Patent US5773889A successfully refreshed from Google Patents.
US5773889A
Expired / Lapsed
US
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Wire interconnect structures for connecting an integrated circuit to a substrate
Assignee: Fujitsu Ltd
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Filing: 1996-09-23
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Granted: 1998-06-30
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Expires: 2016-09-23
Abstract
Abstract An interconnect structure for connecting an integrated circuit (IC) chip to a supporting substrate is described. The supporting substrate serves to communicate signals between the IC chip and the "outside world," such as other IC chips. In one embodiment, the interconnect structure comprises an interconnect substrate having a first post disposed on one of its surfaces and a second post disposed on another of its surfaces. One post is for contacting the IC chip and the other is for contacting the major substrate. Each post comprising an elongated body having top and bottom ends, with the bottom end being mounted to one of the substrate surfaces and the top end having a substantially flat surface which is substantially co-planer with the substrate surface. The interconnect substrate further comprises a means for de-concentrating the mechanical stain present at one or both of the top and bottom ends of each post. The first and second posts are electrically coupled to one anther so that an electrical signal may pass from IC chip to the supporting substrate, and vice-versa.
Inventors
- 👤 David George Love
- 👤 Larry Louis Moresco
- 👤 William Tai-Hua Chou
- 👤 David Albert Horine
- 👤 Connie Mak Wong
- 👤 Solomon Isaac Beilin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 11:55
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W72/00; H10W72/01; H10W72/019; H10W72/20; H10W90/00; H10W90/701; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/0364; H05K2201/0367; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2201/20; H05K2201/2081; H05K2203/00; H05K2203/03; H05K2203/0315; H05K2203/07; H05K2203/0703; H05K2203/072; H05K3/22; H05K3/24; H05K3/243; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K3/3465; H05K3/3473; H10W72/012; H10W72/01251; H10W72/01255; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/221; H10W72/231; H10W72/234; H10W72/251; H10W72/252; H10W72/281; H10W72/283; H10W72/29; H10W72/90; H10W72/951; H10W95/00
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
133 words
A wire interconnect structure comprising: an electrically conductive post disposed on a surface for making contact to an interconnect pad, said post comprising an elongated body having a bottom end and top end thereof, the bottom end being mounted on said surface and the top end for connecting to the interconnect pad by an electrically-conductive bonding material; and a first layer formed on the body of said post extending in the direction of elongation from the bottom end of said post to a point intermediate between the bottom and top ends of said post, said first layer having a lower adherence to the bonding material than the exposed top portion of said post such that bonding material does not substantially adhere to the first layer when said post is connected to the pad.
Claim 2
Dependent Claim
133 words
A wire interconnect structure comprising: an electrically conductive post disposed on a surface for making contact to an interconnect pad, said post comprising an elongated body having a bottom end and top end thereof, the bottom end being mounted on said surface and the top end for connecting to the interconnect pad by an electrically-conductive bonding material; and a first layer formed on the body of said post extending in the direction of elongation from the bottom end of said post to a point intermediate between the bottom and top ends of said post, said first layer having a lower adherence to the bonding material than the exposed top portion of said post such that bonding material does not substantially adhere to the first layer when said post is connected to the pad.
Claim 3
Dependent Claim
14 words
The wire interconnect structure of claim 1 wherein said first layer comprises an oxide.
Claim 4
Dependent Claim
24 words
The wire interconnect structure of claim 1 wherein said first layer extends to within approximately 5 microns of the top end of said post.
Claim 5
Dependent Claim
24 words
The wire interconnect structure of claim 1 wherein said post body is tapered such that the bottom end is smaller than the top end.
Claim 6
Dependent Claim
81 words
The wire interconnect structure of claim 1 wherein the body of said post is substantially circular in a cross-section plane co-planer with its top end surface, the cross-section of said body being substantially circular throughout the body's direction of elongation, each of the top and bottom ends of said post being substantially circular, and wherein the ratio of the post's length in the direction of elongation to the diameter of circular cross-section at its bottom end is greater than approximately 3.5.
Claim 7
Dependent Claim
15 words
The wire interconnect structure of claim 5 wherein said ratio is at least substantially 6.0.
Claim 8
Dependent Claim
35 words
The wire interconnect structure of claim 1 wherein said post comprises an inner portion of a first electrically conductive material and an outer coating layer of a second conductive material disposed on said inner portion.
Claim 9
Dependent Claim
29 words
The wire interconnect structure of claim 1 wherein said structure is physically coupled and electrically coupled to a corresponding pad by a bump comprising an electrically conductive polymer material.
Claim 10
Dependent Claim
47 words
The wire interconnect structure of claim 8 wherein said electrically conductive polymer material comprises one of a conductive elastomer, a metal-filled thermoplastic, a metal-filled epoxy resins, a silver-filled epoxy resin, a metal-filled polyimide, a metal filled epoxy-polyimide, a conductive silicone material, and a metal-coated compliant plastic sphere.
Claim 11
Dependent Claim
38 words
The wire interconnect structure of claim 1 wherein said post comprises a material having a high melting point such that the shape of said post does not substantially change when the post is connected to the interconnect pad.
Claim 12
Dependent Claim
226 words
A wire interconnect structure comprising: an interconnect substrate having a first surface and a second surface; a first electrically conductive post disposed on said first surface for making contact to an interconnect pad, said post comprising an elongated body having a bottom end and top end thereof, the bottom end being mounted on the first surface and the top end for connecting to the pad by an electrically-conductive bonding material; a first layer formed on the body of said post extending in the direction of elongation from the bottom end of said post to a point intermediate between the bottom and top ends of said post, said first layer having a lower adherence to the bonding material than the exposed top portion of said post such that bonding material does not substantially adhere to the first layer when said post is connected to the pad; a second electrically conductive post disposed on the second surface of said interconnect substrate for making contact to another interconnect, said second post comprising an elongated body having a bottom end and top end thereof, the bottom end being mounted to the second surface of said interconnect substrate and the top end for connecting to the other interconnect pad by an electrically-conductive bonding material; and coupling means on said interconnect substrate for electrically coupling said first post to said second post.
Claim 13
Dependent Claim
226 words
A wire interconnect structure comprising: an interconnect substrate having a first surface and a second surface; a first electrically conductive post disposed on said first surface for making contact to an interconnect pad, said post comprising an elongated body having a bottom end and top end thereof, the bottom end being mounted on the first surface and the top end for connecting to the pad by an electrically-conductive bonding material; a first layer formed on the body of said post extending in the direction of elongation from the bottom end of said post to a point intermediate between the bottom and top ends of said post, said first layer having a lower adherence to the bonding material than the exposed top portion of said post such that bonding material does not substantially adhere to the first layer when said post is connected to the pad; a second electrically conductive post disposed on the second surface of said interconnect substrate for making contact to another interconnect, said second post comprising an elongated body having a bottom end and top end thereof, the bottom end being mounted to the second surface of said interconnect substrate and the top end for connecting to the other interconnect pad by an electrically-conductive bonding material; and coupling means on said interconnect substrate for electrically coupling said first post to said second post.
Claim 14
Dependent Claim
14 words
The wire interconnect structure of claim 11 wherein said first layer comprises an oxide.
Claim 15
Dependent Claim
24 words
The wire interconnect structure of claim 11 wherein said first layer extends to within approximately 5 microns of the top end of said post.
Claim 16
Dependent Claim
24 words
The wire interconnect structure of claim 11 wherein said post body is tapered such that the bottom end is smaller than the top end.
Claim 17
Dependent Claim
81 words
The wire interconnect structure of claim 11 wherein the body of said post is substantially circular in a cross-section plane co-planer with its top end surface, the cross-section of said body being substantially circular throughout the body's direction of elongation, each of the top and bottom ends of said post being substantially circular, and wherein the ratio of the post's length in the direction of elongation to the diameter of circular cross-section at its bottom end is greater than approximately 3.5.
Claim 18
Dependent Claim
15 words
The wire interconnect structure of claim 15 wherein said ratio is at least substantially 6.0.
Claim 19
Dependent Claim
35 words
The wire interconnect structure of claim 11 wherein said post comprises an inner portion of a first electrically conductive material and an outer coating layer of a second conductive material disposed on said inner portion.
Claim 20
Dependent Claim
29 words
The wire interconnect structure of claim 11 wherein said structure is physically coupled and electrically coupled to a corresponding pad by a bump comprising an electrically conductive polymer material.
Claim 21
Dependent Claim
47 words
The wire interconnect structure of claim 18 wherein said electrically conductive polymer material comprises one of a conductive elastomer, a metal-filled thermoplastic, a metal-filled epoxy resins, a silver-filled epoxy resin, a metal-filled polyimide, a metal filled epoxy-polyimide, a conductive silicone material, and a metal-coated compliant plastic sphere.
Claim 22
Dependent Claim
38 words
The wire interconnect structure of claim 11 wherein said post comprises a material having a high melting point such that the shape of said post does not substantially change when the post is connected to the interconnect pad.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-06-29 | 2001-12-29 | 2002-06-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-06-29 | 2005-12-29 | 2006-06-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-06-29 | 2009-12-29 | 2010-06-30 | $7700.00 | Window Closed / Lapsed |