USRE32086E
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solder removing device
Assignee: Ernst Spirig
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Filing: 1985-04-19
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Granted: 1986-02-25
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Expires: 2005-04-19
Abstract
Abstract A solder removing device is disclosed for absorbing solder which has been rendered molten by the application of heat, including an open-mesh structure comprising a strand and formed by knitting, as a primary example, at least the surface of the strand being metallic and receptive to solder flux (and indeed being coated with solder flux rendering it more capable of wetting with molten solder). The open-mesh structure enables the device to absorb solder more freely and in greater quantities than can prior braided devices in which the multiple strands are contiguous.
Inventors
- 👤 Ernst Spirig
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 13:33
CPC Classifications
B; B23; B23K; B23K3/00; B23K3/08
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
77 words
A solder removing device, comprising (a) an open-mesh structure including at least one strand and being formed by knitting, weaving, stranding, braiding or crochetting, (b) adjacent sections of said strand being in non-contiguous relation thereby defining open spaces for absorbing molten solder, (c) at least the surface portion of said strand being metallic and receptive to solder flux, (d) said surface portion being coated with solder flux to render it more capable of wetting with molten solder.
Claim 2
Dependent Claim
77 words
A solder removing device, comprising (a) an open-mesh structure including at least one strand and being formed by knitting, weaving, stranding, braiding or crochetting, (b) adjacent sections of said strand being in non-contiguous relation thereby defining open spaces for absorbing molten solder, (c) at least the surface portion of said strand being metallic and receptive to solder flux, (d) said surface portion being coated with solder flux to render it more capable of wetting with molten solder.
Claim 3
Dependent Claim
18 words
A solder removing device as claimed in claim 1, wherein said structure has an elongate, flattened tubular configuration.
Claim 4
Dependent Claim
16 words
A solder removing device as claimed in claim 1, wherein said structure has a pad-shaped configuration.
Claim 5
Dependent Claim
29 words
A solder removing device as claimed in claim 1, and further wherein the strand is copper-coated after being formed into said open-mesh structure and prior to receiving said flux.
Claim 6
Independent Claim
69 words
A method for removing solder from an object, which comprises the steps of: (a) heating the solder to a molten condition; and (b) engaging the molten solder with an open-mesh structure including at least one strand, said structure being formed by knitting, weaving, stranding, braiding or crochetting, adjacent sections of said strand in said open-mesh structure being arranged in noncontiguous relation thereby defining open spaces for absorbing molten solder.
Claim 7
Independent Claim
69 words
A method for removing solder from an object, which comprises the steps of: (a) heating the solder to a molten condition; and (b) engaging the molten solder with an open-mesh structure including at least one strand, said structure being formed by knitting, weaving, stranding, braiding or crochetting, adjacent sections of said strand in said open-mesh structure being arranged in noncontiguous relation thereby defining open spaces for absorbing molten solder.
Claim 8
Dependent Claim
59 words
A solder removing device, comprising an open-mesh structure including at least one strand and being formed by knitting, weaving, stranding, braiding or crochetting, said strand comprising a non-metallic filament, said strand being copper-coated after being formed into said open-mesh structure, said copper-coated open-mesh structure being coated with solder flux to render it more capable of wetting with molten solder.
Claim 9
Dependent Claim
59 words
A solder removing device, comprising an open-mesh structure including at least one strand and being formed by knitting, weaving, stranding, braiding or crochetting, said strand comprising a non-metallic filament, said strand being copper-coated after being formed into said open-mesh structure, said copper-coated open-mesh structure being coated with solder flux to render it more capable of wetting with molten solder.
Claim 10
Dependent Claim
52 words
A solder removing device comprising an open-mesh structure including at least one strand and being formed by knitting, weaving, stranding, braiding or crochetting, said strand being alloy-coated after being formed into said open-mesh structure, said alloy-coated open-mesh structure coated with solder flux to render it more capable of wetting with molten solder.
Claim 11
Dependent Claim
52 words
A solder removing device comprising an open-mesh structure including at least one strand and being formed by knitting, weaving, stranding, braiding or crochetting, said strand being alloy-coated after being formed into said open-mesh structure, said alloy-coated open-mesh structure coated with solder flux to render it more capable of wetting with molten solder.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-02-24 | 1989-08-26 | 1990-02-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-02-24 | 1993-08-26 | 1994-02-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-02-24 | 1997-08-26 | 1998-02-25 | $7700.00 | Window Closed / Lapsed |