US5821031A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Photosensitive solder resist ink, printed circuit board and production thereof
Assignee: Goo Chemical Industries Co Ltd
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Filing: 1995-10-02
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Granted: 1998-10-13
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Expires: 2015-10-02
Abstract
Abstract Disclosed herein is a photosensitive solder resist ink capable of development with a dilute alkaline solution. It has a wide pre-curing latitude. It permits the pre-cured board to be stored for a long period of time. It is superior in resolution, sensitivity, and solder resistance. Disclosed also herein is a printed circuit board having good adhesion, chemical resistance, electrical properties, gold plating resistance, solder heat resistance, and electrocorrosion resistance. Disclosed also herein is a process for producing said printed circuit board by using said solder resist ink. The photosensitive solder resist ink comprises (A) an ultraviolet-curable resin containing 0-20 wt % of aromatic ring moiety which is obtained by reacting a polymer composed of (a) 40-100 mol % of ethylenically unsaturated monomer having an epoxy group and (b) 0-60 mol % of ethylenically unsaturated monomer capable of copolymerization therewith, with (meth)acrylic acid in an amount of 0.7-1.2 equivalents per epoxy equivalent of said polymer and with a saturated or unsaturated polybasic acid anhydride; (B) an epoxy compound soluble in a diluent; (C) a photopolymerization initiator; and (D) a diluent.
Inventors
- 👤 Soichi Hashimoto
- 👤 Fumito Suzuki
- 👤 Toshikazu Oda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 02:55
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/027; G03F7/032; G03F7/033; G03F7/038; G03F7/0388; H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/285; H05K3/287
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
161 words
A photosensitive solder resist ink capable of development with a dilute alkaline solution which comprises: (A) an ultraviolet-curable resin having a weight-average molecular weight of 5,000 to 100,000 and an acid value in the range of 25 to 150 containing 0-20 wt % of an aromatic ring moiety selected from the group consisting of benzene ring, condensed benezene ring, nonobenzoid aromatic ring, and complex aromatic ring, wherein the wt % is based only on the ring moiety and does not include any substituents, wherein said resin is obtained by reacting a polymer composed of (a) 40-100 mol % of ethylenically unsaturated monomer having an epoxy group and (b) 0-60 mol % of ethylenically unsaturated monomer capable of copolymerization therewith, with (meth)acrylic acid in an amount of 0.7-1.2 equivalents per epoxy equivalent of said polymer and with a saturated or unsaturated polybasic acid anhydride; (B) an epoxy compound soluble in the following (D) diluent; (C) a photopolymerization initiator; and (D) a diluent.
Claim 2
Dependent Claim
161 words
A photosensitive solder resist ink capable of development with a dilute alkaline solution which comprises: (A) an ultraviolet-curable resin having a weight-average molecular weight of 5,000 to 100,000 and an acid value in the range of 25 to 150 containing 0-20 wt % of an aromatic ring moiety selected from the group consisting of benzene ring, condensed benezene ring, nonobenzoid aromatic ring, and complex aromatic ring, wherein the wt % is based only on the ring moiety and does not include any substituents, wherein said resin is obtained by reacting a polymer composed of (a) 40-100 mol % of ethylenically unsaturated monomer having an epoxy group and (b) 0-60 mol % of ethylenically unsaturated monomer capable of copolymerization therewith, with (meth)acrylic acid in an amount of 0.7-1.2 equivalents per epoxy equivalent of said polymer and with a saturated or unsaturated polybasic acid anhydride; (B) an epoxy compound soluble in the following (D) diluent; (C) a photopolymerization initiator; and (D) a diluent.
Claim 3
Dependent Claim
32 words
A photosensitive solder resist ink as defined in claim 1, wherein the ethylenically unsaturated monomer having an epoxy group as component (a) in the ultraviolet-curable resin as component (A) is glycidyl (meth)acrylate.
Claim 4
Dependent Claim
21 words
A printed circuit board on which a solder resist pattern is formed from the photosensitive resist ink defined in claim 2.
Claim 5
Dependent Claim
27 words
A process for treating a printed circuit board which comprises forming on the board a solder resist pattern from the photosensitive resist ink defined in claim 2.
Claim 6
Dependent Claim
121 words
A process for producing a printed circuit board as defined in claim 4, which includes the steps of: (1) applying the photosensitive solder resist ink to a board on which a printed wiring pattern has previously been formed, thereby forming a photosensitive solder resist ink layer on the board, (2) pre-curing the photosensitive solder resist ink layer thereby forming a dried coating film on the board, (3) selectively exposing the dried coating film to light through a patterned mask, (4) developing the exposed film with an alkaline solution, thereby selectively removing unexposed parts of the film and forming a pattern of cured film on the board, and (5) post-baking the patterned film on the board, thereby heat curing the patterned film.
Claim 7
Dependent Claim
26 words
A photosensitive solder resist ink as defined in claim 1, wherein the epoxy compound soluble in a diluent as component (B) is an aromatic epoxy resin.
Claim 8
Dependent Claim
21 words
A printed circuit board on which a solder resist pattern is formed from the photosensitive resist ink defined in claim 6.
Claim 9
Dependent Claim
27 words
A process for treating a printed circuit board which comprises forming on the board a solder resist pattern from the photosensitive resist ink defined in claim 6.
Claim 10
Dependent Claim
121 words
A process for producing a printed circuit board as defined in claim 8, which includes the steps of: (1) applying the photosensitive solder resist ink to a board on which a printed wiring pattern has previously been formed, thereby forming a photosensitive solder resist ink layer on the board, (2) pre-curing the photosensitive solder resist ink layer thereby forming a dried coating film on the board, (3) selectively exposing the dried coating film to light through a patterned mask, (4) developing the exposed film with an alkaline solution, thereby selectively removing unexposed parts of the film and forming a pattern of cured film on the board, and (5) post-baking the patterned film on the board, thereby heat curing the patterned film.
Claim 11
Dependent Claim
40 words
A photosensitive solder resist ink as defined in claim 1, wherein the epoxy compound soluble in a diluent as component (B) is at least one epoxy resin selected from the group consisting of bisphenol-A epoxy resin and novolak epoxy resin.
Claim 12
Dependent Claim
21 words
A printed circuit board on which a solder resist pattern is formed from the photosensitive resist ink defined in claim 10.
Claim 13
Dependent Claim
27 words
A process for treating a printed circuit board which comprises forming on the board a solder resist pattern from the photosensitive resist ink defined in claim 10.
Claim 14
Dependent Claim
121 words
A process for producing a printed circuit board as defined in claim 12, which includes the steps of: (1) applying the photosensitive solder resist ink to a board on which a printed wiring pattern has previously been formed, thereby forming a photosensitive solder resist ink layer on the board, (2) pre-curing the photosensitive solder resist ink layer thereby forming a dried coating film on the board, (3) selectively exposing the dried coating film to light through a patterned mask, (4) developing the exposed film with an alkaline solution, thereby selectively removing unexposed parts of the film and forming a pattern of cured film on the board, and (5) post-baking the patterned film on the board, thereby heat curing the patterned film.
Claim 15
Dependent Claim
21 words
A printed circuit board on which a solder resist pattern is formed from the photosensitive resist ink defined in claim 1.
Claim 16
Dependent Claim
27 words
A process for treating a printed circuit board which comprises forming on the board a solder resist pattern from the photosensitive resist ink defined in claim 1.
Claim 17
Dependent Claim
121 words
A process for producing a printed circuit board as defined in claim 15, which includes the steps of: (1) applying the photosensitive solder resist ink to a board on which a printed wiring pattern has previously been formed, thereby forming a photosensitive solder resist ink layer on the board, (2) pre-curing the photosensitive solder resist ink layer, thereby forming a dried coating film on the board, (3) selectively exposing the dried coating film to light through a patterned mask, (4) developing the exposed film with an alkaline solution, thereby selectively removing unexposed parts of the film and forming a pattern of cured film on the board, and (5) post-baking the patterned film on the board, thereby heat curing the patterned film.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-10-12 | 2002-04-13 | 2002-10-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-10-12 | 2006-04-13 | 2006-10-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-10-12 | 2010-04-13 | 2010-10-13 | $7700.00 | Window Closed / Lapsed |