US5883219A
Expired / Lapsed
US
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Integrated circuit device and process for its manufacture
Assignee: International Business Machines Corp
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Filing: 1997-05-29
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Granted: 1999-03-16
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Expires: 2017-05-29
Abstract
Abstract The invention relates to an integrated circuit device comprising (i) a substrate, (ii) metallic circuit lines positioned on the substrate, and (iii) a porous dielectric material positioned on the circuit lines. The dielectric material comprises the reaction product of an organic polysilica and polyamic ester preferably terminated with an alkoxysilyl alkyl group.
Inventors
- 👤 Kenneth Raymond Carter
- 👤 Daniel Joseph Dawson
- 👤 Richard Anthony DiPietro
- 👤 Craig Jon Hawker
- 👤 James Lupton Hedrick
- 👤 Robert Dennis Miller
- 👤 Do Yeung Yoon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 22:10
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/45; H10W20/48; C; C08; C08G; C08G73/00; C08G73/06; C08G73/10; C08L; C08L83/00; C08L83/02; H10P; H10P14/00; H10P14/60; H10P14/66; H10P14/668; H10P14/6681; H10P14/6684; H10P14/6686; H10W20/01; H10W20/071; H10P14/63; H10P14/6326; H10P14/6342; H10P14/665; H10P14/69; H10P14/692; H10P14/6921; H10P14/6922
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
70 words
An integrated circuit device comprising: (a) a substrate; (b) metallic circuit lines positioned on the substrate; and (c) a porous dielectric composition positioned contiguous to the circuit lines, the composition comprising the reaction product of organic polysilica and polyamic ester terminated with (RO) m (R") n SiR'-- where R and R' are independently a hydrocarbyl group; R" is hydrido or hydrocarbyl group; m is 1, 2 or 3 and n+m=3.
Claim 2
Dependent Claim
70 words
An integrated circuit device comprising: (a) a substrate; (b) metallic circuit lines positioned on the substrate; and (c) a porous dielectric composition positioned contiguous to the circuit lines, the composition comprising the reaction product of organic polysilica and polyamic ester terminated with (RO) m (R") n SiR'-- where R and R' are independently a hydrocarbyl group; R" is hydrido or hydrocarbyl group; m is 1, 2 or 3 and n+m=3.
Claim 3
Dependent Claim
17 words
The device of claim 1 wherein the organic polysilica is C 1-6 alkoxysilane, silsesquioxane, or mixtures thereof.
Claim 4
Dependent Claim
13 words
The device of claim 2 wherein the silsesquioxane is phenyl/C 1-6 alkyl silsesquioxane.
Claim 5
Dependent Claim
28 words
The device of claim 2 wherein the polyamic ester is terminated with a tri C 1-10 alkoxysilyl C 1-10 alkyl group or tri C 1-10 alkoxysilyl aryl group.
Claim 6
Dependent Claim
42 words
The device of claim 3 wherein the polyamic ester comprises a diamine selected from 9,9'-bis(4-aminophenyl)fluorene; 4,4'-oxydianiline and 1,1-bis(4-aminophenyl)-1-phenyl-2,2,2-trifluoroethane and a diester diacid halide selected from di C 1-6 alkyl dichloro pyromellitate, di C 1-6 alkyl dichloroxydiphthalate, and di C 1-6 alkyl dichlorobiphenyl-tetracarboxylate.
Claim 7
Dependent Claim
17 words
The device of claim 2 wherein the dielectric composition has a dielectric constant of less than 3.2.
Claim 8
Dependent Claim
16 words
The device of claim 2 wherein the dielectric composition has phase domains less than 0.5 micron.
Claim 9
Dependent Claim
100 words
A process for forming an integrated circuit comprising: (a) positioning on a substrate a layer of dielectric composition, the composition comprising a decomposable polymer and reactants organic polysilica and polyamic ester terminated with (RO) m (R") n SiR'-- where R and R' are independently a hydrocarbyl group; R" is hydrido or hydrocarbyl group; m is 1, 2 or 3 and n+m=3; (b) heating the composition to react the reactants; (c) decomposing the decomposable polymer; (d) lithographically patterning the dielectric layer; (e) depositing a metallic film onto the patterned dielectric layer; and (f) planarizing the film to form the integrated circuit.
Claim 10
Dependent Claim
100 words
A process for forming an integrated circuit comprising: (a) positioning on a substrate a layer of dielectric composition, the composition comprising a decomposable polymer and reactants organic polysilica and polyamic ester terminated with (RO) m (R") n SiR'-- where R and R' are independently a hydrocarbyl group; R" is hydrido or hydrocarbyl group; m is 1, 2 or 3 and n+m=3; (b) heating the composition to react the reactants; (c) decomposing the decomposable polymer; (d) lithographically patterning the dielectric layer; (e) depositing a metallic film onto the patterned dielectric layer; and (f) planarizing the film to form the integrated circuit.
Claim 11
Dependent Claim
17 words
The process of claim 8 wherein the organic polysilica is C 1-6 alkoxysilane, silsesquioxane, or mixtures thereof.
Claim 12
Dependent Claim
28 words
The process of claim 9 wherein the polyamic ester is terminated with tri C 1-10 alkoxysilyl C 1-10 alkyl group or a tri C 1-10 alkoxysilyl aryl group.
Claim 13
Dependent Claim
42 words
The process of claim 9 wherein the polyamic ester comprises a diamine selected from 9,9'-bis(4-aminophenyl)fluorene; 4,4'-oxydianiline and 1,1-bis(4-aminophenyl)-1-phenyl-2,2,2-trifluoroethane and a diester diacid halide selected from di C 1-6 alkyl dichloro pyromellitate; di C 1-6 alkyl dichloroxydiphthalate and di C 1-6 alkyl dichlorobiphenyl-tetracarboxylate.
Claim 14
Dependent Claim
17 words
The process of claim 8 wherein the composition is heated in the presence of an organic base.
Claim 15
Dependent Claim
90 words
A process for forming an integrated circuit comprising: (a) depositing a metallic film on a substrate; (b) lithographically patterning the metallic film; (c) depositing on the patterned metallic film a layer of a dielectric composition comprising a decomposable polymer and reactants organic polysilica and polyamic ester terminated with (RO) m (R") n SiR'-- where R and R' are independently a hydrocarbyl group; R" is hydrido or hydrocarbyl group; m is 1, 2 or 3 and n+m=3; (d) heating the composition to react the reactants; and (e) decomposing the decomposable polymer.
Claim 16
Dependent Claim
90 words
A process for forming an integrated circuit comprising: (a) depositing a metallic film on a substrate; (b) lithographically patterning the metallic film; (c) depositing on the patterned metallic film a layer of a dielectric composition comprising a decomposable polymer and reactants organic polysilica and polyamic ester terminated with (RO) m (R") n SiR'-- where R and R' are independently a hydrocarbyl group; R" is hydrido or hydrocarbyl group; m is 1, 2 or 3 and n+m=3; (d) heating the composition to react the reactants; and (e) decomposing the decomposable polymer.
Claim 17
Dependent Claim
17 words
The process of claim 13 wherein the organic polysilica is C 1-6 alkoxysilane, silsesquioxane, or mixtures thereof.
Claim 18
Dependent Claim
30 words
The process of claim 14 wherein the polyamic ester is end capped with a tri C 1-10 alkoxysilyl C 1-10 alkyl group or a tri C 1-10 alkoxysilyl aryl group.
Claim 19
Dependent Claim
43 words
The process of claim 14 wherein the polyamic ester comprises a diamine selected from 9,9'-bis(4-aminophenyl)fluorene; 4,4'-oxydianiline and 1,1-bis(4-aminophenyl)-1-phenyl-2,2,2-trifluoroethane and a diester diacid halide selected from di C 1-6 alkyl dichloro pyromellitate; di C 1-6 alkyl dichlorooxydliphthalate and di C 1-6 alkyl dichlorobiphenyl-tetra carboxylate.
Claim 20
Dependent Claim
17 words
The process of claim 13 wherein the composition is heated in the presence of an organic base.
Claim 21
Dependent Claim
43 words
A porous composition comprising the reaction product of organic polysilica and polyamic ester terminated with (RO) m (R") n SiR'-- where R and R' are independently a hydrocarbyl group; R" is hydrido or hydrocarbyl group; m is 1, 2 or 3 and n+m=3.
Claim 22
Dependent Claim
43 words
A porous composition comprising the reaction product of organic polysilica and polyamic ester terminated with (RO) m (R") n SiR'-- where R and R' are independently a hydrocarbyl group; R" is hydrido or hydrocarbyl group; m is 1, 2 or 3 and n+m=3.
Claim 23
Dependent Claim
17 words
The composition of claim 18 wherein the organic polysilica is C 1-6 alkoxysilane, silsesquioxane, or mixtures thereof.
Claim 24
Dependent Claim
30 words
The composition of claim 19 wherein the polyamic ester is end capped with a tri C 1-10 alkoxysilyl C 1-10 alkyl group or a tri C 1-10 alkoxysilyl aryl group.
Claim 25
Dependent Claim
43 words
The composition of claim 20 wherein the polyamic ester comprises a diamine selected from 9,9'-bis(4-aminophenyl)fluorene; 4,4'-oxydianiline and 1,1-bis(4-aminophenyl)-1-phenyl-2,2,2-trifluoroethane and a diester diacid halide selected from di C 1-6 alkyl dichloro pyromellitate; di C 1-6 alkyl dichlorooxydiphthalate and di C 1-6 alkyl dichorobiphenyl-tetra carboxylate.
Claim 26
Dependent Claim
110 words
An integrated circuit packaging device for providing signal and power current to an integrated circuit chip comprising: (i) a substrate having an electrical conductor for connection to a circuit board; (ii) a plurality of alternating electrically insulating and conducting layers positioned on the substrate wherein at least one of the layers comprises the porous reaction product of organic polysilica and polyamic ester terminated with (RO) m (R") n SiR'-- where R and R' are independently a hydrocarbyl group; R" is hydrido or hydrocarbyl group; m is 1, 2 or 3 and n+m=3; and (iii) a plurality of vias for electrically interconnecting electrical conductor, conducting layers, and an integrated circuit chip.
Claim 27
Dependent Claim
110 words
An integrated circuit packaging device for providing signal and power current to an integrated circuit chip comprising: (i) a substrate having an electrical conductor for connection to a circuit board; (ii) a plurality of alternating electrically insulating and conducting layers positioned on the substrate wherein at least one of the layers comprises the porous reaction product of organic polysilica and polyamic ester terminated with (RO) m (R") n SiR'-- where R and R' are independently a hydrocarbyl group; R" is hydrido or hydrocarbyl group; m is 1, 2 or 3 and n+m=3; and (iii) a plurality of vias for electrically interconnecting electrical conductor, conducting layers, and an integrated circuit chip.
Claim 28
Dependent Claim
17 words
The device of claim 22 wherein the organic polysilica is C 1-6 alkoxysilane, silsesquioxane, or mixtures thereof.
Claim 29
Dependent Claim
13 words
The device of claim 23 wherein the silsesquioxane is phenyl/C 1-6 alkyl silsesquioxane.
Claim 30
Dependent Claim
28 words
The device of claim 23 wherein the polyamic ester is terminated with a tri C 1-10 alkoxysilyl C 1-10 alkyl group or tri C 1-10 alkoxysilyl aryl group.
Claim 31
Dependent Claim
42 words
The device of claim 25 wherein the polyamic ester comprises a diamine selected from 9,9'-bis(4-aminophenyl)fluorene, 4,4'-oxydianiline and 1,1-bis(4-aminophenyl)-1-phenyl-2,2,2-trifluoroethane, and a diester diacid halide selected from di C 1-6 alkyl dichloro pyromellitate, di C 1-6 alkyl dichlorooxydiphthalate and di C 1-6 alkyl dichlorobiphenyl-tetracarboxylate.
References Cited (Backward Citations)
US3547839A
Cited
US3732181A
Cited
US3917761A
Cited
US4141877A
Cited
GB2006643A
Cited
US5130025A
Cited
US4623463A
Cited
US4535099A
Cited
US4761233A
Cited
JPS63172741A
Cited
JPS63278943A
Cited
US4920402A
Cited
US5043369A
Cited
US5036145A
Cited
US5114826A
Cited
US5198203A
Cited
US5206337A
Cited
US5288842A
Cited
US5252654A
Cited
JPH05205526A
Cited
US5188777A
Cited
US5183607A
Cited
US5420232A
Cited
US5412016A
Cited
US5384376A
Cited
US5412160A
Cited
US5470801A
Cited
US5461003A
Cited
US5633034A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-03-15 | 2002-09-14 | 2003-03-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-03-15 | 2006-09-14 | 2007-03-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-03-15 | 2010-09-14 | 2011-03-16 | $7700.00 | Window Closed / Lapsed |