Claims Analysis
Total Claims: 34
Claim 1
Independent Claim
59 words
A method of fabricating an anode plate for use in a field emission display device, said method comprising the steps of: providing a substantially transparent substrate having spaced-apart, electrically conductive regions on a surface thereof; etching a plurality of grooves in said surface in the spaces between said electrically conductive regions; and applying luminescent material on said conductive regions.
Claim 2
Independent Claim
59 words
A method of fabricating an anode plate for use in a field emission display device, said method comprising the steps of: providing a substantially transparent substrate having spaced-apart, electrically conductive regions on a surface thereof; etching a plurality of grooves in said surface in the spaces between said electrically conductive regions; and applying luminescent material on said conductive regions.
Claim 3
Dependent Claim
36 words
The method in accordance with claim 1 wherein said step of etching grooves in said surface in the spaces between said electrically conductive regions comprises selectively etching said surface to a depth up to 10 μmeters.
Claim 4
Dependent Claim
38 words
The method in accordance with claim 1 wherein said step of etching grooves in said surface in the spaces between said electrically conductive regions comprises dry etching said surface using carbon tetrafluoride (CF 4 ) as an etchant.
Claim 5
Dependent Claim
36 words
The method in accordance with claim 1 wherein said step of etching grooves in said surface in the spaces between said electrically conductive regions comprises wet etching said surface using buffered hydrofluoric acid as an etchant.
Claim 6
Dependent Claim
21 words
The method in accordance with claim 1 wherein said step of applying luminescent material on said conductive regions comprises electrophoretic deposition.
Claim 7
Dependent Claim
38 words
The method in accordance with claim 1 further including the step of: applying an electrically insulating material in said spaces between said electrically conductive regions; and etching a plurality of grooves in a surface of said insulating material.
Claim 8
Dependent Claim
38 words
The method in accordance with claim 6 wherein said step of etching grooves in said insulator surface in the spaces between said electrically conductive regions comprises selectively etching said insulator surface to a depth up to 10 μmeters.
Claim 9
Dependent Claim
40 words
The method in accordance with claim 6 wherein said step of etching grooves in said insulator surface in the spaces between said electrically conductive regions comprises dry etching said insulator surface using carbon tetrafluoride (CF 4 ) as an etchant.
Claim 10
Dependent Claim
38 words
The method in accordance with claim 6 wherein said step of etching grooves in said insulator surface in the spaces between said electrically conductive regions comprises wet etching said insulator surface using buffered hydrofluoric acid as an etchant.
Claim 11
Independent Claim
67 words
A method of fabricating an anode plate for use in a field emission device, said method comprising the steps of: providing a substantially transparent substrate having spaced-apart, electrically conductive regions on a surface thereof; applying luminescent material on said conductive regions applying an electrically insulating material in said spaces between said electrically conductive regions; and etching a plurality of grooves in a surface of said insulating material.
Claim 12
Independent Claim
67 words
A method of fabricating an anode plate for use in a field emission device, said method comprising the steps of: providing a substantially transparent substrate having spaced-apart, electrically conductive regions on a surface thereof; applying luminescent material on said conductive regions applying an electrically insulating material in said spaces between said electrically conductive regions; and etching a plurality of grooves in a surface of said insulating material.
Claim 13
Dependent Claim
38 words
The method in accordance with claim 10 wherein said step of etching grooves in said insulator surface in the spaces between said electrically conductive regions comprises 'selectively etching said insulator surface to a depth up to 10 μmeters.
Claim 14
Dependent Claim
40 words
The method in accordance with claim 10 wherein said step of etching grooves in said insulator surface in the spaces between said electrically conductive regions comprises dry etching said insulator surface using carbon tetrafluoride (CF 4 ) as an etchant.
Claim 15
Dependent Claim
38 words
The method in accordance with claim 10 wherein said step of etching grooves in said insulator surface in the spaces between said electrically conductive regions comprises wet etching said insulator surface using buffered hydrofluoric acid as an etchant.
Claim 16
Dependent Claim
21 words
The method in accordance with claim 10 wherein said step of applying luminescent material on said conductive regions comprises electrophoretic deposition.
Claim 17
Independent Claim
101 words
A method of fabricating an anode plate for use in a field emission display device, said method comprising the steps of: providing a substantially transparent substrate; depositing a layer of a transparent, electrically conductive material on a surface of said substrate; removing portions of said layer of conductive material to leave substantially parallel stripes of said conductive material; applying luminescent material on said conductive regions; coating said surface with a solution of an electrically insulating material; removing said insulating material from areas overlaying said conductive regions; and etching exposed regions of said insulator material to form a plurality of grooves therein.
Claim 18
Independent Claim
101 words
A method of fabricating an anode plate for use in a field emission display device, said method comprising the steps of: providing a substantially transparent substrate; depositing a layer of a transparent, electrically conductive material on a surface of said substrate; removing portions of said layer of conductive material to leave substantially parallel stripes of said conductive material; applying luminescent material on said conductive regions; coating said surface with a solution of an electrically insulating material; removing said insulating material from areas overlaying said conductive regions; and etching exposed regions of said insulator material to form a plurality of grooves therein.
Claim 19
Dependent Claim
30 words
The method in accordance with claim 15 wherein said step of etching said exposed region of said insulator includes selectively etching said substrate to a depth up to 10 μmeters.
Claim 20
Dependent Claim
32 words
The method in accordance with claim 15 wherein said step of etching said exposed region of said insulator comprises dry etching said surface using carbon tetrafluoride (CF 4 ) as an etchant.
Claim 21
Dependent Claim
30 words
The method in accordance with claim 15 wherein said step of etching said exposed region of said insulator comprises wet etching said surface using buffered hydrofluoric acid as an etchant.
Claim 22
Dependent Claim
21 words
The method in accordance with claim 15 wherein said step of applying luminescent material on said conductive regions comprises electrophoretic deposition.
Claim 23
Dependent Claim
88 words
The method in accordance with claim 15 wherein said step of removing portions of said layer of conductive material comprises the sub-steps of: coating said surface with a layer of photoresist; masking said photoresist layer to expose regions corresponding to said substantially parallel stripes; developing said exposed regions of said photoresist layer; removing the developed regions of said photoresist layer to expose regions of said layer of conductive material; removing said exposed regions of said layer of conductive material; and removing the remaining regions of said photoresist layer.
Claim 24
Dependent Claim
36 words
The method in accordance with claim 20 wherein said step of removing said exposed regions of said layer of conductive material comprises wet etching said conductive material with a solution of hydrochloric acid and ferric chloride.
Claim 25
Dependent Claim
173 words
The method in accordance with claim 15 wherein said step of removing said cured insulator material from areas overlaying said conductive regions comprises the sub-steps of: coating said insulator material with a first layer of photoresist; masking said first photoresist layer to expose regions corresponding to selected regions of spaces between said substantially parallel stripes and said substantially parallel stripes; developing said exposed regions of said first photoresist layer; removing the developed regions of said first photoresist layer to expose regions of said layer of cured insulator material; removing said exposed regions of said layer of cured material; and coating said insulator material with a second layer of photoresist; masking said second photoresist layer to expose regions corresponding to said substantially parallel stripes; developing said exposed regions of said second photoresist layer; removing the developed regions of said second photoresist layer to expose regions of said layer of cured insulator material; removing said exposed regions of said layer of cured material; and removing the remaining regions of said first and second photoresist layers.
Claim 26
Dependent Claim
35 words
The method in accordance with claim 22 wherein said step of removing said exposed regions of said layer of cured insulator material comprises wet etching said conductive material with a solution of buffered hydrofluoric acid.
Claim 27
Independent Claim
79 words
A method of fabricating an anode plate for use in a field emission display device, said method comprising the steps of: providing a substantially transparent substrate; depositing a layer of a transparent, electrically conductive material on a surface of said substrate; removing portions of said layer of conductive material to leave substantially parallel stripes of said conductive material; etching exposed regions of said substrate to form a plurality of grooves therein; and applying luminescent material on said conductive regions.
Claim 28
Independent Claim
79 words
A method of fabricating an anode plate for use in a field emission display device, said method comprising the steps of: providing a substantially transparent substrate; depositing a layer of a transparent, electrically conductive material on a surface of said substrate; removing portions of said layer of conductive material to leave substantially parallel stripes of said conductive material; etching exposed regions of said substrate to form a plurality of grooves therein; and applying luminescent material on said conductive regions.
Claim 29
Dependent Claim
80 words
The method in accordance with claim 24 wherein said step of removing portions of said layer of conductive material comprises the sub-steps of: coating said surface with a layer of photoresist; masking said photoresist layer to expose regions corresponding to said substantially parallel stripes; developing said exposed regions of said photoresist layer; removing the undeveloped regions of said photoresist layer to expose regions of said layer of conductive material; and removing said exposed regions of said layer of conductive material.
Claim 30
Dependent Claim
36 words
The method in accordance with claim 25 wherein said step of removing said exposed regions of said layer of conductive material comprises wet etching said conductive material with a solution of hydrochloric acid and ferric chloride.
Claim 31
Dependent Claim
30 words
The method in accordance with claim 24 wherein said step of etching said exposed region of said substrate comprises wet etching said surface using buffered hydrofluoric acid as an etchant.
Claim 32
Dependent Claim
21 words
The method in accordance with claim 24 wherein said step of applying luminescent material on said conductive regions comprises electrophoretic deposition.
Claim 33
Dependent Claim
30 words
The method in accordance with claim 24 wherein said step of etching said exposed region of said substrate includes selectively etching said substrate to a depth up to 10 μmeters.
Claim 34
Dependent Claim
32 words
The method in accordance with claim 24 wherein said step of etching said exposed region of said substrate comprises dry etching said surface using carbon tetrafluoride (CF 4 ) as an etchant.