Tape automated bonding packaged semiconductor device incorporating a heat sink

Claim 2

A packaged semiconductor device comprising: an insulating film having opposed first and second surfaces and an opening; a semiconductor chip having opposed first and second surfaces disposed in said opening of said insulating film and including a plurality of electrodes on the first surface of said chip; a plurality of leads, each having first and second ends, the first ends being connected to corresponding electrodes of said semiconductor chip, said plurality of leads being supported on the first surface of said insulating film; plate-shaped heat radiating means disposed opposite and spaced from the first surface of said semiconductor chip; and a resin package body encapsulating said semiconductor chip, disposed between and contacting the first surface of said semiconductor chip and said heat radiating means, separating and isolating said semiconductor chip from said heat radiating means, leaving the second ends of said plurality of leads extending outwardly from said package body, and partially encapsulating said heat radiating means with part of said heat radiating means externally exposed wherein said heat radiating means has a higher heat conductivity than said resin package body.

Claim 3

A packaged semiconductor device according to claim 1 wherein said heat radiating means is smaller than said package body.

Claim 4

A packaged semiconductor device according to claim 2 wherein said package body has a thickness and the thickness of a portion of said package body positioned on a first side of said insulating film is substantially the same as the thickness of a portion of the package body on a second side of said insulating film.

Claim 5

A packaged semiconductor device according to claim 3 wherein said heat radiating means is disposed on the first side of said insulating film and said package body extends in thickness beyond said heat radiating means on the first side of said insulating film.

Claim 6

A packaged semiconductor device according to claim 1 further comprising a semiconductor chip support member secured to the second surface of said semiconductor chip and having a peripheral portion secured to the second surface of said insulating film.

Claim 7

A packaged semiconductor device according to claim 5 wherein said semiconductor chip support member is electrically conductive.

Claim 8

A packaged semiconductor device comprising: an insulating film having opposed first and second surfaces and an opening; a semiconductor chip having opposed first and second surfaces disposed in said opening of said insulating film and including a plurality of electrodes on the first surface of said chip; a plurality of leads, each having first and second ends, the first ends being connected to corresponding electrodes of said semiconductor chip, said plurality of leads being supported on the first surface of said insulating film; metal heat radiating means disposed opposite and spaced from the first surface of said semiconductor chip; and a resin package body encapsulating said semiconductor chip, disposed between and contacting the first surface of said semiconductor chip and said heat radiating means, separating and isolating said semiconductor chip from said heat radiating means, leaving the second ends of said plurality of leads extending outwardly from said package body and partially encapsulating said heat radiating means with part of said heat radiating means externally exposed.

Claim 9

A packaged semiconductor device comprising: an insulating film having opposed first and second surfaces and an opening; a semiconductor chip having opposed first and second surfaces disposed in said opening of said insulating film and including a plurality of electrodes on the first surface of said chip; a plurality of leads, each having first and second ends, the first ends being connected to corresponding electrodes of said semiconductor chip, said plurality of leads being supported on the first surface of said insulating film; metal heat radiating means disposed opposite and spaced from the first surface of said semiconductor chip; and a resin package body encapsulating said semiconductor chip, disposed between and contacting the first surface of said semiconductor chip and said heat radiating means, separating and isolating said semiconductor chip from said heat radiating means, leaving the second ends of said plurality of leads extending outwardly from said package body and partially encapsulating said heat radiating means with part of said heat radiating means externally exposed.

Claim 10

A packaged semiconductor device according to claim 7, wherein said metal heat radiating means is copper.

Claim 11

A packaged semiconductor device comprising: an insulating film having opposed first and second surfaces and an opening; a semiconductor chip having opposed first and second surfaces disposed in said opening of said insulating film and including a plurality of electrodes on the first surface of said chip; a plurality of leads, each having first and second ends, the first ends being connected to corresponding electrodes of said semiconductor chip, said plurality of leads being supported on the first surface of said insulating film; plate-shaped heat radiating means having substantially the same coefficient of thermal expansion as said semiconductor chip disposed opposite and spaced from the first surface of said semiconductor chip; and a resin package body encapsulating said semiconductor chip, disposed between and contacting the first surface of said semiconductor chip and said heating radiating means, separating and isolating said semiconductor chip from said heat radiating means, leaving the second ends of said plurality of leads extending outwardly from said package body, and partially encapsulating said heat radiating means with part of said heat radiating means externally exposed wherein said heat radiating means is smaller than said resin package body and has a higher heat conductivity than said resin package body.

Claim 12

A packaged semiconductor device comprising: an insulating film having opposed first and second surfaces and an opening; a semiconductor chip having opposed first and second surfaces disposed in said opening of said insulating film and including a plurality of electrodes on the first surface of said chip; a plurality of leads, each having first and second ends, the first ends being connected to corresponding electrodes of said semiconductor chip, said plurality of leads being supported on the first surface of said insulating film; plate-shaped heat radiating means having substantially the same coefficient of thermal expansion as said semiconductor chip disposed opposite and spaced from the first surface of said semiconductor chip; and a resin package body encapsulating said semiconductor chip, disposed between and contacting the first surface of said semiconductor chip and said heating radiating means, separating and isolating said semiconductor chip from said heat radiating means, leaving the second ends of said plurality of leads extending outwardly from said package body, and partially encapsulating said heat radiating means with part of said heat radiating means externally exposed wherein said heat radiating means is smaller than said resin package body and has a higher heat conductivity than said resin package body.

Claim 13

A packaged semiconductor device according to claim 9 wherein said semiconductor chip is silicon and said heat radiating means is aluminum nitride.

Claim 14

A packaged semiconductor device according to claim 9 wherein said heat radiating means and semiconductor chip have substantially the same thicknesses.

Claim 15

A packaged semiconductor device comprising: an insulating film having opposed first and second surfaces and an opening; a semiconductor chip having opposed first and second surfaces disposed in said opening of said insulating film and including a plurality of electrodes on the first surface of said chip; a plurality of leads, each having first and second ends, the first ends being connected to corresponding electrodes of said semiconductor chip, said plurality of leads being supported on the first surface of said insulating film; plate-shaped heat radiating means disposed opposite and spaced from the first surface of said semiconductor chip; an electrically insulating adhesive directly contacting and adhering said heat radiating means to said semiconductor chip; and a resin package body encapsulating said semiconductor chip, disposed between the first surface of said semiconductor chip and said heat radiating means, leaving the second ends of said plurality of leads extending outwardly from said package body and partially encapsulating said heat radiating means with part of said heat radiating means externally exposed wherein said heat radiating means has a higher heat conductivity than said resin package body.

Claim 16

A packaged semiconductor device comprising: an insulating film having opposed first and second surfaces and an opening; a semiconductor chip having opposed first and second surfaces disposed in said opening of said insulating film and including a plurality of electrodes on the first surface of said chip; a plurality of leads, each having first and second ends, the first ends being connected to corresponding electrodes of said semiconductor chip, said plurality of leads being supported on the first surface of said insulating film; plate-shaped heat radiating means disposed opposite and spaced from the first surface of said semiconductor chip; an electrically insulating adhesive directly contacting and adhering said heat radiating means to said semiconductor chip; and a resin package body encapsulating said semiconductor chip, disposed between the first surface of said semiconductor chip and said heat radiating means, leaving the second ends of said plurality of leads extending outwardly from said package body and partially encapsulating said heat radiating means with part of said heat radiating means externally exposed wherein said heat radiating means has a higher heat conductivity than said resin package body.

Claim 17

A packaged semiconductor device according to claim 12 wherein said adhesive is flexible.

Claim 18

A packaged semiconductor device according to claim 13 wherein said adhesive is a resin.

Claim 19

A packaged semiconductor device according to claim 14 wherein said adhesive is a silicone resin.

Claim 20

A packaged semiconductor device comprising: an insulating film having opposed first and second surfaces and an opening; a semiconductor chip having opposed first and second surfaces disposed in said opening of said insulating film and including a plurality of electrodes on the first surface of said chip; a plurality of leads, each having first and second ends, the first ends being connected to corresponding electrodes of said semiconductor chip, said plurality of leads being supported on the first surface of said insulating film; plate-shaped heat radiating means disposed opposite and spaced from the first surface of said semiconductor chip; an electrically insulating resin adhesive containing a high thermal conductivity filler adhering said heat radiating means to said semiconductor chip; and a resin package body encapsulating said semiconductor chip, disposed between the first surface of said semiconductor chip and said heat radiating means, leaving the second ends of said plurality of leads extending outwardly from said package body and partially encapsulating said heat radiating means with part of said heat radiating means externally exposed wherein said heat radiating means has a higher heat conductivity than said resin package body.

Claim 21

A packaged semiconductor device comprising: an insulating film having opposed first and second surfaces and an opening; a semiconductor chip having opposed first and second surfaces disposed in said opening of said insulating film and including a plurality of electrodes on the first surface of said chip; a plurality of leads, each having first and second ends, the first ends being connected to corresponding electrodes of said semiconductor chip, said plurality of leads being supported on the first surface of said insulating film; plate-shaped heat radiating means disposed opposite and spaced from the first surface of said semiconductor chip; an electrically insulating resin adhesive containing a high thermal conductivity filler adhering said heat radiating means to said semiconductor chip; and a resin package body encapsulating said semiconductor chip, disposed between the first surface of said semiconductor chip and said heat radiating means, leaving the second ends of said plurality of leads extending outwardly from said package body and partially encapsulating said heat radiating means with part of said heat radiating means externally exposed wherein said heat radiating means has a higher heat conductivity than said resin package body.

Claim 22

A packaged semiconductor device according to claim 16 wherein said filler is silicon carbide.

Claim 23

A packaged semiconductor device comprising: an insulating film having opposed first and second surfaces and an opening; a semiconductor chip having opposed first and second surfaces disposed in said opening of said insulating film and including a plurality of electrodes on the first surface of said chip; a plurality of leads, each having first and second ends, the first ends being connected to corresponding electrodes of said semiconductor chip, said plurality of leads being supported on the first surface of said insulating film; plate-shaped heat radiating means disposed opposite and spaced from the first surface of said semiconductor chip; and a resin package body encapsulating said semiconductor chip, disposed between the first surface of said semiconductor chip and said heat radiating means, leaving the second ends of said plurality of leads extending outwardly from said package body and partially encapsulating said heat radiating means with part of said heat radiating means externally exposed including means for improving adhesion between said heat radiating means and said resin package body, wherein said heat radiating means has a higher heat conductivity than said resin package body and said heat radiating means is smaller than said resin package body.

Claim 24

A packaged semiconductor device comprising: an insulating film having opposed first and second surfaces and an opening; a semiconductor chip having opposed first and second surfaces disposed in said opening of said insulating film and including a plurality of electrodes on the first surface of said chip; a plurality of leads, each having first and second ends, the first ends being connected to corresponding electrodes of said semiconductor chip, said plurality of leads being supported on the first surface of said insulating film; plate-shaped heat radiating means disposed opposite and spaced from the first surface of said semiconductor chip; and a resin package body encapsulating said semiconductor chip, disposed between the first surface of said semiconductor chip and said heat radiating means, leaving the second ends of said plurality of leads extending outwardly from said package body and partially encapsulating said heat radiating means with part of said heat radiating means externally exposed including means for improving adhesion between said heat radiating means and said resin package body, wherein said heat radiating means has a higher heat conductivity than said resin package body and said heat radiating means is smaller than said resin package body.

Claim 25

A packaged semiconductor device according to claim 18, wherein said means for improving adhesion comprises a recess in said heat radiating means.

Claim 26

A packaged semiconductor device according to claim 18, wherein said means for improving adhesion comprises a projection on said heat radiating means.

Claim 27

A packaged semiconductor device according to claim 18, wherein said means for improving adhesion comprises a through hole in said heat radiating means.

Claim 28

A packaged semiconductor device according to claim 18, wherein said means for improving adhesion comprises a flange formed on said heat radiating means.

Claim 29

A packaged semiconductor device according to claim 22, wherein said flange includes through holes.