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US5946558A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of making ROM components

Assignee: United Microelectronics Corp
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Filing: 1997-05-30
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Granted: 1999-08-31
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Expires: 2017-05-30
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Abstract

Abstract A method of making a read only memory device includes forming a gate oxide layer and a silicon nitride layer in sequence above a silicon substrate. The gate oxide layer and the silicon nitride layer are etched to define a plurality of parallel strips extending in a first direction. Ions are implanted, using the parallel strips as masks, into the silicon substrate to form a plurality of buried bit lines extending in the first direction. A sidewall spacer is formed on respective sidewalls of the parallel strips. A silicide layer is formed over an exposed surface of the respective bit lines. An insulating layer is formed to cover any exposed surfaces, and fill a space located between adjacent parallel strips and above the bit lines. A portion of the insulating layer is removed to expose the silicon nitride layer and form a planar surface. The silicon nitride layer is patterned to form a plurality of coding areas. A polysilicon layer is formed to cover the coding areas as well as any other exposed surfaces. The polysilicon layer is patterned to form a plurality of parallel word lines extending in a second direction perpendicular to the first direction. The word lines cover the coding areas and cross the bit lines. The area where each word line crosses with two adjacent bit lines forms a read only memory cell. A self-aligned coding operation is performed to define the read only memory cells as having an on or off state.

Inventors

  • 👤 Chen-Chung Hsu

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 10:47
CPC Classifications
H; H10; H10B; H10B20/00; H10B20/27; H10B20/30; H10B20/38; H10B20/383

Claims Analysis

Total Claims: 16
Claim 1
Independent Claim 238 words
A method of making a read only memory device, comprising: forming a gate oxide layer and a silicon nitride layer in sequence above a silicon substrate; etching the gate oxide layer and the silicon nitride layer to define a plurality of parallel strips extending in a first direction; implanting ions, using the parallel strips as masks, into the silicon substrate to form a plurality of buried bit lines extending in the first direction; forming a sidewall spacer on respective sidewalls of the parallel strips; forming a silicide layer over an exposed surface of the respective bit lines; forming an insulating layer covering any exposed surfaces, and filling a space located between adjacent parallel strips and above the bit lines; removing a portion of the insulating layer to expose the silicon nitride layer and form a planar surface; patterning the silicon nitride layer to form a plurality of coding areas; forming a polysilicon layer to cover the coding areas as well as any other exposed surfaces; patterning the polysilicon layer to form a plurality of parallel word lines extending in a second direction perpendicular to the first direction, the word lines covering the coding areas and crossing the bit lines, with an area where each word line crosses with two adjacent bit lines forming a read only memory cell; and performing a self-aligned coding operation to define the read only memory cells as having an ON or OFF state.
Claim 2
Independent Claim 238 words
A method of making a read only memory device, comprising: forming a gate oxide layer and a silicon nitride layer in sequence above a silicon substrate; etching the gate oxide layer and the silicon nitride layer to define a plurality of parallel strips extending in a first direction; implanting ions, using the parallel strips as masks, into the silicon substrate to form a plurality of buried bit lines extending in the first direction; forming a sidewall spacer on respective sidewalls of the parallel strips; forming a silicide layer over an exposed surface of the respective bit lines; forming an insulating layer covering any exposed surfaces, and filling a space located between adjacent parallel strips and above the bit lines; removing a portion of the insulating layer to expose the silicon nitride layer and form a planar surface; patterning the silicon nitride layer to form a plurality of coding areas; forming a polysilicon layer to cover the coding areas as well as any other exposed surfaces; patterning the polysilicon layer to form a plurality of parallel word lines extending in a second direction perpendicular to the first direction, the word lines covering the coding areas and crossing the bit lines, with an area where each word line crosses with two adjacent bit lines forming a read only memory cell; and performing a self-aligned coding operation to define the read only memory cells as having an ON or OFF state.
Claim 3
Dependent Claim 14 words
The method recited in claim 1, wherein said implanting ions includes implanting N-type ions.
Claim 4
Dependent Claim 20 words
The method recited in claim 1, wherein said forming a sidewall spacer includes composing the sidewall spacers of silicon dioxide.
Claim 5
Dependent Claim 17 words
The method recited in claim 1, wherein said forming a silicide layer comprises using a self-alignment process.
Claim 6
Dependent Claim 20 words
The method recited in claim 1, wherein said forming a silicide layer includes composing the silicide layer of titanium silicide.
Claim 7
Dependent Claim 20 words
The method recited in claim 1, wherein said forming a silicide layer includes composing the silicide layer of tungsten silicide.
Claim 8
Dependent Claim 20 words
The method recited in claim 1, wherein said forming an insulating layer includes composing the insulating layer of silicon dioxide.
Claim 9
Dependent Claim 20 words
The method recited in claim 1, wherein said forming an insulating layer includes composing the insulating layer of boro-phosphosilicate glass.
Claim 10
Dependent Claim 24 words
The method recited in claim 1, wherein said removing a portion of the insulating layer includes removing the portion using a chemical-mechanical polishing technique.
Claim 11
Dependent Claim 27 words
The method recited in claim 1, wherein said performing a self-aligned coding operation includes defining the state of each memory cell using a P-type ion implantation process.
Claim 12
Dependent Claim 21 words
The method recited in claim 1, further comprising forming metallic wirings and passivation layers after said performing a self-aligned coding operation.
Claim 13
Independent Claim 223 words
A method of making a memory unit for a read only memory device, comprising: forming a gate oxide layer and a silicon nitride layer in sequence above a silicon substrate; etching the gate oxide layer and the silicon nitride layer to define a plurality of parallel strips extending in a first direction; implanting ions, using the parallel strips as masks, into the silicon substrate to form a plurality of buried bit lines extending in the first direction; forming a sidewall spacer on respective sidewalls of the parallel strips; forming a silicide layer over an exposed surface of the respective bit lines; forming an insulating layer covering any exposed surfaces, and filling a space located between adjacent parallel strips and above the bit lines; removing a portion of the insulating layer to expose the silicon nitride layer and form a planar surface; patterning the silicon nitride layer to form a plurality of coding areas; forming a polysilicon layer to cover the coding areas as well as any other exposed surfaces; and patterning the polysilicon layer to form a plurality of parallel word lines extending in a second direction perpendicular to the first direction, the word lines covering the coding areas and crossing the bit lines, with an area where each word line crosses with two adjacent bit lines forming a read only memory cell.
Claim 14
Independent Claim 223 words
A method of making a memory unit for a read only memory device, comprising: forming a gate oxide layer and a silicon nitride layer in sequence above a silicon substrate; etching the gate oxide layer and the silicon nitride layer to define a plurality of parallel strips extending in a first direction; implanting ions, using the parallel strips as masks, into the silicon substrate to form a plurality of buried bit lines extending in the first direction; forming a sidewall spacer on respective sidewalls of the parallel strips; forming a silicide layer over an exposed surface of the respective bit lines; forming an insulating layer covering any exposed surfaces, and filling a space located between adjacent parallel strips and above the bit lines; removing a portion of the insulating layer to expose the silicon nitride layer and form a planar surface; patterning the silicon nitride layer to form a plurality of coding areas; forming a polysilicon layer to cover the coding areas as well as any other exposed surfaces; and patterning the polysilicon layer to form a plurality of parallel word lines extending in a second direction perpendicular to the first direction, the word lines covering the coding areas and crossing the bit lines, with an area where each word line crosses with two adjacent bit lines forming a read only memory cell.
Claim 15
Independent Claim 199 words
A method of making a memory unit for a read only memory device, comprising: forming a plurality of parallel strips of silicon nitride over a silicon substrate; implanting ions, using the parallel strips as masks, into the silicon substrate to form a plurality of buried bit lines extending in the same direction as the parallel strips; forming a suicide layer over an exposed surface of the respective bit lines to increase the conductivity of the bit lines; forming an insulating layer covering any exposed surfaces, and filling a space located between adjacent parallel strips and above the bit lines; removing a portion of the insulating layer to expose the silicon nitride layer and form a planar surface; patterning the silicon nitride layer to form a plurality of coding areas; forming a polysilicon layer to cover the coding areas as well as any other exposed surfaces; and patterning the polysilicon layer to form a plurality of parallel word lines extending in a second direction perpendicular to the first direction, the word lines covering the coding areas and crossing the bit lines, with an area where each word line crosses with two adjacent bit lines forming a read only memory cell.
Claim 16
Independent Claim 199 words
A method of making a memory unit for a read only memory device, comprising: forming a plurality of parallel strips of silicon nitride over a silicon substrate; implanting ions, using the parallel strips as masks, into the silicon substrate to form a plurality of buried bit lines extending in the same direction as the parallel strips; forming a suicide layer over an exposed surface of the respective bit lines to increase the conductivity of the bit lines; forming an insulating layer covering any exposed surfaces, and filling a space located between adjacent parallel strips and above the bit lines; removing a portion of the insulating layer to expose the silicon nitride layer and form a planar surface; patterning the silicon nitride layer to form a plurality of coding areas; forming a polysilicon layer to cover the coding areas as well as any other exposed surfaces; and patterning the polysilicon layer to form a plurality of parallel word lines extending in a second direction perpendicular to the first direction, the word lines covering the coding areas and crossing the bit lines, with an area where each word line crosses with two adjacent bit lines forming a read only memory cell.

References Cited (Backward Citations)

US5084418A Cited
US5712203A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2002-08-30 2003-03-01 2003-08-31 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2006-08-30 2007-03-01 2007-08-31 $3760.00 Window Closed / Lapsed
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