Abstract A retainer ring is provided for used on the polishing head of a CMP machine, which can allow the slurry being applied to the CMP process to be uniformly distributed over the surface of the wafer. The retainer ring is designed for use on a CMP machine of the type having a polishing table, a polishing pad, a polishing head for holding a semiconductor wafer retained in fixed position, and means for applying a mass of slurry to the wafer. The polishing head is of the type including an air-pressure means which can apply air pressure to a wafer loader used to hold the wafer in position. The retainer ring is formed with a plurality of straight grooves spaced at substantially equal intervals, each being radially inclined in such a manner so as to form an acute angle of attack against the slurry on the outside of said retainer ring when said retainer ring spins. Further, the retainer ring can be additionally formed with at least one circular groove intercrossing all of said straight grooves. The straight grooves can cause the slurry to be drawn into the inside of the retainer ring from all radial directions, thus allowing the slurry to be spread uniformly over the wafer.
A retainer ring for use on a polishing machine having a polishing table, a polishing pad layered on said polishing table, a polishing head for holding a semiconductor wafer retained in a fixed position by said retainer ring, and means for applying a mass of slurry to the wafer, said retainer ring comprising: a plurality of straight grooves spaced at substantially equal angular intervals around said retainer ring; and at least one circular groove intercrossing said plurality of straight grooves, each of said plurality straight grooves being radially inclined in such a manner so as to form an acute angle of attack against the slurry on the outside of said retainer ring when said retainer ring spins.
Claim 2
Dependent Claim
117 words
A retainer ring for use on a polishing machine having a polishing table, a polishing pad layered on said polishing table, a polishing head for holding a semiconductor wafer retained in a fixed position by said retainer ring, and means for applying a mass of slurry to the wafer, said retainer ring comprising: a plurality of straight grooves spaced at substantially equal angular intervals around said retainer ring; and at least one circular groove intercrossing said plurality of straight grooves, each of said plurality straight grooves being radially inclined in such a manner so as to form an acute angle of attack against the slurry on the outside of said retainer ring when said retainer ring spins.
Claim 3
Dependent Claim
23 words
The retainer ring of claim 1, which is formed with an inner radius of 4 inches and an outer radius of 12 inches.
Claim 4
Dependent Claim
17 words
The retainer ring of claim 1, wherein said straight grooves are formed in a number of 10.
Claim 5
Dependent Claim
25 words
The retainer ring of claim 1, wherein said straight grooves are each formed with a width of 0.1 mm and a depth of 3 mm.
Claim 6
Dependent Claim
23 words
The retainer ring of claim 1, wherein said circular groove is formed between the outer side and inner side of said retainer ring.
Claim 7
Dependent Claim
24 words
The retainer ring of claim 1, wherein said circular groove is formed with a width of 0.05˜0.3 mm and a depth of 2˜4 mm.