Method and equipment for coating substrates by means of a plasma discharge using a system of magnets to confine the plasma

Claim 2

Method for coating continuously moving substrates by the deposition of compounds from the gas phase by means of a plasma discharge, produced by a negatively biased electrode, with a chemical reaction, a system of magnets for the generation of a magnetic trap which is a closed tunnel to constrict the plasma being disposed on one side of the substrate, wherein the substrate is one of the electrode and a member independent of the electrode and wherein the surface of the substrate that is to be treated is held at distance "S 1 " from the electrode, which is less than the dark-shape distance that arises under the given conditions of the process, where "S 1 " includes zero, and the magnetic trap is so adjusted, that it passes through the substrate and is a closed tunnel over the surface of the substrate that is to be coated in such a manner, that the chemical reaction is maintained in the constricted plasma on the surface of the substrate that is to be coated.

Claim 3

Method as defined in claim 1 for coating substrates that are moved over an electrode, said electrode being a stationary electrode, wherein the first surface of the substrate that faces the electrode is held at a distance "S 2 " from the electrode, which is less than the given dark-space distance under the specified process conditions, and that the magnetic trap is adjusted so that it passes through the substrate and is closed over the second surface of the substrate, which is averted from the electrode, in such a manner, that the chemical reaction is maintained in the constricted plasma on the side of the substrate averted from the electrode.

Claim 4

Method as defined in claim 1 for coating substrates with polymers, wherein polymerizable substances are supplied to the plasma continuously.

Claim 5

Method as defined in claim 1, wherein the electrode is held at a negative potential.

Claim 6

Chemical reactor for implementing the method of coating continuously moving substrates by the deposition of compounds from the gas phase by means of a plasma discharge, with an evacuatable reaction chamber with at least one feeding device for the reaction components, with a holding device for at least one substrate, with an electrode disposed in the vicinity of the substrate position for generating a plasma and, on the side of the electrode opposite to the substrate position, with a system of magnets with pole faces of opposite polarity for producing an in itself closed magnetic trap which is a closed tunnel, which starts out from the pole faces and passes through the electrode, wherein the holding device is disposed in such a spatial position relative to the electrode, that the first surface of the substrate, which faces the electrode, is at a distance "S 2 " form the electrode, which is less than the given dark-space distance under the specified process conditions, and the magnetic trap is adjusted, so that it passes through the substrate and is a closed tunnel over the second surface of the substrate, which is averted from the electrode, in such a manner, that the constricted plasma and the chemical reaction zone are on the side of the substrate averted from the electrode.

Claim 7

Chemical reactor for implementing the method of coating continuously moving substrates by the deposition of compounds from the gas phase by means of a plasma discharge, with an evacuatable reaction chamber with at least one feeding device for the reaction components, with a holding device for at least one substrate, with an electrode disposed in the vicinity of the substrate position for generating a plasma and, on the side of the electrode opposite to the substrate position, with a system of magnets with pole faces of opposite polarity for producing an in itself closed magnetic trap which is a closed tunnel, which starts out from the pole faces and passes through the electrode, wherein the holding device is disposed in such a spatial position relative to the electrode, that the first surface of the substrate, which faces the electrode, is at a distance "S 2 " form the electrode, which is less than the given dark-space distance under the specified process conditions, and the magnetic trap is adjusted, so that it passes through the substrate and is a closed tunnel over the second surface of the substrate, which is averted from the electrode, in such a manner, that the constricted plasma and the chemical reaction zone are on the side of the substrate averted from the electrode.

Claim 8

Equipment as defined in claim 5, wherein the holding device for the substrate comprises at least one guide roller, by means of which the substrate can be guided parallel to and over the electrode.

Claim 9

Equipment as defined in claim 6, wherein the holding device for the substrate comprises a hollow guide roller, which simultaneously is the electrode and in the hollow space or of which the system of magnets is accommodated.

Claim 10

Equipment for implementing the method of coating continuously moving substrates by the deposition of compounds from the gas phase by means of a plasma discharge comprising: an evacuatable reaction chamber with at least one feeding device for the reaction components; a holding device for at least one substrate, the holding device for the substrate comprising a hollow guide roller, which simultaneously is an electrode for generating a plasma; and a system of magnets disposed in a hollow space of the guide roller with pole faces of opposite polarity for producing an in itself closed magnetic trap, which starts out from the pole faces and passes through the electrode, the magnetic trap being adjusted so that it passes through the substrate and is closed over the surface of the substrate, which is averted from the electrode in such a manner that the constricted plasma and the chemical reaction zone are on the side of the substrate averted from the electrode.

Claim 11

Equipment for implementing the method of coating continuously moving substrates by the deposition of compounds from the gas phase by means of a plasma discharge comprising: an evacuatable reaction chamber with at least one feeding device for the reaction components; a holding device for at least one substrate, the holding device for the substrate comprising a hollow guide roller, which simultaneously is an electrode for generating a plasma; and a system of magnets disposed in a hollow space of the guide roller with pole faces of opposite polarity for producing an in itself closed magnetic trap, which starts out from the pole faces and passes through the electrode, the magnetic trap being adjusted so that it passes through the substrate and is closed over the surface of the substrate, which is averted from the electrode in such a manner that the constricted plasma and the chemical reaction zone are on the side of the substrate averted from the electrode.