US5744019A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for electroplating metal films including use a cathode ring insulator ring and thief ring
Assignee: Sony Group Corp
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Filing: 1997-01-31
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Granted: 1998-04-28
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Expires: 2017-01-31
Abstract
Abstract Multiple-layer thin film devices are deposited by electroplating on an otherwise substantially clean substrate wafer. The composition of the electroplated alloy layers is maintained substantially uniform using a cathode assembly on which the substrate wafer is mounted. The cathode assembly includes an inner cathode ring electrically connected to the wafer, a thief ring external to the cathode ring and an insulating ring connected between and electrically insulating the cathode and thief rings. The cathode ring and the thief ring are powered by separate power sources.
Inventors
- 👤 Jane Ang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 03:35
CPC Classifications
C; C25; C25D; C25D17/00; C25D17/10; C25D17/12; C25D17/001; C25D21/00; C25D21/12; C25D7/00; C25D7/12; C25D7/123; H; H10; H10W; H10W70/00; H10W70/01; H10W70/05
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
130 words
A method of electroplating a thin metal film onto a substrate wafer comprising the steps of: electroplating on a clean substrate wafer in an electroplating solution; maintaining an alloy composition uniformity of at least one electroplated layer substantially uniform using a cathode assembly for mounting the substrate wafer, the cathode assembly including: an inner cathode ring electrically connected to the wafer; a thief ring external to the cathode ring; and an insulating ring connected between and electrically insulating the cathode and thief rings; and powering the cathode ring and the thief ring using separate first and second power sources having respective first and second negative terminals respectively coupled to the cathode ring and the thief ring the first and second power sources having a positive terminal coupled to an anode.
Claim 2
Independent Claim
130 words
A method of electroplating a thin metal film onto a substrate wafer comprising the steps of: electroplating on a clean substrate wafer in an electroplating solution; maintaining an alloy composition uniformity of at least one electroplated layer substantially uniform using a cathode assembly for mounting the substrate wafer, the cathode assembly including: an inner cathode ring electrically connected to the wafer; a thief ring external to the cathode ring; and an insulating ring connected between and electrically insulating the cathode and thief rings; and powering the cathode ring and the thief ring using separate first and second power sources having respective first and second negative terminals respectively coupled to the cathode ring and the thief ring the first and second power sources having a positive terminal coupled to an anode.
Claim 3
Dependent Claim
39 words
A method according to claim 1 further comprising the steps of: supplying a constant current to the cathode ring; and adjusting a current supplied to the thief ring in order to achieve a desired alloy composition on the wafer.
Claim 4
Dependent Claim
21 words
The method according to claim 1 wherein the cathode ring, the thief ring, and the insulating ring have a noncircular shape.
Claim 5
Dependent Claim
32 words
A method according to claim 1 further comprising the step of: mounting the substrate wafer to rest in the cathode assembly, a surface of the substrate wafer being completely exposed for electroplating.
Claim 6
Dependent Claim
19 words
A method according to claim 1 further comprising the step of: supporting the cathode assembly with an insulative block.
Claim 7
Dependent Claim
14 words
A method according to claim 5 wherein the insulative block is a plexiglass block.
Claim 8
Dependent Claim
31 words
A method according to claim 1 wherein the separate power sources include: a first negative terminal of a dual-channel power supply; and a second negative terminal of the dual-channel power supply.
Claim 9
Independent Claim
160 words
A method of electroplating a thin NiFe film onto a substrate wafer comprising the steps of: electroplating on a clean substrate wafer in an electroplating solution; maintaining a NiFe composition uniformity of at least one electroplated layer substantially uniform using a cathode assembly for mounting the substrate wafer, the cathode assembly including: an inner cathode ring electrically connected to the wafer; a thief ring external to the cathode ring; and an insulating ring connected between and electrically insulating the cathode and thief rings; powering the cathode ring and the thief ring using separate first and second power sources having respective first and second negative terminals respectively coupled to the cathode ring and the thief ring, the first and second power sources having a positive terminal coupled to anode; supplying a constant current to the cathode ring; and adjusting a current supplied to the thief ring in order to achieve a desired Fe composition on a particular portion of the wafer.
Claim 10
Independent Claim
160 words
A method of electroplating a thin NiFe film onto a substrate wafer comprising the steps of: electroplating on a clean substrate wafer in an electroplating solution; maintaining a NiFe composition uniformity of at least one electroplated layer substantially uniform using a cathode assembly for mounting the substrate wafer, the cathode assembly including: an inner cathode ring electrically connected to the wafer; a thief ring external to the cathode ring; and an insulating ring connected between and electrically insulating the cathode and thief rings; powering the cathode ring and the thief ring using separate first and second power sources having respective first and second negative terminals respectively coupled to the cathode ring and the thief ring, the first and second power sources having a positive terminal coupled to anode; supplying a constant current to the cathode ring; and adjusting a current supplied to the thief ring in order to achieve a desired Fe composition on a particular portion of the wafer.
Claim 11
Dependent Claim
20 words
The method according to claim 8 wherein the particular portion of the wafer is a peripheral edge of the wafer.
Claim 12
Dependent Claim
31 words
A method according to claim 8 wherein the separate power sources include: a first negative terminal of a dual-channel power supply; and a second negative terminal of the dual-channel power supply.
Claim 13
Dependent Claim
32 words
A method according to claim 8, further comprising the step of: mounting the substrate wafer to rest in the cathode assembly, a surface of the substrate wafer being completely exposed for electroplating.
Claim 14
Independent Claim
131 words
A method of electroplating a thin metal film onto a substrate wafer comprising the steps of: electroplating on a clean substrate wafer in an electroplating solution; maintaining an alloy composition uniformity of at least one electroplated layer substantially uniform using a cathode assembly for mounting the substrate wafer, the cathode assembly including: an inner cathode structure electrically connected to the wafer; a thief structure external to the cathode structure; and an insulating structure connected between and electrically insulating the cathode and thief structures; and powering the cathode structure and the thief structure using separate first and second and power sources having respective first and second negative terminals respectively coupled to the cathode ring and the thief ring, the first and second power sources having a positive terminal coupled to an anode.
Claim 15
Independent Claim
131 words
A method of electroplating a thin metal film onto a substrate wafer comprising the steps of: electroplating on a clean substrate wafer in an electroplating solution; maintaining an alloy composition uniformity of at least one electroplated layer substantially uniform using a cathode assembly for mounting the substrate wafer, the cathode assembly including: an inner cathode structure electrically connected to the wafer; a thief structure external to the cathode structure; and an insulating structure connected between and electrically insulating the cathode and thief structures; and powering the cathode structure and the thief structure using separate first and second and power sources having respective first and second negative terminals respectively coupled to the cathode ring and the thief ring, the first and second power sources having a positive terminal coupled to an anode.
Claim 16
Dependent Claim
24 words
A method according to claim 12 wherein at least one of the inner cathode, thief, and insulating structures is a closed path circular structure.
Claim 17
Dependent Claim
24 words
A method according to claim 12 wherein at least one of the inner cathode, thief, and insulating structures is a closed path noncircular structure.
Claim 18
Dependent Claim
24 words
A method according to claim 12 wherein at least one of the inner cathode, thief, and insulating structures is an open path circular structure.
Claim 19
Dependent Claim
24 words
A method according to claim 12 wherein at least one of the inner cathode, thief, and insulating structures is an open path noncircular structure.
Claim 20
Dependent Claim
31 words
A method according to claim 12 wherein the separate power sources include: a first negative terminal of a dual-channel power supply; and a second negative terminal of the dual-channel power supply.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-04-27 | 2001-10-27 | 2002-04-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-04-27 | 2005-10-27 | 2006-04-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-04-27 | 2009-10-27 | 2010-04-28 | $7700.00 | Window Closed / Lapsed |