US5557142A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Shielded semiconductor device package
Assignee: NXP USA Inc
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Filing: 1991-02-04
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Granted: 1996-09-17
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Expires: 2011-02-04
Abstract
Abstract A shielded semiconductor package and a method for manufacturing the package is provided. The shielded semiconductor package comprises a metal coating (19) applied over an encapsulated semiconductor device (16). The device may be transfer molded or encapsulated by glob top technology. The metal coating (19) serves as a barrier to the transmission of electromagnetic or radio frequency energy, thereby shielding the semiconductor device (16). The shielded semiconductor package is manufactured by providing a metallization pattern (12 and 14) on a substrate (10) and mechanically attaching and electrically interconnecting a semiconductor device (16) to the metallization pattern. A resin (18) is transfer molded about the semiconductor device, the electrical interconnections (17), and the metallization pattern so as to form an assembly, and a metal coating (19) is applied via vacuum deposition or plating to interconnect with a portion of the metallization pattern.
Inventors
- 👤 Peter B. Gilmore
- 👤 Kenneth R. Thompson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 11:13
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/20; H10W42/261; H10W42/276; H10W72/00; H10W72/071; H10W72/073; H10W72/07351; H10W72/07352; H10W72/30; H10W72/321; H10W72/50; H10W72/541; H10W72/5445; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
68 words
A shielded semiconductor device package, comprising: a semiconductor device; a substrate having the semiconductor device mechanically attached and electrically interconnected thereto; an encapsulant material encapsulating the semiconductor device; and a shield consisting of: a thin coating of metal deposited directly on the encapsulant material and portions of the substrate, the metal coating precisely conformed to the encapsulant material and the substrate and electrically coupled to the semiconductor device.
Claim 2
Dependent Claim
68 words
A shielded semiconductor device package, comprising: a semiconductor device; a substrate having the semiconductor device mechanically attached and electrically interconnected thereto; an encapsulant material encapsulating the semiconductor device; and a shield consisting of: a thin coating of metal deposited directly on the encapsulant material and portions of the substrate, the metal coating precisely conformed to the encapsulant material and the substrate and electrically coupled to the semiconductor device.
Claim 3
Dependent Claim
19 words
The shielded semiconductor device package according to claim 1, wherein the thin metal coating comprises a sputtered metal coating.
Claim 4
Dependent Claim
24 words
The shielded semiconductor device package according to claim 2, further comprising a second metal coating deposited directly on the vacuum-deposited coating by electroless plating.
Claim 5
Dependent Claim
23 words
The shielded semiconductor device package according to claim 1, further comprising a second metal coating deposited directly on the vacuum-deposited coating by electroplating.
Claim 6
Dependent Claim
128 words
A shielded semiconductor device package including a radio frequency shield for at least one semiconductor device, comprising: a substrate having upper and lower faces, the upper face having a metallization pattern; a semiconductor device mechanically attached to the upper face and electrically interconnected to the metallization pattern; a non-conductive material encapsulating the semiconductor device, the electrical interconnections, and portions of the upper face of the substrate; and a shield consisting of: a thin coating of metal deposited in a selected pattern directly on the non-conductive material and portions of the substrate, the metal coating precisely conformed to the non-conductive material and the substrate and electrically coupled to the semiconductor device in order to substantially reduce the ingress or egress of radio frequency signals through the semiconductor device package.
Claim 7
Dependent Claim
128 words
A shielded semiconductor device package including a radio frequency shield for at least one semiconductor device, comprising: a substrate having upper and lower faces, the upper face having a metallization pattern; a semiconductor device mechanically attached to the upper face and electrically interconnected to the metallization pattern; a non-conductive material encapsulating the semiconductor device, the electrical interconnections, and portions of the upper face of the substrate; and a shield consisting of: a thin coating of metal deposited in a selected pattern directly on the non-conductive material and portions of the substrate, the metal coating precisely conformed to the non-conductive material and the substrate and electrically coupled to the semiconductor device in order to substantially reduce the ingress or egress of radio frequency signals through the semiconductor device package.
Claim 8
Dependent Claim
17 words
The shielded monolithic semiconductor device package according to claim 5, wherein the non-conductive material is transfer molded.
Claim 9
Dependent Claim
19 words
The shielded semiconductor device package according to claim 6, wherein the thin metal coating comprises a sputtered metal coating.
Claim 10
Dependent Claim
51 words
The shielded semiconductor device package according to claim 5, further comprising an array of surface mount solder pads on the lower face of the substrate, the solder pads electrically connected to the metallization pattern by vias through the substrate, at least some of the vias located away from the solder pads.
Claim 11
Dependent Claim
17 words
The shielded semiconductor device package according to claim 8, further comprising solder bumps on the solder pads.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-09-17 | 2000-03-18 | 2000-09-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-09-17 | 2004-03-18 | 2004-09-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-09-17 | 2008-03-18 | 2008-09-17 | $7700.00 | Window Closed / Lapsed |