Process for making integrated circuit structure comprising local area interconnects formed over semiconductor substrate by selective deposition on seed layer in patterned trench

Claim 2

A process for forming one or more electrically conductive interconnects over a semiconductor substrate which comprises: a) forming an insulation layer over a semiconductor substrate; b) forming one or more trenches in, but not completely through said insulation layer conforming to the desired shape of said one or more electrically conductive interconnects; c) thereafter forming only in said one or more trenches in said insulation layer a seed layer patterned by said one or more trenches into the desired shape of said one or more electrically conductive interconnects; and d) then selectively forming an electrically conductive metal compound directly over only said patterned seed layer in said one or more trenches; whereby said electrically conductive metal compound selectively formed only over said patterned seed layer will conform to the pattern of said seed layer to form said one or more electrically conductive interconnects.

Claim 3

The process of forming one or more electrically conductive interconnects of claim 1 wherein said step of depositing said seed layer in said one or more trenches conforming to the desired shape of said one or more electrically conductive interconnects further comprises depositing in said one or more trenches a seed layer selected from the group consisting of silicon, germanium, silicon-germanium mixtures, transition metal nitrides, titanium, platinum, tungsten, and titanium tungsten alloys.

Claim 4

The process of forming one or more electrically conductive interconnects of claim 1 wherein said step of depositing said seed layer in said one or more trenches conforming to the desired shape of said one or more electrically conductive interconnects further comprises depositing in said one or more trenches a seed layer selected from the group consisting of silicon, germanium, silicon-germanium mixtures, and titanium nitride.

Claim 5

A process for forming one or more electrically conductive local area interconnects over a semiconductor substrate which comprises: a) forming over a semiconductor substrate, a seed layer patterned into the desired shape of said one or more electrically conductive interconnects; and b) selectively forming titanium silicide only over said patterned seed layer; whereby said titanium silicide selectively formed only over said patterned seed layer will conform to the pattern of said seed layer to form said one or more electrically conductive local area interconnects.

Claim 6

A process for forming one or more electrically conductive local area interconnects over a semiconductor substrate which comprises: a) forming over a semiconductor substrate, a seed layer patterned into the desired shape of said one or more electrically conductive interconnects; and b) selectively forming titanium silicide only over said patterned seed layer; whereby said titanium silicide selectively formed only over said patterned seed layer will conform to the pattern of said seed layer to form said one or more electrically conductive local area interconnects.

Claim 7

The process of claim 4 wherein said seed layer is deposited in one or more trenches patterned to conform to the desired shape of said one or more electrically conductive interconnects.

Claim 8

The process of forming one or more electrically conductive local area interconnects of claim 5 wherein said step of depositing said seed layer in said one or more trenches conforming to the desired shape of said one or more electrically conductive interconnects further comprises depositing in said one or more trenches a seed layer selected from the group consisting of silicon, germanium, silicon-germanium mixtures, transition metal nitrides, titanium, platinum, tungsten, and titanium tungsten alloys.

Claim 9

A process for forming one or more electrically conductive local area interconnects over a semiconductor substrate which comprises: a) forming an insulation layer over a semiconductor substrate; b) forming one or more trenches in, but not completely through said insulation layer conforming to the desired shape of said one or more electrically conductive local area interconnects; c) thereafter forming a seed layer only in said one or more trenches, said seed layer thereby patterned by said trenches into the desired shape of said one or more electrically conductive interconnects, said seed layer selected from the group consisting of silicon, germanium, silicon-germanium mixtures, transition metal nitrides, titanium, platinum, tungsten, and titanium tungsten alloys; and d) then selectively forming titanium silicide only over said patterned seed layer; whereby said titanium silicide selectively formed only over said patterned seed layer will conform to the pattern of said seed layer in said one or more trenches to form said one or more electrically conductive local area interconnects.

Claim 10

A process for forming one or more electrically conductive local area interconnects over a semiconductor substrate which comprises: a) forming an insulation layer over a semiconductor substrate; b) forming one or more trenches in, but not completely through said insulation layer conforming to the desired shape of said one or more electrically conductive local area interconnects; c) thereafter forming a seed layer only in said one or more trenches, said seed layer thereby patterned by said trenches into the desired shape of said one or more electrically conductive interconnects, said seed layer selected from the group consisting of silicon, germanium, silicon-germanium mixtures, transition metal nitrides, titanium, platinum, tungsten, and titanium tungsten alloys; and d) then selectively forming titanium silicide only over said patterned seed layer; whereby said titanium silicide selectively formed only over said patterned seed layer will conform to the pattern of said seed layer in said one or more trenches to form said one or more electrically conductive local area interconnects.