US5767014A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit and process for its manufacture
Assignee: GlobalFoundries Inc
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Filing: 1996-10-28
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Granted: 1998-06-16
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Expires: 2016-10-28
Abstract
Abstract The invention relates to an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises the reaction product of a hyperbranched polymer and organic polysilica.
Inventors
- 👤 Craig Jon Hawker
- 👤 James Lupton Hedrick
- 👤 Robert Dennis Miller
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 00:06
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/66; H10P14/668; H10P14/6681; H10P14/6684; H10P14/6686; H10P14/69; H10P14/692; H10P14/6921; H10P14/6922; H10P14/40; H10P14/6925; H10P14/6926; H10P32/00; H10P32/10; H10P32/14; H10P32/1408; H10P32/1414; H10P50/00; H10P50/20; H10P50/26; H10P50/264; H10P76/00; H10P76/20; H10P76/204; H10P76/2041; H10P95/00; H10P95/90; H10W; H10W20/00; H10W20/40; H10W20/45; H10W20/48; H10W20/495; H10P14/63; H10P14/6326; H10P14/6342
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
61 words
A process for forming an integrated circuit comprising: (a) positioning on a substrate a layer of dielectric composition, the composition comprising reactants hyperbranched polymer and organic polysilica; (b) heating the composition to react the reactants; (c) lithographically patterning the dielectric layer; (d) depositing a metallic film onto the patterned dielectric layer; and (e) planarizing the film to form the integrated circuit.
Claim 2
Dependent Claim
61 words
A process for forming an integrated circuit comprising: (a) positioning on a substrate a layer of dielectric composition, the composition comprising reactants hyperbranched polymer and organic polysilica; (b) heating the composition to react the reactants; (c) lithographically patterning the dielectric layer; (d) depositing a metallic film onto the patterned dielectric layer; and (e) planarizing the film to form the integrated circuit.
Claim 3
Dependent Claim
21 words
The process of claim 1 wherein the hyperbranched polymer is poly(ether quinoline), poly (aryl ether phenylquinoxaline), poly(aryl ester) or poly(ether ketone).
Claim 4
Dependent Claim
11 words
The process of claim 2 wherein the organic polysilica is silsesquioxane.
Claim 5
Dependent Claim
13 words
The process of claim 3 wherein the silsesquioxane is phenyl/C 1-6 alkyl silsesquioxane.
Claim 6
Dependent Claim
51 words
A process for forming an integrated circuit comprising: (a) depositing a metallic film on a substrate; (b) lithographically patterning the metallic film; (c) depositing on the patterned metallic film, a layer of a dielectric composition comprising reactants hyperbranched polymers and organic polysilica; and (d) heating the composition to react the reactants.
Claim 7
Dependent Claim
51 words
A process for forming an integrated circuit comprising: (a) depositing a metallic film on a substrate; (b) lithographically patterning the metallic film; (c) depositing on the patterned metallic film, a layer of a dielectric composition comprising reactants hyperbranched polymers and organic polysilica; and (d) heating the composition to react the reactants.
Claim 8
Dependent Claim
20 words
The process of claim 5 wherein the hyperbranched polymer is poly(ether quinoline), poly(aryl ether phenylquinoxaline), poly(aryl ester) or poly(ether ketone).
Claim 9
Dependent Claim
11 words
The process of claim 6 wherein the organic polysilica is silsesquioxane.
Claim 10
Dependent Claim
13 words
The process of claim 7 wherein the silsesquioxane is phenyl/C 1-6 alkyl silsesquioxane.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-06-15 | 2001-12-15 | 2002-06-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-06-15 | 2005-12-15 | 2006-06-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-06-15 | 2009-12-15 | 2010-06-16 | $7700.00 | Window Closed / Lapsed |