Method and apparatus for handling semiconductor wafers

Claim 2

Apparatus for handling semiconductors wafers used for the production of integrated circuit structures which permits processing of both the top and bottom surfaces of the wafer which comprises: a) a retaining ring having engagement means thereon to permit said retaining ring to be engaged to transfer said wafer and said retaining ring from one processing station to another to perform one or more processing steps on one or more surfaces of said wafer; b) clip means carried by said retaining ring for yieldably engaging the end edges of said wafer leaving both the top and bottom surfaces of said wafer exposed for processing; c) tip means on said clip means having a groove therein to engage only the end edges of said wafer; d) means for activating said clip means to yieldably engage the end edges of said wafer after insertion of said wafer into said retaining ring; and e) an inner diameter on said retaining ring sufficiently larger than the outer diameter of said wafer to permit equal processing of both sides of said wafer without interference by shadowing from said retaining ring.

Claim 3

The apparatus of claim 1 wherein means are further provided for radially orienting a flat portion on said end edges on said wafer with respect to said engagement means on said retaining ring prior to inserting said wafer into said retaining ring.

Claim 4

The apparatus of claim 1 wherein said groove on said tip means has a curvature therein substantially the same as the radius of said wafer to distribute the force exerted by said clip means against said wafer.

Claim 5

The apparatus of claim 1 wherein said tip means is constructed of a material selected from the class consisting of a metal and a ceramic.

Claim 6

The apparatus of claim 4 wherein said tip means is a ceramic material.

Claim 7

The apparatus of claim 4 wherein both said retaining ring and said clip means, including said tip means thereon comprise electrically conductive materials to permit grounding said wafer by contacting said retaining ring to ground it.

Claim 8

The apparatus of claim 1 wherein said means for activating said clip means comprise means for moving said clip means and said tip means thereon into and out of engagement with the end edges of said wafer in a direction parallel to the plane of said wafer.

Claim 9

The apparatus of claim 7 wherein said means for activating said clips means further comprise biasing means which urge said clip means and said tip means thereon toward said wafer in a direction parallel to the plane of said wafer to engage the end edges of said wafer.

Claim 10

The apparatus of claim 7 which further includes storage means for removably storing a plurality of said retaining rings in a vertical stack.

Claim 11

The apparatus of claim 9 wherein means are provided in said storage means for radially orienting said wafer prior to said engagement of said wafer by one of said retaining rings.

Claim 12

The apparatus of claim 10 wherein said means for radially orienting said wafer includes a rotatable platform concentrically mounted in said storage means to receive said wafer and rotate it prior to engagement by one of said retaining rings.

Claim 15

The method of claim 12 wherein said step of engaging the end edges of said wafer further comprises moving said tip means into and out of engagement with the end edges of said wafer in a direction parallel to the plane of said wafer.

Claim 16

The process of claim 13 including the further step of releasing said wafer from said retaining ring upon completion of said processing steps.

Claim 17

The process of claim 13 including the further step of activating said yieldable means in said retaining ring to yieldably engage the end edges of said wafer after insertion of said wafer into said retaining ring.

Claim 18

The process of claim 13 including the further step of rotating said wafer to radially orient a flat portion on the end edge of said wafer with respect to one or more fixed points on said retaining ring prior to inserting said wafer into said retaining ring.

Claim 19

The process of claim 16 wherein said step of contacting said retaining ring to transfer said wafer and said retaining ring from one processing station to another further comprises engaging said one or more fixed points on said ring to which a flat side portion of said wafer is radially oriented.

Claim 20

Apparatus for handling semiconductors wafers used for the production of integrated circuit structures which permits processing of both the top and bottom surfaces of the wafer which comprises: a) a retaining ring having engagement means thereon to permit said retaining ring to be engaged to transfer said wafer and said retaining ring from one processing station to another to perform one or more processing steps on one or more surfaces of said wafer; b) means on said retaining ring for engaging the end edges of said wafer leaving both the top and bottom surfaces of said wafer exposed for processing; c) an inner diameter on said retaining means sufficiently larger than the outer diameter of said wafer to permit equal processing of both sides of said wafer without interference by shadowing from said retaining ring; (d) storage means for removably storing a plurality of said retaining means in a vertical stack; (e) a rotatable platform concentrically mounted within said storage means to receive said wafer and rotate it to radially orient said wafer prior to insertion of said wafer into said retaining ring and engagement of said wafer by said retaining ring; and (f) means connected to said platform for lowering said wafer into a position for engagement with a retaining ring stored in said vertical stack in said storage means.

Claim 21

Apparatus for handling semiconductors wafers used for the production of integrated circuit structures which permits processing of both the top and bottom surfaces of the wafer which comprises: a) a retaining ring having engagement means thereon to permit said retaining ring to be engaged to transfer said wafer and said retaining ring from one processing station to another to perform one or more processing steps on one or more surfaces of said wafer; b) means on said retaining ring for engaging the end edges of said wafer leaving both the top and bottom surfaces of said wafer exposed for processing; c) an inner diameter on said retaining means sufficiently larger than the outer diameter of said wafer to permit equal processing of both sides of said wafer without interference by shadowing from said retaining ring; (d) storage means for removably storing a plurality of said retaining means in a vertical stack; (e) a rotatable platform concentrically mounted within said storage means to receive said wafer and rotate it to radially orient said wafer prior to insertion of said wafer into said retaining ring and engagement of said wafer by said retaining ring; and (f) means connected to said platform for lowering said wafer into a position for engagement with a retaining ring stored in said vertical stack in said storage means.

Claim 22

The apparatus of claim 18 wherein said engagement means on said retaining ring which permit said wafer and said retaining ring to be engaged for transferring said retaining ring and said wafer from one processing station to another further comprises engagement means positioned at a fixed point on said ring to which a flat side portion of said wafer is radially oriented.

Claim 23

The apparatus of claim 18 wherein said apparatus further comprises remote means for engaging said engagement means on said retaining ring to permit said retaining ring and said wafer therein to be moved without contacting said wafer.

Claim 24

The apparatus of claim 20 wherein said storage means is further provided with means to lower said storage means with respect to said wafer once said wafer has been loaded into said retaining ring in said stack and said engagement means on said retaining ring have been engaged by said remote means to transfer said wafer and said retaining ring from one processing station to another.

Claim 25

Apparatus for handling semiconductors wafers used for the production of integrated circuit structures which permits processing of both the top and bottom surfaces of the wafer which comprises: a) a retaining ring having engagement means located at a particular position thereon to permit said retaining ring to be engaged to transfer said wafer and said retaining ring from one processing station to another to perform one or more processing steps on one or more surfaces of said wafer; b) clip means carried by said retaining ring for yieldably engaging the end edges of said wafer leaving both the top and bottom surfaces of said wafer exposed for processing; c) tip means on said clip means having a groove therein to engage only the end edges of said wafer; d) means for activating said clip means to yieldably engage the end edges of said wafer after insertion of said wafer into said retaining ring; and e) an inner diameter on said retaining ring sufficiently larger than the outer diameter of said wafer to permit equal processing of both sides of said wafer without interference by shadowing from said retaining ring.

Claim 26

Apparatus for handling semiconductors wafers used for the production of integrated circuit structures which permits processing of both the top and bottom surfaces of the wafer which comprises: a) a retaining ring having engagement means located at a particular position thereon to permit said retaining ring to be engaged to transfer said wafer and said retaining ring from one processing station to another to perform one or more processing steps on one or more surfaces of said wafer; b) clip means carried by said retaining ring for yieldably engaging the end edges of said wafer leaving both the top and bottom surfaces of said wafer exposed for processing; c) tip means on said clip means having a groove therein to engage only the end edges of said wafer; d) means for activating said clip means to yieldably engage the end edges of said wafer after insertion of said wafer into said retaining ring; and e) an inner diameter on said retaining ring sufficiently larger than the outer diameter of said wafer to permit equal processing of both sides of said wafer without interference by shadowing from said retaining ring.

Claim 27

Apparatus for handling semiconductors wafers used for the production of integrated circuit structures which leaves both the top and bottom surfaces of the wafer completely exposed for processing which comprises: a) a retaining ring having engagement means thereon to permit said retaining ring to be engaged to transfer said wafer and said retaining ring from one processing station to another to perform one or more processing steps on one or more surfaces of said wafer; b) clip means carried by said retaining ring for yieldably engaging the end edges of said wafer leaving both the top and bottom surfaces of said wafer exposed for processing; c) tip means on said clip means having a groove therein to engage only the end edges of said wafer; d) means for activating said clip means to yieldably engage the end edges of said wafer after insertion of said wafer into said retaining ring; and e) an inner diameter on said retaining ring sufficiently larger than the outer diameter of said wafer to leave both surfaces of said wafer completely open for processing without interference by shadowing from said retaining ring.

Claim 28

Apparatus for handling semiconductors wafers used for the production of integrated circuit structures which leaves both the top and bottom surfaces of the wafer completely exposed for processing which comprises: a) a retaining ring having engagement means thereon to permit said retaining ring to be engaged to transfer said wafer and said retaining ring from one processing station to another to perform one or more processing steps on one or more surfaces of said wafer; b) clip means carried by said retaining ring for yieldably engaging the end edges of said wafer leaving both the top and bottom surfaces of said wafer exposed for processing; c) tip means on said clip means having a groove therein to engage only the end edges of said wafer; d) means for activating said clip means to yieldably engage the end edges of said wafer after insertion of said wafer into said retaining ring; and e) an inner diameter on said retaining ring sufficiently larger than the outer diameter of said wafer to leave both surfaces of said wafer completely open for processing without interference by shadowing from said retaining ring.

Claim 29

Apparatus for handling semiconductors wafers used for the production of integrated circuit structures which permits processing of both the top and bottom surfaces of the wafer which comprises: a) a retaining ring having engagement means thereon to permit said retaining ring to be engaged to transfer said wafer and said retaining ring in and out of one processing station to perform one or more processing steps on one or more surfaces of said wafer; b) clip means carried by said retaining ring for yieldably engaging the end edges of said wafer leaving both the top and bottom surfaces of said wafer exposed for processing; c) tip means on said clip means having a groove therein to engage only the end edges of said wafer; d) means for activating said clip means to yieldably engage the end edges of said wafer after insertion of said wafer into said retaining ring; and e) an inner diameter on said retaining ring sufficiently larger than the outer diameter of said wafer to permit equal processing of both surfaces of said wafer without interference by shadowing from said retaining ring.

Claim 30

Apparatus for handling semiconductors wafers used for the production of integrated circuit structures which permits processing of both the top and bottom surfaces of the wafer which comprises: a) a retaining ring having engagement means thereon to permit said retaining ring to be engaged to transfer said wafer and said retaining ring in and out of one processing station to perform one or more processing steps on one or more surfaces of said wafer; b) clip means carried by said retaining ring for yieldably engaging the end edges of said wafer leaving both the top and bottom surfaces of said wafer exposed for processing; c) tip means on said clip means having a groove therein to engage only the end edges of said wafer; d) means for activating said clip means to yieldably engage the end edges of said wafer after insertion of said wafer into said retaining ring; and e) an inner diameter on said retaining ring sufficiently larger than the outer diameter of said wafer to permit equal processing of both surfaces of said wafer without interference by shadowing from said retaining ring.

Claim 31

Apparatus for handling semiconductors wafers used for the production of integrated circuit structures which leaves both the top and bottom surfaces of the wafer completely exposed for processing which comprises: a) a retaining ring having engagement means thereon to permit said retaining ring to be engaged to transfer said wafer and said retaining ring in and out of one processing station to perform one or more processing steps on one or more surfaces of said wafer; b) clip means carried by said retaining ring for yieldably engaging the end edges of said wafer leaving both the top and bottom surfaces of said wafer exposed for processing; c) tip means on said clip means having a groove therein to engage only the end edges of said wafer; d) means for activating said clip means to yieldably engage the end edges of said wafer after insertion of said wafer into said retaining ring; and e) an inner diameter on said retaining ring sufficiently larger than the outer diameter of said wafer to leave both surfaces of said wafer completely open for processing without interference by shadowing from said retaining ring.

Claim 32

Apparatus for handling semiconductors wafers used for the production of integrated circuit structures which leaves both the top and bottom surfaces of the wafer completely exposed for processing which comprises: a) a retaining ring having engagement means thereon to permit said retaining ring to be engaged to transfer said wafer and said retaining ring in and out of one processing station to perform one or more processing steps on one or more surfaces of said wafer; b) clip means carried by said retaining ring for yieldably engaging the end edges of said wafer leaving both the top and bottom surfaces of said wafer exposed for processing; c) tip means on said clip means having a groove therein to engage only the end edges of said wafer; d) means for activating said clip means to yieldably engage the end edges of said wafer after insertion of said wafer into said retaining ring; and e) an inner diameter on said retaining ring sufficiently larger than the outer diameter of said wafer to leave both surfaces of said wafer completely open for processing without interference by shadowing from said retaining ring.

Claim 33

The apparatus of claim 2 including a rotatable platform to receive said wafer and rotate it prior to engagement by said retaining ring.