Patent US5139852A successfully refreshed from Google Patents.
US5139852A
Expired / Lapsed
US
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Low dielectric composite substrate
Assignee: International Business Machines Corp
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Filing: 1990-03-30
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Granted: 1992-08-18
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Expires: 2010-03-30
Abstract
Abstract The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.
Inventors
- 👤 Arnold I. Baise
- 👤 Ray M. Bryant
- 👤 Jon A. Casey
- 👤 Allen J. Dam
- 👤 Werner E. Dunkel
- 👤 James N. Humenik
- 👤 Anthony Mastreani
- 👤 Robert W. Nufer
- 👤 Charles H. Perry
- 👤 Salvatore J. Scilla
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 04:47
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; C; C04; C04B; C04B41/00; C04B41/45; C04B41/46; C04B41/48; C04B41/488; C04B41/49; C04B41/4905; C04B41/495; C04B41/4961; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4061; H10W70/01; H10W70/05; H10W70/67; H10W70/68; H10W70/685; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09581; H05K2203/00; H05K2203/11; H05K2203/1147; H05K2203/30; H05K2203/308; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/24926
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
103 words
A substrate for interconnecting electronic components comprising: at least one layer of non-porous dielectric material; non-porous metallurgical features of a first metallurgy disposed in said dielectric material comprising metallurgical patterns disposed on the surfaces of said at least one layer and a plurality of metallurgical vias extending between the surfaces of said at least one layer, and wherein a permeable collar is disposed between said via and said dielectric material; and a flexible polymeric material disposed in said permeable collar, wherein said flexible polymeric material is a polymeric material selected from the group consisting of polyimides, bismaleimides, acetylenes, epoxies, and thermally-stable silicon-containing polymers.
Claim 2
Dependent Claim
103 words
A substrate for interconnecting electronic components comprising: at least one layer of non-porous dielectric material; non-porous metallurgical features of a first metallurgy disposed in said dielectric material comprising metallurgical patterns disposed on the surfaces of said at least one layer and a plurality of metallurgical vias extending between the surfaces of said at least one layer, and wherein a permeable collar is disposed between said via and said dielectric material; and a flexible polymeric material disposed in said permeable collar, wherein said flexible polymeric material is a polymeric material selected from the group consisting of polyimides, bismaleimides, acetylenes, epoxies, and thermally-stable silicon-containing polymers.
Claim 3
Dependent Claim
14 words
The substrate of claim 1 wherein said permeable collar comprises a uniform permeable void.
Claim 4
Dependent Claim
16 words
The substrate of claim 1 wherein said permeable collar comprises a second metallurgy having permeable pores.
Claim 5
Dependent Claim
26 words
The substrate of claim 3, wherein said first metallurgy comprises a pure metal and wherein said second metallurgy comprises said first metal and a sintering retardant.
Claim 6
Dependent Claim
13 words
The substrate of claim 1, wherein said first metallurgy comprises a pure metal.
Claim 7
Dependent Claim
23 words
The substrate of claim 1, wherein said flexible material is thermally stable to temperatures sufficient to effect interconnection of components to said substrate.
Claim 8
Dependent Claim
15 words
The substrate of claim 1, wherein said dielectric material comprises at least a crystallizable glass.
Claim 9
Dependent Claim
16 words
The substrate of claim 7, wherein said crystallizable glass has cordierite as its principle crystalline phase.
Claim 10
Dependent Claim
30 words
The substrate of claim 1, wherein said first metallurgy comprises a metal-based metallurgy, said metal being selected from the group comprising copper, aluminum, silver, gold, platinum, palladium and alloys thereof.
Claim 11
Dependent Claim
25 words
The substrate of claim 4, wherein said first metallurgy comprises one of the group comprising copper, silver, gold, platinum, palladium and aluminum and alloys thereof.
Claim 12
Dependent Claim
54 words
A structure for interconnection vias in a multilayer substrate having a pattern of via holes thereon comprising: a conductive, non-porous first via material disposed in said holes and having a diameter which is less than the diameter of said holes; and a porous second via material disposed between first via material and the substrate.
Claim 13
Dependent Claim
54 words
A structure for interconnection vias in a multilayer substrate having a pattern of via holes thereon comprising: a conductive, non-porous first via material disposed in said holes and having a diameter which is less than the diameter of said holes; and a porous second via material disposed between first via material and the substrate.
Claim 14
Dependent Claim
40 words
The structure of claim 11, further comprising a polymeric material disposed in the pores of said second material, wherein said polymeric material is a polymeric material selected from the group consisting of polyimides, bismaleimides, acetylenes, epoxies, and thermally-stable silicon-containing polymers.
Claim 15
Dependent Claim
11 words
The structure of claim 12, wherein said polymeric material is conductive.
Claim 16
Dependent Claim
14 words
The structure of claim 11, wherein said first via material comprises a pure metal.
Claim 17
Dependent Claim
21 words
The structure of claim 11, wherein said second via material comprises a combination of said first via material and an oxide.
References Cited (Backward Citations)
US4861646A
Cited
US4880684A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-08-18 | 1996-02-17 | 1996-08-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-08-18 | 2000-02-17 | 2000-08-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-08-18 | 2004-02-17 | 2004-08-18 | $7700.00 | Window Closed / Lapsed |