Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
140 words
A method of fabricating a one-time programmable read only memory, comprising the steps of: forming a stacked structure on a substrate, wherein the stacked structure comprises a first oxide layer, a first polysilicon layer, and a second oxide layer formed in sequence on the substrate, and the substrate beside the stacked structure is exposed by the stacked structure; forming an implanted region in the exposed substrate beside the stacked structure; forming a spacer on a sidewall of the stacked structure; forming a silicide layer on the implanted region; forming a silicon nitride layer to directly cover the second oxide layer, the spacer, and the silicide layer, forming a second polysilicon layer to cover the silicon nitride layer; and patterning the second polysilicon layer to form a control gate and further patterning the first polysilicon layer to form a floating gate.
Claim 2
Independent Claim
140 words
A method of fabricating a one-time programmable read only memory, comprising the steps of: forming a stacked structure on a substrate, wherein the stacked structure comprises a first oxide layer, a first polysilicon layer, and a second oxide layer formed in sequence on the substrate, and the substrate beside the stacked structure is exposed by the stacked structure; forming an implanted region in the exposed substrate beside the stacked structure; forming a spacer on a sidewall of the stacked structure; forming a silicide layer on the implanted region; forming a silicon nitride layer to directly cover the second oxide layer, the spacer, and the silicide layer, forming a second polysilicon layer to cover the silicon nitride layer; and patterning the second polysilicon layer to form a control gate and further patterning the first polysilicon layer to form a floating gate.
Claim 3
Dependent Claim
15 words
The method of claim 1 , wherein the material of the spacer comprises silicon nitride.
Claim 4
Dependent Claim
15 words
The method of claim 1 , wherein the silicide layer comprises a titanium silicide layer.
Claim 5
Dependent Claim
18 words
The method of claim 1 , wherein the first polysilicon layer is formed by low-pressure chemical vapor deposition.
Claim 6
Dependent Claim
18 words
The method of claim 1 , wherein the second polysilicon layer is formed by low-pressure chemical vapor deposition.
Claim 7
Dependent Claim
60 words
The method of claim 1 , wherein the step of forming the silicide layer comprises: forming a metallic layer on the substrate exposed by the second oxide layer, the spacer, and the stacked structure; performing a thermal treatment to covert the metallic layer, which is in contact with the substrate, into the silicide layer; and removing the remaining metallic layer.
Claim 8
Dependent Claim
28 words
The method of claim 1 , wherein the step of patterning the second polysilicon layer and further patterning the first polysilicon layer comprises a photolithographic and etching process.
Claim 9
Dependent Claim
29 words
The method of claim 1 , wherein the further patterning of the first polysilicon layer comprises a self-aligned etching step with the second polysilicon layer serving as a mask.
Claim 10
Independent Claim
118 words
A method of fabricating a one-time programmable read only memory, comprising the steps of: forming a stacked structure on a substrate, wherein the stacked structure comprises a first oxide layer, a first polysilicon layer, and a second oxide layer formed in sequence on the substrate, and the substrate beside the stacked structure is exposed by the stacked structure; forming an implanted region in the exposed substrate beside the stacked structure; forming a spacer on a sidewall of the stacked structure; forming a silicide layer on the implanted region in the substrate; forming a silicon nitride layer to directly cover the second oxide layer, the spacer, and the silicide layer; forming a control gate on the silicon nitride layer.
Claim 11
Independent Claim
118 words
A method of fabricating a one-time programmable read only memory, comprising the steps of: forming a stacked structure on a substrate, wherein the stacked structure comprises a first oxide layer, a first polysilicon layer, and a second oxide layer formed in sequence on the substrate, and the substrate beside the stacked structure is exposed by the stacked structure; forming an implanted region in the exposed substrate beside the stacked structure; forming a spacer on a sidewall of the stacked structure; forming a silicide layer on the implanted region in the substrate; forming a silicon nitride layer to directly cover the second oxide layer, the spacer, and the silicide layer; forming a control gate on the silicon nitride layer.
Claim 12
Dependent Claim
41 words
The method of claim 9 , wherein the step of forming the silicide layer comprises: forming a metallic layer on the substrate; performing a thermal treatment to convert the metallic layer into the silicide layer; and removing the remaining metallic layer.
Claim 13
Dependent Claim
15 words
The method of claim 9 , wherein the material of the spacer comprises silicon nitride.
Claim 14
Dependent Claim
36 words
The method of claim 9 , wherein the step of forming the control gate comprises: forming a second polysilicon layer on the silicon nitride layer; and patterning the second polysilicon layer to form a control gate.
Claim 15
Dependent Claim
25 words
The method of claim 9 , further comprising patterning the first polysilicon layer to form a floating gate after the formation of the control gate.