to a plan view, at substantially right angles over said RAM type memory mat, and wherein said third signal lines are extended in a substantially straight-line form over said RAM type memory mat.

Claim 3

A semiconductor integrated circuit device according to claim 1, wherein said second signal lines include word lines of said RAM type memory mat.

Claim 4

A semiconductor integrated circuit device according to claim 2, wherein said first signal lines include complementary data line pairs of said RAM type memory mat.

Claim 5

A semiconductor integrated circuit device according to claim 3, wherein said complementary data line pairs are coupled to said peripheral circuit of said RAM type memory mat, and wherein said peripheral circuit is coupled to said first logic circuit block.

Claim 6

A semiconductor integrated circuit device according to claim 3, wherein said plurality of logic gates of both of said first and second logic circuit blocks are comprised of transistors.

Claim 7

A semiconductor integrated circuit device according to claim 5, wherein said transistors are bipolar transistors.

Claim 8

A semiconductor integrated circuit device according to claim 5, wherein said transistors consist of composite arrangements of bipolar transistors and MOS transistors.

Claim 9

A semiconductor integrated circuit device according to claim 3, wherein each of said plurality of memory cells of said RAM type memory mat comprises a bipolar-static memory cell.

Claim 10

A semiconductor integrated circuit device according to claim 8, wherein said plurality of logic gates of both of said first and second logic circuit blocks are comprised of transistors.

Claim 11

A semiconductor integrated circuit device according to claim 9, wherein the main surface of said semiconductor substrate is a front surface of a semiconductor chip, and wherein said RAM type memory mat is disposed on the front surface of said semiconductor chip at a substantially central position thereof.

Claim 12

A semiconductor integrated circuit device according to claim 3, wherein each of said plurality of memory cells of said RAM type memory mat comprises a MOS-static memory cell having a MOS transistor and a load resistance.

Claim 13

A semiconductor integrated circuit device according to claim 11, wherein said plurality of logic gates of both of said first and second logic circuit blocks are comprised of transistors.

Claim 14

A semiconductor integrated circuit device according to claim 12, wherein the main surface of said semiconductor substrate is a front surface of a semiconductor chip, and wherein said RAM type memory mat is disposed on the front surface of said semiconductor chip at a substantially central position thereof.

Claim 15

A semiconductor integrated circuit device according to claim 3, wherein the main surface of said semiconductor substrate is a front surface of a semiconductor chip, and wherein said RAM type memory mat is disposed on the front surface of said semiconductor chip at a substantially central position thereof.

Claim 16

A semiconductor integrated circuit device according to claim 3, wherein said first, second and third signal lines are comprised of aluminum.

Claim 17

A semiconductor integrated circuit device according to claim 1, wherein said plurality of logic gates of both of said first and second logic circuit blocks are comprised of bipolar transistors.

Claim 18

A semiconductor integrated circuit device according to claim 1, wherein said plurality of logic gates of both of said first and second logic circuit blocks are comprised of bipolar transistors and MOS transistors.

Claim 19

A semiconductor integrated circuit device according to claim 1, wherein each of said plurality of memory cells of said RAM type memory mat comprises a bipolar-static memory cell.

Claim 20

A semiconductor integrated circuit device according to claim 1, wherein each of said plurality of memory cells of said RAM type memory mat comprises a MOS-static memory cell having a MOS transistor and a load resistance.

Claim 21

A semiconductor integrated circuit device according to claim 1, wherein the main surface of said semiconductor substrate is a front surface of a semiconductor chip, and wherein said RAM type memory mat is disposed on the front surface of said semiconductor chip at a substantially central position thereof.

Claim 22

A semiconductor integrated circuit device according to claim 1, wherein said first, second and third signal lines are comprised of aluminum.

Claim 23

A semiconductor integrated circuit device comprising: a semiconductor substrate having a main surface; a first logic circuit block and a separate, second logic circuit block being disposed on said main surface of said substrate, respectively, each of said first and second logic circuit blocks operating on internally provided signals to produce internal logic signals and including a plurality of logic gates; a RAM type memory mat and a peripheral circuit thereof being provided on said main surface between said first and second logic circuit blocks, said RAM type memory mat including a plurality of memory cells, a plurality of first signal lines of a first level wiring layer and a plurality of second signal lines of a second level wiring layer, said second level wiring layer being arranged at a relatively higher level, of a multi-layer wiring arrangement, than said first level wiring layer with respect to the main surface of said semiconductor substrate, and said first and second signal lines being disposed in a coupling arrangement so that each memory cell is coupled to a first signal line and a second signal line; and a plurality of third signal lines of a third level wiring layer, for connecting said first logic circuit block with said second logic circuit block, being disposed over said main surface, said third level wiring layer being arranged at a higher level wiring layer than said second level wiring layer with respect to the main surface of said semiconductor substrate, wherein said third signal lines and said second signal lines are disposed to intersect each other, with respect to a plan view, at substantially right angles over said RAM type memory mat, and wherein said third signal lines are extended in a substantially straight-line form over said RAM type memory mat.

Claim 24

A semiconductor integrated circuit device comprising: a semiconductor substrate having a main surface; a first logic circuit block and a separate, second logic circuit block being disposed on said main surface of said substrate, respectively, each of said first and second logic circuit blocks operating on internally provided signals to produce internal logic signals and including a plurality of logic gates; a RAM type memory mat and a peripheral circuit thereof being provided on said main surface between said first and second logic circuit blocks, said RAM type memory mat including a plurality of memory cells, a plurality of first signal lines of a first level wiring layer and a plurality of second signal lines of a second level wiring layer, said second level wiring layer being arranged at a relatively higher level, of a multi-layer wiring arrangement, than said first level wiring layer with respect to the main surface of said semiconductor substrate, and said first and second signal lines being disposed in a coupling arrangement so that each memory cell is coupled to a first signal line and a second signal line; and a plurality of third signal lines of a third level wiring layer, for connecting said first logic circuit block with said second logic circuit block, being disposed over said main surface, said third level wiring layer being arranged at a higher level wiring layer than said second level wiring layer with respect to the main surface of said semiconductor substrate, wherein said third signal lines and said second signal lines are disposed to intersect each other, with respect to a plan view, at substantially right angles over said RAM type memory mat, and wherein said third signal lines are extended in a substantially straight-line form over said RAM type memory mat.

Claim 25

A semiconductor integrated circuit device according to claim 22, wherein said second signal lines include word lines of said RAM type memory mat.

Claim 26

A semiconductor integrated circuit device according to claim 23, wherein said first signal lines include complementary data line pairs of said RAM type memory mat.

Claim 27

A semiconductor integrated circuit device according to claim 24, wherein said complementary data line pairs are coupled to said peripheral circuit of said RAM type memory mat, and wherein said peripheral circuit is coupled to said first logic circuit block.

Claim 28

A semiconductor integrated circuit device according to claim 24, wherein said plurality of logic gates of both of said first and second logic circuit blocks are comprised of transistors.

Claim 29

A semiconductor integrated circuit device according to claim 26, wherein said transistors are bipolar transistors.

Claim 30

A semiconductor integrated circuit device according to claim 26, wherein said transistors consist of composite arrangements of bipolar transistors and MOS transistors.

Claim 31

A semiconductor integrated circuit device according to claim 22, wherein said plurality of logic gates of both of said first and second logic circuit blocks are comprised of bipolar transistors.

Claim 32

A semiconductor integrated circuit device according to claim 22, wherein said plurality of logic gates of both of said first and second logic circuit blocks are comprised of bipolar transistors and MOS transistors.

Claim 33

A semiconductor integrated circuit device according to claim 22, wherein each of said plurality of memory cells of said RAM type memory mat comprises a bipolar-static memory cell.

Claim 34

A semiconductor integrated circuit device according to claim 22, wherein each of said plurality of memory cells of said RAM type memory mat comprises a MOS-static memory cell having a MOS transistor and a load resistance.