Patent US5355283A successfully refreshed from Google Patents.
US5355283A
Expired / Lapsed
US
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Ball grid array with via interconnection
Assignee: Teijin Ltd
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Filing: 1993-04-14
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Granted: 1994-10-11
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Expires: 2013-04-14
Abstract
Abstract A ball grid array is formed by mounting and electrically connecting one or more electronic devices to a substrate in which vias are formed to interconnect electrically conductive traces formed in a surface of the substrate to solder ball pads formed at an opposite surface of the substrate. The vias are formed by mechanical or laser drilling. Solder balls are formed on each of the pads and are reflow-attached to, for instance, a printed circuit board. The electronic components can include one or more integrated circuit chips, as well as passive components. The electronic components are attached to the substrate using wirebonding, TAB or flip chip connection. An encapsulating material is applied to encapsulate the electronic devices.
Inventors
- 👤 Robert C. Marrs
- 👤 Tadashi Hirakawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 20:05
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W90/00; H10W90/701; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
159 words
A packaged integrated circuit, comprising: a substrate having first and second opposed surfaces, electrically conductive first traces being formed on the first surface of the substrate; a series of electrically conductive pads extending across a portion of the substrate opposite the first surface of the substrate; a series of vias formed in the substrate, each via extending to one of said pads; electrically conductive plating material on sidewalls of said vias in electrical contact with selected ones of said first traces and with selected ones of said pads; an electronic device attached to the first surface of the substrate; means for making electrical connection between the electronic device and at least one of the first traces on the substrate; and encapsulant formed around the electronic device so as to protect the electronic device, the encapsulant covering at least a portion of the first surface of the substrate, filling said vias and extending against a via-facing surface of said pads.
Claim 2
Dependent Claim
159 words
A packaged integrated circuit, comprising: a substrate having first and second opposed surfaces, electrically conductive first traces being formed on the first surface of the substrate; a series of electrically conductive pads extending across a portion of the substrate opposite the first surface of the substrate; a series of vias formed in the substrate, each via extending to one of said pads; electrically conductive plating material on sidewalls of said vias in electrical contact with selected ones of said first traces and with selected ones of said pads; an electronic device attached to the first surface of the substrate; means for making electrical connection between the electronic device and at least one of the first traces on the substrate; and encapsulant formed around the electronic device so as to protect the electronic device, the encapsulant covering at least a portion of the first surface of the substrate, filling said vias and extending against a via-facing surface of said pads.
Claim 3
Dependent Claim
25 words
The packaged integrated circuit of claim 1, wherein solder balls are attached to pads at a position juxtaposed to the second surface of the substrate.
Claim 4
Dependent Claim
19 words
The packaged integrated circuit of claim 1, wherein said vias are in the form of an inverted truncated cone.
Claim 5
Dependent Claim
17 words
The packaged integrated circuit of claim 1, wherein said vias have tapered sidewalls converging toward said pads.
Claim 6
Dependent Claim
15 words
The packaged integrated circuit of claim 1, wherein the vias are formed by laser drilling.
Claim 7
Dependent Claim
14 words
The packaged integrated circuit of claim 5, wherein the laser is an excimer laser.
Claim 8
Dependent Claim
19 words
The packaged integrated circuit of claim 1, wherein electrically non-conductive portions of the substrate are made of organic material.
Claim 9
Dependent Claim
15 words
The packaged integrated circuit of claim 7, wherein the organic material includes organic reinforcement fibers.
Claim 10
Dependent Claim
14 words
The packaged integrated circuit of claim 8, where the reinforcement fibers are aramid fibers.
Claim 11
Independent Claim
149 words
A method of forming a package integrated circuit comprising the steps of: fabricating a substrate having a first surface and an opposed second surface; forming a series of electrically conductive first traces on said first surface; forming a series of electrically conductive pads extending across a portion of the substrate opposite to said first surface; then forming a series of vias through said substrate to a via-facing surface of the pads; depositing a conductive plating in said vias and extending from selected ones of said first traces to selected ones of said pads; attaching an electronic device to said first surface; electrically connecting the electronic device to said first traces; and encapsulating the electronic device with an electrically insulating encapsulant so as to protect the electronic device, the encapsulant covering at least part of said first surface, filling said vias and extending against said via-facing surface of said pads.
Claim 12
Independent Claim
149 words
A method of forming a package integrated circuit comprising the steps of: fabricating a substrate having a first surface and an opposed second surface; forming a series of electrically conductive first traces on said first surface; forming a series of electrically conductive pads extending across a portion of the substrate opposite to said first surface; then forming a series of vias through said substrate to a via-facing surface of the pads; depositing a conductive plating in said vias and extending from selected ones of said first traces to selected ones of said pads; attaching an electronic device to said first surface; electrically connecting the electronic device to said first traces; and encapsulating the electronic device with an electrically insulating encapsulant so as to protect the electronic device, the encapsulant covering at least part of said first surface, filling said vias and extending against said via-facing surface of said pads.
Claim 13
Dependent Claim
26 words
A method as in claim 10, further comprising forming a solder ball on a surface of each of said pads which faces away from the vias.
Claim 14
Dependent Claim
25 words
A method as in claim 10, wherein all first traces on the first surface and the plating in said vias are covered by the encapsulant.
Claim 15
Dependent Claim
21 words
A method as in claim 10, wherein vias are formed by laser drilling down to said via-facing surface of said pads.
Claim 16
Dependent Claim
14 words
A method as in claim 13, wherein the laser drilling is excimer laser drilling.
Claim 17
Dependent Claim
18 words
A method as in claim 10, wherein electrically non-conductive portions of the substrate are made of organic material.
Claim 18
Dependent Claim
14 words
A method as in claim 15, wherein the organic material includes organic reinforcement fibers.
Claim 19
Dependent Claim
13 words
A method as in claim 16, where the reinforcement fibers are aramid fibers.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-10-10 | 1998-04-11 | 1998-10-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-10-10 | 2002-04-11 | 2002-10-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-10-10 | 2006-04-11 | 2006-10-11 | $7700.00 | Window Closed / Lapsed |