Patent US2881068A successfully refreshed from Google Patents.
Patent US4803543A successfully refreshed from Google Patents.
US4803543A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device and process for producing the same
Assignee: Hitachi Microcomputer System Ltd
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Filing: 1981-12-04
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Granted: 1989-02-07
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Expires: 2001-12-04
Abstract
Abstract In a resin packaged semiconductor device including a semiconductor element, the back side of which is bonded to a support and the front side of which has electrodes which are electrically connected to electroconductive portions by fine leads, when an adhesive composition comprising an epoxy resin, a novolak type phenolic resin, a solvent for the both resins and a powdery filler, and if necessary, a curing accelerator and a coupling agent, is used for binding the semiconductor and the support, the resulting semiconductor device is excellent in moisture resistance and corrosion resistance.
Inventors
- 👤 Hideo Inayoshi
- 👤 Akira Suzuki
- 👤 Kunihiro Tsubosaki
- 👤 Toyoichi Ueda
- 👤 Daisuke Makino
- 👤 Nobuo Ichimura
- 👤 Kazunari Suzuki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 18:12
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W20/00; H10W20/40; H10W70/00; H10W70/40; H10W70/411; H10W70/417; H10W74/10; H10W74/111; H10W74/121; H10W74/47; H10W74/473; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/075; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
83 words
A semiconductor device comprising a semiconductor element, the back main face of which is fixed to a supporting member with an adhesive layer formed by heat-curing an adhesive composition to bond the semiconductor element through its back main face to the supporting member, the adhesive composition comprising an epoxy resin, a novolak-type phenolic resin as a hardener, a solvent capable of dissolving both of said resins, and powdered silver, said adhesive layer being positioned between the back main face and the supporting member.
Claim 2
Dependent Claim
83 words
A semiconductor device comprising a semiconductor element, the back main face of which is fixed to a supporting member with an adhesive layer formed by heat-curing an adhesive composition to bond the semiconductor element through its back main face to the supporting member, the adhesive composition comprising an epoxy resin, a novolak-type phenolic resin as a hardener, a solvent capable of dissolving both of said resins, and powdered silver, said adhesive layer being positioned between the back main face and the supporting member.
Claim 3
Dependent Claim
12 words
A device according to claim 1, wherein the solvent is butyl Cellosolve.
Claim 4
Dependent Claim
51 words
A device according to claim 1, wherein the powdered silver has a particle size of 5 μm or less and the powdered silver content in the adhesive composition is 15% to 50% by volume based on the total volume of the epoxy resin, the novolak-type phenolic resin, and the powdered silver.
Claim 5
Dependent Claim
27 words
A device according to claim 1, wherein the adhesive composition further comprises at least one material selected from the group consisting of hardening accelerators and coupling agents.
Claim 6
Dependent Claim
17 words
A semiconductor device according to claim 1, wherein said epoxy resin has at least two epoxy groups.
Claim 7
Dependent Claim
123 words
A semiconductor device comprising a semiconductor element, the back main face of which is fixed to a supporting member with an adhesive layer formed by heat-curing an adhesive composition to bond the semiconductor element through its back main face to the supporting member, the adhesive composition comprising an epoxy resin, a novolak-type phenolic resin as a hardener, a solvent capable of dissolving both of said resins, and powdered silver, said adhesive layer being positioned between the back main face and the supporting member, the front main face of said semiconductor element carrying an electrode connected electrically to an electroconductive member through a fine lead wire, and said semiconductor element, said supporting member, and said lead wire being encapsulated with a resin packaging material.
Claim 8
Dependent Claim
123 words
A semiconductor device comprising a semiconductor element, the back main face of which is fixed to a supporting member with an adhesive layer formed by heat-curing an adhesive composition to bond the semiconductor element through its back main face to the supporting member, the adhesive composition comprising an epoxy resin, a novolak-type phenolic resin as a hardener, a solvent capable of dissolving both of said resins, and powdered silver, said adhesive layer being positioned between the back main face and the supporting member, the front main face of said semiconductor element carrying an electrode connected electrically to an electroconductive member through a fine lead wire, and said semiconductor element, said supporting member, and said lead wire being encapsulated with a resin packaging material.
Claim 9
Dependent Claim
27 words
A semiconductor device according to claim 6, wherein said resin composition includes at least one material selected from the group consisting of hardening accelerators and coupling agents.
Claim 10
Dependent Claim
142 words
A semiconductor device comprising a semiconductor element, the back main face of which is fixed to a supporting member with an adhesive layer formed by heat-curing an adhesive composition to bond the semiconductor element through its back main face to the supporting member, the adhesive composition comprising an epoxy resin, a novolak-type phenol resin as a hardener, a solvent capable of dissolving both of said resins, and powdered silver, the adhesive layer being positioned between the back main face and the supporting member, the front main face of said semiconductor element carrying an electrode connected electrically to an electroconductive member through a fine lead wire, the side faces of said semiconductor element being covered with the same material as that of said adhesive layer, and said semiconductor element, said supporting member, and said lead wire being encapsulated with a resin packaging material.
Claim 11
Dependent Claim
142 words
A semiconductor device comprising a semiconductor element, the back main face of which is fixed to a supporting member with an adhesive layer formed by heat-curing an adhesive composition to bond the semiconductor element through its back main face to the supporting member, the adhesive composition comprising an epoxy resin, a novolak-type phenol resin as a hardener, a solvent capable of dissolving both of said resins, and powdered silver, the adhesive layer being positioned between the back main face and the supporting member, the front main face of said semiconductor element carrying an electrode connected electrically to an electroconductive member through a fine lead wire, the side faces of said semiconductor element being covered with the same material as that of said adhesive layer, and said semiconductor element, said supporting member, and said lead wire being encapsulated with a resin packaging material.
Claim 12
Dependent Claim
27 words
A semiconductor device according to claim 8, wherein said resin composition includes at least one material selected from the group consisting of hardening accelerators and coupling agents.
Claim 13
Dependent Claim
147 words
A semiconductor device comprising a semiconductor element, the back main face of which is fixed to a supporting member with an adhesive layer formed by heat-curing an adhesive composition comprising an epoxy resin, a novolak-type phenolic resin as a hardener, a solvent capable of dissolving both of said resins, and a powdery filler, said adhesive composition acting to bond the semiconductor through its back main face to said supporting member, said adhesive layer being positioned between the back main face and the supporting member, the front main face of said semiconductor element carrying an electrode connected electrically to an electroconductive member through a fine lead wire, and said semiconductor element, said supporting member, and said lead wire being encapsulated with a resin packaging material, wherein the use of said adhesive composition prevents corrosion of said electrode caused by the adhesive bonding the element to the support member.
Claim 14
Dependent Claim
147 words
A semiconductor device comprising a semiconductor element, the back main face of which is fixed to a supporting member with an adhesive layer formed by heat-curing an adhesive composition comprising an epoxy resin, a novolak-type phenolic resin as a hardener, a solvent capable of dissolving both of said resins, and a powdery filler, said adhesive composition acting to bond the semiconductor through its back main face to said supporting member, said adhesive layer being positioned between the back main face and the supporting member, the front main face of said semiconductor element carrying an electrode connected electrically to an electroconductive member through a fine lead wire, and said semiconductor element, said supporting member, and said lead wire being encapsulated with a resin packaging material, wherein the use of said adhesive composition prevents corrosion of said electrode caused by the adhesive bonding the element to the support member.
Claim 15
Dependent Claim
14 words
A semiconductor device according to claim 10, wherein the powdery filler is powdered silver.
Claim 16
Dependent Claim
16 words
A semiconductor device according to claim 10, wherein said powdery filler is an electroconductive powdery filler.
Claim 17
Dependent Claim
16 words
A semiconductor device according to claim 10, wherein said powdery filler is an insulating powdery filler.
Claim 18
Dependent Claim
27 words
A semiconductor device according to claim 10, wherein said resin composition includes at least one material selected from the group consisting of hardening accelerators and coupling agents.
Claim 19
Dependent Claim
21 words
A semiconductor device according to claim 10, wherein the adhesive layer is extended to cover the sides of the semiconductor element.
Claim 20
Dependent Claim
26 words
A semiconductor device according to claim 10, wherein the adhesive layer is extended to cover the sides and the front main face of the semiconductor element.
Claim 21
Dependent Claim
14 words
A semiconductor device according to claim 10, wherein the electrode is made of aluminum.
Claim 22
Dependent Claim
14 words
A semiconductor device according to claim 11, wherein the electrode is made of aluminum.
Claim 23
Dependent Claim
32 words
A semiconductor device according to claim 6, 8 or 1, wherein the novolak-type phenol resin is a resin formed by the reaction of phenol or a phenol derivative with formaldehyde or p-formaldehyde.
Claim 24
Dependent Claim
41 words
A semiconductor device according to claim 6, 8 or 1, wherein the novolak-type phenolic resin is used in an amount to provide a ratio of the number of phenolic hydroxyl groups to the number of epoxy groups of 0.5 to 1.5/1.
Claim 25
Dependent Claim
37 words
A semiconductor device according to claim 6 or 8, wherein the electrode is made of aluminum, whereby corrosion of the aluminum due to the adhesive used to bond the semiconductor element to the support member is prevented.
Claim 26
Dependent Claim
41 words
A semiconductor device according to claim 19, wherein the epoxy resin is selected from the group consisting of diglycidyl ether of bisphenol A-type, diglycidyl ether of bisphenol F, vinylcyclohexane diepoxide, triglycidyl ether of p-aminophenol, and polyglycidyl ether of novolak-type phenolic resin.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-02-07 | 1992-08-08 | 1993-02-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-02-07 | 1996-08-08 | 1997-02-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-02-07 | 2000-08-08 | 2001-02-07 | $7700.00 | Window Closed / Lapsed |