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US5486131A Expired / Lapsed US ⏱️ 0.0 years remaining

Device for conditioning polishing pads

Assignee: Speedfam IPEC Corp
•
Filing: 1994-01-04
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Granted: 1996-01-23
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Expires: 2014-01-04
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Abstract

Abstract A device for conditioning the surface of a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis, comprising a rigid carrier element carrying cutting means on its bottom surface and which is adapted for vertical movement into and out of engagement with the surface of a polishing pad and which is adapted for oscillating horizontal movement over the surface of the polishing pad. The cutting means are dispersed in a circular or ring configuration.

Inventors

  • 👤 Joseph V. Cesna
  • 👤 Anthony G. Van Woerkom

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 18:16
CPC Classifications
B; B24; B24B; B24B1/00; B24B53/00; B24B53/017; B24B53/10

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 121 words
A process for simultaneously truing and dressing a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis which comprises while said polishing pad is being rotated bringing under pressure into contact with the top exposed surface of said polishing pad and oscillating over the said pad surface a carrier element adapted for vertical movement into and out of substantially perpendicular engagement with the surface of a polishing pad and for oscillating radial movement over the surface of the polishing pad, said carrier element being in the shape of a ring and carrying on its bottom surface cutting means disposed in a circular ring configuration for truing and dressing the polishing pad by contact therewith.
Claim 2
Dependent Claim 121 words
A process for simultaneously truing and dressing a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis which comprises while said polishing pad is being rotated bringing under pressure into contact with the top exposed surface of said polishing pad and oscillating over the said pad surface a carrier element adapted for vertical movement into and out of substantially perpendicular engagement with the surface of a polishing pad and for oscillating radial movement over the surface of the polishing pad, said carrier element being in the shape of a ring and carrying on its bottom surface cutting means disposed in a circular ring configuration for truing and dressing the polishing pad by contact therewith.
Claim 3
Dependent Claim 32 words
A process in accordance with claim 1 wherein the carrier element is provided with spaced cut-out portions along its periphery to permit materials to escape from the interior of the carrier element.
Claim 4
Dependent Claim 14 words
A process in accordance with claim 1 wherein the cutting means comprises diamond particles.
Claim 5
Dependent Claim 27 words
A process in accordance with claim 3 in which the diamond cutting means have a particle size of not larger than about 60 mesh, U.S. Sieve Series.
Claim 6
Dependent Claim 18 words
A process in accordance with claim 1 wherein the cutting elements comprise a blade having cutting teeth thereon.
Claim 7
Independent Claim 84 words
A device for simultaneously truing and dressing a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis, comprising a carrier element adapted for vertical substantially perpendicular movement into and out of engagement with the surface of a polishing pad and for oscillating radial movement over the surface of the polishing pad, said carrier element having a ring-shaped flange downwardly depending from its bottom surface carrying cutting means for truing and dressing the polishing pad by contact therewith.
Claim 8
Independent Claim 84 words
A device for simultaneously truing and dressing a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis, comprising a carrier element adapted for vertical substantially perpendicular movement into and out of engagement with the surface of a polishing pad and for oscillating radial movement over the surface of the polishing pad, said carrier element having a ring-shaped flange downwardly depending from its bottom surface carrying cutting means for truing and dressing the polishing pad by contact therewith.
Claim 9
Dependent Claim 30 words
A device in accordance with claim 6 having spaced cut-out portions along the periphery of the flange element to permit materials to escape from the interior of the carrier element.
Claim 10
Dependent Claim 14 words
A device in accordance with claim 6 wherein the cutting means comprises diamond particles.
Claim 11
Dependent Claim 27 words
A device in accordance with claim 8 in which the diamond cutting means have a particle size of not larger than about 80 mesh, U.S. Sieve Series.
Claim 12
Dependent Claim 19 words
A device in accordance with claim 6 wherein the cutting means comprise a circular blade having cutting teeth thereon.

References Cited (Backward Citations)

US4102084A Cited
US4663890A Cited
US4760668A Cited
US4720938A Cited
US5081051A Cited
US5216843A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-01-22 1999-07-24 2000-01-23 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-01-22 2003-07-24 2004-01-23 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-01-22 2007-07-24 2008-01-23 $7700.00 Window Closed / Lapsed

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