Patent US5055321A successfully refreshed from Google Patents.
US5055321A
Expired / Lapsed
US
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Adhesive for electroless plating, printed circuit boards and method of producing the same
Assignee: Ibiden Co Ltd
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Filing: 1989-04-28
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Granted: 1991-10-08
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Expires: 2009-04-28
Abstract
Abstract An adhesive for electroless plating is formed by dispersing particular heat-resistant granules easily soluble in an oxidizing agent into a particular heat-resistant resin sparingly soluble in the oxidizing agent through a curing treatment. A printed circuit board is manufactured by using such an adhesive.
Inventors
- 👤 Ryo Enomoto
- 👤 Motoo Asai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 07:58
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4661; C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/2006; C23C18/2046; C23C18/2073; C23C18/208; C23C18/22; C23C18/24; C23C18/28; C23C18/30; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0373; C23C18/1601; C23C18/1633; C23C18/1646; C23C18/165; C23C18/1651; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/0212; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09563; H05K2203/00; H05K2203/07; H05K2203/0756; H05K2203/0773; H05K2203/0779; H05K2203/0786; H05K2203/0796; H05K2203/10; H05K2203/107; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0032; H05K3/0035; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/184; H05K3/40; H05K3/42; H05K3/425; H05K3/426; H05K3/465; Y; Y10; Y10T; Y10T428/00; Y10T428/28; Y10T428/2852; Y10T428/2857; Y10T442/00; Y10T442/20; Y10T442/2738
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
209 words
A method of producing a printed circuit board, which comprises: (a) forming a cured adhesive layer on a substrate, with the forming including dispersing cured heat-resistant particles easily soluble in an oxidizing agent in a heat-resistant resin exhibiting a sparingly soluble property to said oxidizing agent, said cured heat-resistant particles being selected from the group consisting of a mixture of a heat-resistant resin particles having an average particle size of 2-10 μm and heat-resistant resin fine particles having an average particle size of not more than 2 μm, false particles obtained by adhering at least one of heat-resistant resin fine powder having an average particle size of not more than 2 μm and inorganic fine powder having an average particle size of not more than 2 μm to surfaces of heat-resistant particles having an average particle size of 2-10 μm, and agglomerated particles obtained by agglomerating heat-resistant resin fine powder having an average particle size of not more than 2 μm into an average particle size of 2-10 μm, and mixtures thereof; (b) dissolving and removing heat-resistant particles existent on the surface portion of said adhesive layer with the use of an oxidizing agent whereby the surface portion is roughened; and (c) forming a conductor layer through electroless plating.
Claim 2
Independent Claim
209 words
A method of producing a printed circuit board, which comprises: (a) forming a cured adhesive layer on a substrate, with the forming including dispersing cured heat-resistant particles easily soluble in an oxidizing agent in a heat-resistant resin exhibiting a sparingly soluble property to said oxidizing agent, said cured heat-resistant particles being selected from the group consisting of a mixture of a heat-resistant resin particles having an average particle size of 2-10 μm and heat-resistant resin fine particles having an average particle size of not more than 2 μm, false particles obtained by adhering at least one of heat-resistant resin fine powder having an average particle size of not more than 2 μm and inorganic fine powder having an average particle size of not more than 2 μm to surfaces of heat-resistant particles having an average particle size of 2-10 μm, and agglomerated particles obtained by agglomerating heat-resistant resin fine powder having an average particle size of not more than 2 μm into an average particle size of 2-10 μm, and mixtures thereof; (b) dissolving and removing heat-resistant particles existent on the surface portion of said adhesive layer with the use of an oxidizing agent whereby the surface portion is roughened; and (c) forming a conductor layer through electroless plating.
Claim 3
Dependent Claim
15 words
The method according to claim 1, wherein said substrate is provided with a conductor layer.
Claim 4
Dependent Claim
23 words
The method according to claim 1, wherein said heat-resistant resin exhibiting a sparingly soluble property to said oxidizing agent is a photo-sensitive resin.
Claim 5
Dependent Claim
40 words
The method according to claim 1, wherein said heat-resistant resin exhibiting a sparingly soluble property to said oxidizing agent is at least one resin selected from the group consisting of epoxy resin, epoxy-modified polyimide resins, polyimide resins and phenolic resins.
Claim 6
Dependent Claim
42 words
The method according to claim 1, wherein said heat-resistant particles are compounded in an amount of 2-350 parts by weight per 100 parts by weight as a solid content of said heat-resistant resin having a sparingly soluble property to an oxidizing agent.
Claim 7
Dependent Claim
42 words
The method according to claim 5, wherein said heat-resistant particles are compounded in an amount of 5-200 parts by weight per 100 parts by weight as a solid content of said heat-resistant resin having a sparingly soluble property to an oxidizing agent.
Claim 8
Dependent Claim
27 words
The method according to claim 1, wherein said oxidizing agent is at least one substance selected from the group consisting of chromic acid, chromate, permanganate and ozone.
Claim 9
Dependent Claim
31 words
The method according to claim 1, wherein said electroless plated film is at least one film selected from electroless copper plated film, electroless nickel plated film and electroless gold plated film.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1994-10-07 | 1995-04-08 | 1995-10-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-10-07 | 1999-04-08 | 1999-10-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-10-07 | 2003-04-08 | 2003-10-08 | $7700.00 | Window Closed / Lapsed |