Patent FR1080684A successfully refreshed from Google Patents.
Patent US5354490A successfully refreshed from Google Patents.
US5354490A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Slurries for chemical mechanically polishing copper containing metal layers
Assignee: Micron Technology Inc
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Filing: 1993-03-29
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Granted: 1994-10-11
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Expires: 2013-03-29
Abstract
Abstract A semiconductor processing method of chemical mechanical polishing a predominately copper containing metal layer on a semiconductor substrate includes, a) providing a chemical mechanical polishing slurry comprising H 2 0, a solid abrasive material, and a third component selected from the group consisting of HNO 3 , H 2 SO 4 , and AgNO 3 or mixtures thereof; and b) chemical mechanical polishing a predominately copper containing metal layer on a semiconductor substrate with the slurry. Such slurry also constitutes part of the invention. Such slurry may also contain an additional oxidant selected from the group consisting of H 2 0 2 , HOCl, KOCl, KMnO 4 and CH 3 COOH or mixtures thereof to form a copper oxide passivating-type layer at the copper surface.
Inventors
- 👤 Chris C. Yu
- 👤 Trung T. Doan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 08:11
CPC Classifications
H; H10; H10P; H10P52/00; H10P52/40; H10P52/403
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
46 words
A chemical mechanical polishing slurry comprising: a liquid semiconductor processing chemical-mechanical polishing slurry having suspended solids, the slurry comprising AgNO 3 at from about 2% to 15% by volume, H 2 O 2 , H 2 O, and the suspended solids comprising a solid abrasive material.
Claim 2
Dependent Claim
46 words
A chemical mechanical polishing slurry comprising: a liquid semiconductor processing chemical-mechanical polishing slurry having suspended solids, the slurry comprising AgNO 3 at from about 2% to 15% by volume, H 2 O 2 , H 2 O, and the suspended solids comprising a solid abrasive material.
Claim 3
Dependent Claim
42 words
A chemical mechanical polishing slurry comprising: a liquid semiconductor processing chemical-mechanical polishing slurry having suspended solids, the slurry comprising AgNO 3 at from about 2% to 15% by volume, HOCl, H 2 O, and the suspended solids comprising a solid abrasive material.
Claim 4
Dependent Claim
42 words
A chemical mechanical polishing slurry comprising: a liquid semiconductor processing chemical-mechanical polishing slurry having suspended solids, the slurry comprising AgNO 3 at from about 2% to 15% by volume, HOCl, H 2 O, and the suspended solids comprising a solid abrasive material.
Claim 5
Dependent Claim
42 words
A chemical mechanical polishing slurry comprising: a liquid semiconductor processing chemical-mechanical polishing slurry having suspended solids, the slurry comprising AgNO 3 at from about 2% to 15% by volume, KOCl, H 2 O, and the suspended solids comprising a solid abrasive material.
Claim 6
Dependent Claim
42 words
A chemical mechanical polishing slurry comprising: a liquid semiconductor processing chemical-mechanical polishing slurry having suspended solids, the slurry comprising AgNO 3 at from about 2% to 15% by volume, KOCl, H 2 O, and the suspended solids comprising a solid abrasive material.
Claim 7
Dependent Claim
44 words
A chemical mechanical polishing slurry comprising: a liquid semiconductor processing chemical-mechanical polishing slurry having suspended solids, the slurry comprising AgNO 3 at from about 2% to 15% by volume, KMnO 4 , H 2 O, and the suspended solids comprising a solid abrasive material.
Claim 8
Dependent Claim
44 words
A chemical mechanical polishing slurry comprising: a liquid semiconductor processing chemical-mechanical polishing slurry having suspended solids, the slurry comprising AgNO 3 at from about 2% to 15% by volume, KMnO 4 , H 2 O, and the suspended solids comprising a solid abrasive material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-10-10 | 1998-04-11 | 1998-10-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-10-10 | 2002-04-11 | 2002-10-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-10-10 | 2006-04-11 | 2006-10-11 | $7700.00 | Window Closed / Lapsed |