Patent US2150046A successfully refreshed from Google Patents.
US6559523B2
Expired / Lapsed
US
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Device for attaching a semiconductor chip to a chip carrier
Assignee: Texas Instruments Inc
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Filing: 2001-04-19
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Granted: 2003-05-06
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Expires: 2021-04-19
Abstract
Abstract In a device for attaching a semiconductor chip ( 10 ) to a chip carrier ( 12 ), thereby producing an electrically conducting connection between contact areas ( 22, 24 ) arranged on a surface of the semiconductor chip ( 10 ) and contact areas ( 26, 28 ) on the chip carrier ( 12 ) by means of an anisotropically conducting film ( 16 ) or an anisotropically conducting paste ( 16 ), a pressure die ( 18 ) is used for the application of the pressure to the chip ( 10 ) with an adjustable pressing force against the chip carrier ( 12 ). A counter-pressure support ( 14 ) accepts the chip carrier ( 12 ) with the semiconductor chip ( 10 ) arranged on it with the interposition of the anisotropically conducting film ( 16 ) or the anisotropically conducting paste ( 16 ). An elastic body ( 20 ) is arranged either between the pressure die ( 14 ) and the semiconductor chip ( 10 ) or between the chip carrier ( 12 ) and the counter-pressure support ( 14 ).
Inventors
- 👤 Hermann Schmid
- 👤 Wolfgang Ramin
- 👤 Nusret Yilmaz
- 👤 Heinrich Brenninger
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 07:47
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/073; H10W72/0711; H10W72/30; H10W72/07141; H10W72/074; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W74/00; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
136 words
Device for attaching a semiconductor chip to a chip carrier to produce an electrically conducting connection between contact areas arranged on a surface of the semiconductor chip and contact areas on the chip carrier by means of an anisotropically conducting medium electrical conductor comprising: a chip carrier carrying thereon a semiconductor chip, an adjustable pressure die for the application of pressure to the semiconductor chip with an adjustable pressing force against the chip carrier, a counter-pressure support for receiving the chip carrier with the semiconductor chip arranged thereon, an anisotropically conducting medium disposed on said chip carrier, and an elastic body disposed between the pressure die and the semiconductor chip for creating an accumulation of anisotropically conducting medium over the sides of the semiconductor chip and on surface regions of the semiconductor chip having contact areas.
Claim 2
Dependent Claim
136 words
Device for attaching a semiconductor chip to a chip carrier to produce an electrically conducting connection between contact areas arranged on a surface of the semiconductor chip and contact areas on the chip carrier by means of an anisotropically conducting medium electrical conductor comprising: a chip carrier carrying thereon a semiconductor chip, an adjustable pressure die for the application of pressure to the semiconductor chip with an adjustable pressing force against the chip carrier, a counter-pressure support for receiving the chip carrier with the semiconductor chip arranged thereon, an anisotropically conducting medium disposed on said chip carrier, and an elastic body disposed between the pressure die and the semiconductor chip for creating an accumulation of anisotropically conducting medium over the sides of the semiconductor chip and on surface regions of the semiconductor chip having contact areas.
Claim 3
Dependent Claim
18 words
Device according to claim 1 , the elastic body being fitted to the face of the pressure die.
Claim 4
Dependent Claim
12 words
Device according to claim 2 wherein the elastic body comprises heat-resistant silicone.
Claim 5
Dependent Claim
31 words
Device according to claim 1 , wherein the elastic body is a band extending parallel to and between the face of the pressure die and the surface of the semiconductor chip.
Claim 6
Dependent Claim
11 words
Device according to claim 4 wherein the counter-pressure support is heated.
Claim 7
Dependent Claim
12 words
Device according to claim 4 wherein the elastic body comprises heat-resistant silicone.
Claim 8
Dependent Claim
11 words
Device according to claim 1 wherein the counter-pressure support is heated.
Claim 9
Dependent Claim
12 words
Device according to claim 7 wherein the elastic body comprises heat-resistant silicone.
Claim 10
Dependent Claim
12 words
Device according to claim 1 wherein the elastic body comprises heat-resistant silicone.
Claim 11
Dependent Claim
11 words
Device according to claim 2 wherein the counter-pressure support is heated.
Claim 12
Dependent Claim
77 words
Device for attaching a semiconductor chip to a carrier comprising: a chip carrier carrying a semiconductor chip thereon; a pressure die for the application of pressure to the chip with an adjustable pressing force against the chip carrier, a counter-pressure support for receiving the chip carrier with the semiconductor chip arranged thereon, an anisotropically conducting medium interposed between said chip and said counter-pressure support, and an elastic body disposed between the pressure die and the semiconductor chip.
Claim 13
Dependent Claim
77 words
Device for attaching a semiconductor chip to a carrier comprising: a chip carrier carrying a semiconductor chip thereon; a pressure die for the application of pressure to the chip with an adjustable pressing force against the chip carrier, a counter-pressure support for receiving the chip carrier with the semiconductor chip arranged thereon, an anisotropically conducting medium interposed between said chip and said counter-pressure support, and an elastic body disposed between the pressure die and the semiconductor chip.
Claim 14
Dependent Claim
18 words
Device according to claim 11 , wherein the elastic body is fitted to the face of pressure die.
Claim 15
Dependent Claim
11 words
Device according to claim 12 wherein the counter-pressure support is heated.
Claim 16
Dependent Claim
11 words
Device according to claim 12 wherein the elastic body comprises silicone.
Claim 17
Dependent Claim
11 words
Device according to claim 11 wherein the counter-pressure support is heated.
Claim 18
Dependent Claim
11 words
Device according to claim 11 wherein the elastic body comprises silicone.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-05-05 | 2006-11-04 | 2007-05-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-05-05 | 2010-11-04 | 2011-05-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-05-05 | 2014-11-04 | 2015-05-06 | $7700.00 | Window Closed / Lapsed |