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Underwater laser processing method and apparatus

Assignee: Toshiba Corp
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Filing: 1998-05-15
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Granted: 2000-07-04
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Expires: 2018-05-15
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Abstract

Abstract An underwater laser processing method is carried out by irradiating, through a laser beam irradiation apparatus, a laser beam having a high output, a short pulse and a visible wavelength to a surface of a structure immersed in a water to improve residual stress of a material of the surface of the structure and remove a crack or a CRUD thereof. The laser beam irradiation apparatus comprises a pulse laser device suspended into a water in which a metal material is accommodated from an upper side thereof for irradiating a laser beam having a visible wavelength to a processing position, a beam strength adjusting device for adjusting an output per 1 pulse of a laser beam generated by the pulse laser device and a mechanism for adjusting a spot diameter and a multiplexing ratio of an irradiated beam.

Inventors

  • 👤 Kouki Okazaki
  • 👤 Arata Ito
  • 👤 Yuji Sano
  • 👤 Naruhiko Mukai
  • 👤 Nobutada Aoki
  • 👤 Chikara Konagai
  • 👤 Muneyoshi Kikunaga

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 08:07
CPC Classifications
B; B23; B23K; B23K26/00; B23K26/02; B23K26/06; B23K26/0604; B23K26/0608; B23K26/08; B23K26/082; B23K26/0821; B23K26/12; B23K26/1224; B23K26/14; B23K26/142; B23K26/352; B23K26/356; G; G21; G21C; G21C13/00; G21C13/08; G21C13/087; Y; Y02; Y02E; Y02E30/00; Y02E30/30

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 129 words
An underwater laser processing apparatus, comprising: a pulse laser device configured to provide a series of laser beam pulses, each laser beam pulse having a duration of 100 nanoseconds or less; a laser beam strength adjusting device configured to adjust an output power of each said laser beam pulse to a peak power value in a range of from 0.1 to 10 GW/cm 2 ; and a working head including a mechanism configured to irradiate each said laser beam pulse of a duration of 100 nanoseconds or less and adjusted power value in a range of from 0.1 to 10 GW/cm 2 as a train of laser beam spots having a coverage factor of 100% onto a surface of a metal material covered with water at a processing position.
Claim 2
Dependent Claim 129 words
An underwater laser processing apparatus, comprising: a pulse laser device configured to provide a series of laser beam pulses, each laser beam pulse having a duration of 100 nanoseconds or less; a laser beam strength adjusting device configured to adjust an output power of each said laser beam pulse to a peak power value in a range of from 0.1 to 10 GW/cm 2 ; and a working head including a mechanism configured to irradiate each said laser beam pulse of a duration of 100 nanoseconds or less and adjusted power value in a range of from 0.1 to 10 GW/cm 2 as a train of laser beam spots having a coverage factor of 100% onto a surface of a metal material covered with water at a processing position.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2003-07-04 2004-01-03 2004-07-04 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2007-07-04 2008-01-03 2008-07-04 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2011-07-04 2012-01-03 2012-07-04 $7700.00 Window Closed / Lapsed

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