Method for electroplating metal films including use a cathode ring insulator ring and thief ring

Claim 1

A method of electroplating a thin metal film onto a substrate wafer comprising the steps of: electroplating on a clean substrate wafer in an electroplating solution; maintaining an alloy composition uniformity of at least one electroplated layer substantially uniform using a cathode assembly for mounting the substrate wafer, the cathode assembly including: an inner cathode ring electrically connected to the wafer; a thief ring external to the cathode ring; and an insulating ring connected between and electrically insulating the cathode and thief rings; and powering the cathode ring and the thief ring using separate first and second power sources having respective first and second negative terminals respectively coupled to the cathode ring and the thief ring the first and second power sources having a positive terminal coupled to an anode.

Claim 2

A method of electroplating a thin metal film onto a substrate wafer comprising the steps of: electroplating on a clean substrate wafer in an electroplating solution; maintaining an alloy composition uniformity of at least one electroplated layer substantially uniform using a cathode assembly for mounting the substrate wafer, the cathode assembly including: an inner cathode ring electrically connected to the wafer; a thief ring external to the cathode ring; and an insulating ring connected between and electrically insulating the cathode and thief rings; and powering the cathode ring and the thief ring using separate first and second power sources having respective first and second negative terminals respectively coupled to the cathode ring and the thief ring the first and second power sources having a positive terminal coupled to an anode.

Claim 9

A method of electroplating a thin NiFe film onto a substrate wafer comprising the steps of: electroplating on a clean substrate wafer in an electroplating solution; maintaining a NiFe composition uniformity of at least one electroplated layer substantially uniform using a cathode assembly for mounting the substrate wafer, the cathode assembly including: an inner cathode ring electrically connected to the wafer; a thief ring external to the cathode ring; and an insulating ring connected between and electrically insulating the cathode and thief rings; powering the cathode ring and the thief ring using separate first and second power sources having respective first and second negative terminals respectively coupled to the cathode ring and the thief ring, the first and second power sources having a positive terminal coupled to anode; supplying a constant current to the cathode ring; and adjusting a current supplied to the thief ring in order to achieve a desired Fe composition on a particular portion of the wafer.

Claim 10

A method of electroplating a thin NiFe film onto a substrate wafer comprising the steps of: electroplating on a clean substrate wafer in an electroplating solution; maintaining a NiFe composition uniformity of at least one electroplated layer substantially uniform using a cathode assembly for mounting the substrate wafer, the cathode assembly including: an inner cathode ring electrically connected to the wafer; a thief ring external to the cathode ring; and an insulating ring connected between and electrically insulating the cathode and thief rings; powering the cathode ring and the thief ring using separate first and second power sources having respective first and second negative terminals respectively coupled to the cathode ring and the thief ring, the first and second power sources having a positive terminal coupled to anode; supplying a constant current to the cathode ring; and adjusting a current supplied to the thief ring in order to achieve a desired Fe composition on a particular portion of the wafer.

Claim 14

A method of electroplating a thin metal film onto a substrate wafer comprising the steps of: electroplating on a clean substrate wafer in an electroplating solution; maintaining an alloy composition uniformity of at least one electroplated layer substantially uniform using a cathode assembly for mounting the substrate wafer, the cathode assembly including: an inner cathode structure electrically connected to the wafer; a thief structure external to the cathode structure; and an insulating structure connected between and electrically insulating the cathode and thief structures; and powering the cathode structure and the thief structure using separate first and second and power sources having respective first and second negative terminals respectively coupled to the cathode ring and the thief ring, the first and second power sources having a positive terminal coupled to an anode.

Claim 15

A method of electroplating a thin metal film onto a substrate wafer comprising the steps of: electroplating on a clean substrate wafer in an electroplating solution; maintaining an alloy composition uniformity of at least one electroplated layer substantially uniform using a cathode assembly for mounting the substrate wafer, the cathode assembly including: an inner cathode structure electrically connected to the wafer; a thief structure external to the cathode structure; and an insulating structure connected between and electrically insulating the cathode and thief structures; and powering the cathode structure and the thief structure using separate first and second and power sources having respective first and second negative terminals respectively coupled to the cathode ring and the thief ring, the first and second power sources having a positive terminal coupled to an anode.