Patent US5264010A successfully refreshed from Google Patents.
US5264010A
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Compositions and methods for polishing and planarizing surfaces
Assignee: DuPont Electronic Materials Holding Inc
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Filing: 1992-04-27
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Granted: 1993-11-23
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Expires: 2012-04-27
Abstract
Abstract An abrasive composition for use in polishing or planarizing the surface of a work piece is provided comprising about 30 to 50 percent of cerium oxide; about 8 to about 20 percent of fumed silica and about 15 to about 45 percent of precipitated silica. Methods using the composition to polish or planarize the surfaces of work pieces, as well as products produced by such methods, are also provided.
Inventors
- 👤 Gregory Brancaleoni
- 👤 Elmer W. Jensen
- 👤 John V. H. Roberts
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 18:41
CPC Classifications
B; B24; B24D; B24D3/00; C; C09; C09G; C09G1/00; C09G1/02; B24D3/34; B24D3/346; C09C; C09C1/00; C09K; C09K3/00; C09K3/14
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
44 words
An abrasive composition for use in polishing or planarizing the surface of a work piece comprising about 30 to about 50 percent of cerium oxide; about 8 to about 20 percent of fumed silica and about 15 to about 45 percent of precipitated silica.
Claim 2
Dependent Claim
44 words
An abrasive composition for use in polishing or planarizing the surface of a work piece comprising about 30 to about 50 percent of cerium oxide; about 8 to about 20 percent of fumed silica and about 15 to about 45 percent of precipitated silica.
Claim 3
Dependent Claim
32 words
A composition as in claim 1 comprising about 42.5 to about 48.0 percent cerium oxide, about 17 to about 19 percent fumed silica and about 35 to about 39 percent precipitated silica.
Claim 4
Dependent Claim
29 words
A composition as in claim 1, comprising about 45 percent of the cerium oxide; about 18% percent of the fumed silica; and about 37 percent of the precipitated silica.
Claim 5
Dependent Claim
55 words
A composition as in claim 1, 2 or 3, wherein the cerium oxide has a particle size of about nm to about 2,000 nm, the fumed silica has a particle size of about 10 nm to about 1,200 nm and the precipitated silica has a particle size of about 25 nm to about 4,000 nm.
Claim 6
Dependent Claim
56 words
A composition as in claim 1, 2 or 3, wherein the cerium oxide has a particle size of about 100 nm to about 500 nm, the fumed silica has a particle size of about 7 nm to about 40 nm and the precipitated silica has a particle size of about 50 nm to about 2,000 nm.
Claim 7
Dependent Claim
56 words
A composition as in claim 1, 2 or 3, wherein the cerium oxide has a particle size of about 100 nm to about 300 nm, the fumed silica has a particle size of about 10 nm to about 30 nm and the precipitated silica has a particle size of about 100 nm to about 300 nm.
Claim 8
Dependent Claim
27 words
An aqueous slurry for polishing or planarizing a work piece comprising water and about 5 to about 20 weight percent of the abrasive composition of claim 1.
Claim 9
Dependent Claim
54 words
An aqueous slurry as in claim 7, wherein the cerium oxide has a particle size of about 100 nm to about 2,000 nm, the fumed silica has a particle size of about 10 nm to about 1,200 nm and the precipitated silica has a particle size of about 25 nm to about 4,000 nm.
Claim 10
Dependent Claim
18 words
An aqueous slurry as in claim 8, further comprising about 0.01 to about 2.0 percent of a surfactant.
Claim 11
Dependent Claim
28 words
An aqueous slurry as in claim 9, wherein the surfactant is selected from the group consisting of non-ionic surfactants, anionic surfactants, cationic surfactants, amphoteric surfactants and mixtures thereof.
Claim 12
Dependent Claim
57 words
An aqueous slurry as in claim 10, wherein the surfactant is selected from the group consisting of octylphenylethyleneoxide, nonylphenylethyleneoxide, octylphenoxypolyethoxyethanol, polyoxyethylene (10) octylphenol ether, nonyl phenol polyether, polyoxyethylene (20) sorbitan monooleate, poly(oxy-1,2-ethanediyl)alpha(nonylphenyl)omega-hydroxy, aliphatic ethoxylates, salts of carboxylic acid polyamine amides, alkylammonium salts of polymers having anionic or ionic character, polycarboxylic acids, acrylic acid copolymers and mixtures thereof.
Claim 13
Dependent Claim
12 words
An aqueous slurry as in claim 11, wherein the surfactant is octylphenoxypolyethoxyethanol.
Claim 14
Dependent Claim
27 words
An aqueous slurry as in claim 8, further comprising an acidic or basic material to maintain the pH of the composition at about 4 to about 12.
Claim 15
Dependent Claim
22 words
An aqueous slurry as in claim 13, wherein the acidic or basic material maintains the pH at about 6 to about 11.4.
Claim 16
Dependent Claim
44 words
An aqueous slurry as in claim 13, wherein the acidic material is selected from the group consisting of hydrochloric acid, nitric acid, phosphoric acid and sulfuric acid, and the basic material is selected from the group consisting of potassium hydroxide, ammonium hydroxide and ethanolamine.
Claim 17
Dependent Claim
26 words
An aqueous slurry for polishing or planarizing a work piece comprising water and about 10 to about 16 percent of the abrasive composition of claim 2.
Claim 18
Dependent Claim
54 words
An aqueous slurry as in claim 16 wherein the cerium oxide has a particle size of about 100 nm to about 500 nm, the fumed silica has a particle size of about 7 nm to about 40 nm and the precipitated silica has a particle size of about 50 nm to about 2,000 nm.
Claim 19
Dependent Claim
27 words
An aqueous slurry for polishing or planarizing a work piece comprising water and about 10 to about 16% by weight of the abrasive composition of claim 3.
Claim 20
Dependent Claim
54 words
An aqueous slurry as in claim 18 wherein the cerium oxide has a particle size of about 100 nm to about 300 nm, the fumed silica has a particle size of about 10 nm to about 30 nm and the precipitated silica has a particle size of about 100 nm to about 300 nm.
Claim 21
Dependent Claim
30 words
An aqueous slurry as in claim 19 further comprising about 0.01 to about 2.0 percent of a surfactant selected from the group consisting of octylphenylethyleneoxide, nonylphenylethyleneoxide, octylphenoxypolyethoxyethanol and mixtures thereof.
Claim 22
Independent Claim
68 words
A method of polishing or planarizing the surface of a work piece comprising: (a) applying the aqueous slurry of any one of claims 7 through 20 to a surface of the work piece to be polished or planarized; and (b) polishing or planarizing the surface of the work piece by mechanically and chemically causing the aqueous slurry to abrade the surface of the work piece to an extent.
Claim 23
Dependent Claim
44 words
A method as in claim 21 comprising applying the aqueous composition to a pad and then causing the pad to be sufficiently proximate the surface of the work piece at a pressure and for a time sufficient to polish or planarize the work piece.
Claim 24
Dependent Claim
47 words
A method as in claim 22 wherein the work piece is a semiconductor wafer having regions of relatively less and more electronic device integration density, the surface of the wafer having a plurality of steps and a plurality of gaps between at least some of the steps.
Claim 25
Dependent Claim
60 words
A method as in claim 23 wherein the surface of the wafer has a planar level above which no work piece material is desired and below which there exists electronic components which are desirably defect-free, the method further comprising planarizing the surface of the wafer to the planar level without substantially adverse defects in the wafer below the planar level.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-11-22 | 1997-05-24 | 1997-11-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-11-22 | 2001-05-24 | 2001-11-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-11-22 | 2005-05-24 | 2005-11-23 | $7700.00 | Window Closed / Lapsed |