Coplanar waveguide-mounted flip chip

Claim 2

A coplanar waveguide-based circuit structure comprising: an electrically insulating substrate having a planar face with a connection region; a first coplanar waveguide mounted on said substrate face and having first and second, spaced-apart coplanar ground conductors, and a first signal conductor coplanar with said ground conductors and positioned between and spaced from said first and second ground conductors, said signal conductor and at least one of said first and second ground conductors extending into said connection region, said first and second ground conductors being integrally joined in said connection region; and an integrated circuit flip mounted on said connection region of said substrate with a first terminal flip mounted to said at least one ground conductor and a second terminal flip mounted to said signal conductor, said first coplanar waveguide conducting electrical current relative to said integrated circuit.

Claim 3

A circuit structure according to claim 1 wherein said signal conductor includes a base portion and at least first and second spaced-apart branch portions, at least one of said branch portions extending into said connection region for connection with said second terminal of said integrated circuit.

Claim 4

A circuit structure according to claim 2 wherein said first and second branch portions are integrally joined to said base portion, and said waveguide further comprises a third ground conductor coplanar with and electrically connected to said first and second ground conductors and extending between said first and second spaced-apart branch portions.

Claim 5

A circuit structure according to claim 3 wherein said branch portions and third ground conductor are all elongate and have generally uniform widths.

Claim 6

A circuit structure according to claim 2 wherein said signal conductor further comprises third and fourth branch portions extending into said connection region from said base portion and said integrated circuit further has third and fourth terminals flip mounted, respectively, to said third and fourth branch portions.

Claim 7

A circuit structure according to claim 1 further comprising a plurality of said coplanar waveguides extending in parallel with a single ground conductor extending between adjacent signal conductors, and wherein said integrated circuit further comprises a terminal corresponding to and flip mounted to each of said conductors.

Claim 8

A circuit structure according to claim 6 wherein said ground conductors are elongate and have generally uniform widths along at least a portion of their lengths.

Claim 9

A circuit structure according to claim 6 wherein said signal conductors and said ground conductors extending between adjacent signal conductors are elongate and have generally uniform and equal widths along at least a portion of their lengths.

Claim 10

A circuit structure according to claim 1 wherein said ground and signal conductors are elongate and have generally uniform widths along at least a portion of their lengths.

Claim 11

A circuit structure according to claim 1 further comprising capacitance means coupling adjacent sections of said signal conductor and at least one of said ground conductors.

Claim 12

A circuit structure according to claim 10 wherein said at least one ground conductor has a first section having a generally uniform spacing from said signal conductor, and said capacitance means comprises a second section of said at least one ground conductor having a reduced spacing from said signal conductor that is less than the generally uniform spacing.

Claim 13

A circuit structure according to claim 10 wherein said capacitance means comprises a second integrated circuit having at least one open-ended waveguide flip mounted to said signal conductor and to said at least one ground conductor.

Claim 14

A circuit structure according to claim 1 further comprising a second coplanar waveguide mounted on said substrate face spaced from and coplanar with said first coplanar waveguide, said second waveguide having third and fourth, spaced-apart coplanar ground conductors, and a second signal conductor coplanar with, positioned between, and spaced from said third and fourth ground conductors, said third and fourth ground conductors and said second signal conductor extending into said connection region for conducting electrical current relative to said integrated circuit, said first, second, third and fourth ground conductors being integrally joined in said connection region between said first and second signal conductors.

Claim 15

A coplanar waveguide-based circuit structure comprising: an electrically insulating substrate having a planar face with a connection region; a first coplanar waveguide mounted on said substrate face and having first and second, spaced-apart coplanar ground conductors, and a first signal conductor coplanar with said ground conductors and positioned between and spaced from said first and second ground conductors, said signal conductor including a base portion and at least first and second spaced-apart branch portions, at least one of said branch portions extending into said connection region from said base portion, at least one of said first and second ground conductors extending into said connection region; a second coplanar waveguide mounted on said substrate face spaced from and coplanar with said first coplanar waveguide, said second waveguide having third and fourth, spaced-apart coplanar ground conductors, and a second signal conductor coplanar with, positioned between, and spaced from said third and fourth ground conductors, said third and fourth ground conductors and said second signal conductor extending into said connection region for conducting electrical current relative to said component, whereby said first, second, third and fourth ground conductors are integrally joined in said connection region between said branch portions and said second signal conductor; and an integrated circuit comprising first and second transistors flip mounted to said first, second, third and fourth ground conductors, to said first and second branch portions of said first signal conductor, and to said second signal conductor for receiving a signal input on said first signal conductor and for outputting a signal amplified by said transistors on said second signal conductor.

Claim 16

A coplanar waveguide-based circuit structure comprising: an electrically insulating substrate having a planar face with a connection region; a first coplanar waveguide mounted on said substrate face and having first and second, spaced-apart coplanar ground conductors, and a first signal conductor coplanar with said ground conductors and positioned between and spaced from said first and second ground conductors, said signal conductor including a base portion and at least first and second spaced-apart branch portions, at least one of said branch portions extending into said connection region from said base portion, at least one of said first and second ground conductors extending into said connection region; a second coplanar waveguide mounted on said substrate face spaced from and coplanar with said first coplanar waveguide, said second waveguide having third and fourth, spaced-apart coplanar ground conductors, and a second signal conductor coplanar with, positioned between, and spaced from said third and fourth ground conductors, said third and fourth ground conductors and said second signal conductor extending into said connection region for conducting electrical current relative to said component, whereby said first, second, third and fourth ground conductors are integrally joined in said connection region between said branch portions and said second signal conductor; and an integrated circuit comprising first and second transistors flip mounted to said first, second, third and fourth ground conductors, to said first and second branch portions of said first signal conductor, and to said second signal conductor for receiving a signal input on said first signal conductor and for outputting a signal amplified by said transistors on said second signal conductor.

Claim 17

A circuit structure according to claim 14 further comprising at least a first capacitance means coupling said first and second branch portions to at least one adjacent ground conductor wherein said first and second branch portions form transmission lines having lengths that are appropriate, in combination with said at least a first capacitance means, for matching the input impedance of said waveguide to the input impedances of said first and second transistors.

Claim 18

A circuit structure according to claim 15 wherein there is a junction where said base portion is joined to said first and second branch portions, said first coplanar waveguide further comprising a third ground conductor coplanar with the electrically connected to said first and second ground conductors and extending between said first and second branch portions, said third ground conductor having an end adjacent to said junction, and said at least a first capacitance means is flip mounted to said end of said third ground conductor and to said junction.

Claim 19

A radio frequency circuit structure comprising: an electrically insulating substrate having a planar face with a connection region; a planar ground conductor mounted on said substrate planar face and extending across said connection region; an input signal conductor mounted on said substrate planar face and having an input end and a plurality of output ends extending electrically in parallel into said connection region, said input signal conductor and ground conductor comprising, in combination, a first coplanar waveguide; an output signal conductor also mounted on said substrate planar face electrically spaced from said input signal conductor, having an input end in said connection region and an output end spaced from said connection region, said output signal conductor and said ground conductor comprising, in combination, a second coplanar waveguide; and an integrated circuit chip flip mounted on said substrate and having a transistor associated with each input signal conductor output end, an input terminal for each transistor being connected to a corresponding one of said input signal conductor output ends and at least one output terminal connected to said input end of said output signal conductor for outputting the amplified signals from said transistors.

Claim 20

A radio frequency circuit structure comprising: an electrically insulating substrate having a planar face with a connection region; a planar ground conductor mounted on said substrate planar face and extending across said connection region; an input signal conductor mounted on said substrate planar face and having an input end and a plurality of output ends extending electrically in parallel into said connection region, said input signal conductor and ground conductor comprising, in combination, a first coplanar waveguide; an output signal conductor also mounted on said substrate planar face electrically spaced from said input signal conductor, having an input end in said connection region and an output end spaced from said connection region, said output signal conductor and said ground conductor comprising, in combination, a second coplanar waveguide; and an integrated circuit chip flip mounted on said substrate and having a transistor associated with each input signal conductor output end, an input terminal for each transistor being connected to a corresponding one of said input signal conductor output ends and at least one output terminal connected to said input end of said output signal conductor for outputting the amplified signals from said transistors.

Claim 21

A circuit structure according to claim 17 further comprising one of said output signal conductors for each of said transistors, wherein each transistor has an output terminal connected to the associated one of said output signal conductors.

Claim 22

A high-frequency power amplifier comprising: an electrically insulating substrate having a planar face with a connection region; an integrated circuit chip flip mounted on said substrate connection region, having a plurality of transistors, and having a set of at least one control terminal connected to said transistors and a set of at least one output current terminal connected to said transistors, at least one of said sets having a plurality of associated terminals; an impedance-matching network mounted on said substrate and associated with said one set of terminals and comprising a network coplanar waveguide having an elongate waveguide signal conductor for each terminal in said one set with a distal end spaced from said connection region and a proximal end in said connection region and flip mounted to a respective one of said terminals in said one set, and a ground conductor on each side of said waveguide signal conductor, said network further comprising a capacitor coupling each of said waveguide signal conductor distal ends to an adjacent ground conductor, the length of said waveguide signal conductors and said capacitors providing a selected impedance at a selected frequency; and at least one separate signal conductor, separate from said waveguide signal conductors, mounted on said substrate and flip mounted to the other of said sets of terminals.

Claim 23

A high-frequency power amplifier comprising: an electrically insulating substrate having a planar face with a connection region; an integrated circuit chip flip mounted on said substrate connection region, having a plurality of transistors, and having a set of at least one control terminal connected to said transistors and a set of at least one output current terminal connected to said transistors, at least one of said sets having a plurality of associated terminals; an impedance-matching network mounted on said substrate and associated with said one set of terminals and comprising a network coplanar waveguide having an elongate waveguide signal conductor for each terminal in said one set with a distal end spaced from said connection region and a proximal end in said connection region and flip mounted to a respective one of said terminals in said one set, and a ground conductor on each side of said waveguide signal conductor, said network further comprising a capacitor coupling each of said waveguide signal conductor distal ends to an adjacent ground conductor, the length of said waveguide signal conductors and said capacitors providing a selected impedance at a selected frequency; and at least one separate signal conductor, separate from said waveguide signal conductors, mounted on said substrate and flip mounted to the other of said sets of terminals.

Claim 24

An amplifier according to claim 19 wherein all of said distal ends of said waveguide signal conductors are connected to a single base signal conductor.

Claim 25

An amplifier according to claim 19 wherein said capacitors are on a separate chip flip mounted to said waveguide signal and ground conductors.

Claim 26

An amplifier according to claim 21 wherein said capacitors comprise at least one coplanar waveguide with an open-ended signal conductor.

Claim 27

An amplifier according to claim 19 wherein said separate signal conductor is part of an associated coplanar waveguide having associated ground conductors connected to said ground conductors of said network coplanar waveguide.

Claim 28

A coplanar waveguide-based circuit structure comprising: an electrically insulating substrate having a planar face with a connection region; a first coplanar waveguide mounted on said substrate face and having first and second, spaced apart coplanar ground conductors, and a first signal conductor coplanar with said ground conductors and positioned therebetween wherein said first signal conductor is spaced a first distance from said first and second ground conductors proximate said connection region; and an integrated circuit flip mounted on said connection region of said substrate with a first terminal flip mounted to said first ground conductor and a second terminal flip mounted to said signal conductor so that said first coplanar waveguide conducts current relative to said integrated circuit, said signal conductor and said first ground conductor being spaced apart a second distance different from said first distance distal said connection region so as to provide impedance match to said integrated circuit.

Claim 29

A coplanar waveguide-based circuit structure comprising: an electrically insulating substrate having a planar face with a connection region; a first coplanar waveguide mounted on said substrate face and having first and second, spaced apart coplanar ground conductors, and a first signal conductor coplanar with said ground conductors and positioned therebetween wherein said first signal conductor is spaced a first distance from said first and second ground conductors proximate said connection region; and an integrated circuit flip mounted on said connection region of said substrate with a first terminal flip mounted to said first ground conductor and a second terminal flip mounted to said signal conductor so that said first coplanar waveguide conducts current relative to said integrated circuit, said signal conductor and said first ground conductor being spaced apart a second distance different from said first distance distal said connection region so as to provide impedance match to said integrated circuit.