Patent US5776798A successfully refreshed from Google Patents.
US5776798A
Expired / Lapsed
US
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Semiconductor package and method thereof
Assignee: NXP USA Inc
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Filing: 1996-09-04
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Granted: 1998-07-07
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Expires: 2016-09-04
Abstract
Abstract A semiconductor package substrate (10) has an array of package sites (13,14,16,21,22, and 23) that are substantially identical. The entire array of package sites (13,14,16,21,22, and 23) is covered by an encapsulant (19). The individual package sites (13,14,16,21,22, and 23) are singulated by sawing through the encapsulant (19) and the underlying semiconductor package substrate (10).
Inventors
- 👤 Son Ky Quan
- 👤 Samuel L. Coffman
- 👤 Bruce Reid
- 👤 Keith E. Nelson
- 👤 Deborah A. Hagen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 16:55
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W74/00; H10W74/01; H10W74/014; H10W74/10; H10W74/111; H10W74/114; H10W46/00; H10W46/601; H10W46/607; H10W72/00; H10W72/01; H10W72/0198; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
63 words
A method of forming a semiconductor package comprising: forming a substrate having a plurality of package sites and an electronic component attached to the plurality of package sites; encapsulating the plurality of package sites wherein the encapsulating forms a continuous encapsulating material covering the plurality of package sites; and singulating through the encapsulating material to singulate each package site into an individual package.
Claim 2
Independent Claim
63 words
A method of forming a semiconductor package comprising: forming a substrate having a plurality of package sites and an electronic component attached to the plurality of package sites; encapsulating the plurality of package sites wherein the encapsulating forms a continuous encapsulating material covering the plurality of package sites; and singulating through the encapsulating material to singulate each package site into an individual package.
Claim 3
Independent Claim
69 words
A method of forming a semiconductor package comprising: encapsulating a plurality of package sites that are on a substrate wherein the encapsulating forms a continuous encapsulating material covering the plurality of package sites and wherein encapsulating the plurality of package sites includes forming the encapsulating material to have a top surface planarity deviation of less than 0.13 millimeters; and singulate through the encapsulating material to singulate each package site.
Claim 4
Independent Claim
69 words
A method of forming a semiconductor package comprising: encapsulating a plurality of package sites that are on a substrate wherein the encapsulating forms a continuous encapsulating material covering the plurality of package sites and wherein encapsulating the plurality of package sites includes forming the encapsulating material to have a top surface planarity deviation of less than 0.13 millimeters; and singulate through the encapsulating material to singulate each package site.
Claim 5
Independent Claim
84 words
A method of forming a semiconductor package comprising: encapsulating a plurality of package sites that are on a substrate wherein the encapsulating forms a continuous encapsulating material covering the plurality of package sites and wherein encapsulating the plurality of package sites includes forming a dam bar surrounding the periphery of the plurality of package sites for forming a cavity containing the plurality of package sites, and dispensing the encapsulating material within the cavity; and singulating through the encapsulating material to singulate each package site.
Claim 6
Independent Claim
84 words
A method of forming a semiconductor package comprising: encapsulating a plurality of package sites that are on a substrate wherein the encapsulating forms a continuous encapsulating material covering the plurality of package sites and wherein encapsulating the plurality of package sites includes forming a dam bar surrounding the periphery of the plurality of package sites for forming a cavity containing the plurality of package sites, and dispensing the encapsulating material within the cavity; and singulating through the encapsulating material to singulate each package site.
Claim 7
Dependent Claim
20 words
The method of claim 3 wherein forming the dam bar includes dispensing a first encapsulating material having a first viscosity.
Claim 8
Dependent Claim
30 words
The method of claim 4 wherein dispensing the encapsulating material within the cavity includes dispensing a second encapsulating material having a second viscosity that is lower than the first viscosity.
Claim 9
Dependent Claim
24 words
The method of claim 5 wherein dispensing the first encapsulating material having the first viscosity includes having a viscosity of 1,000,000 to 2,000,000 cps.
Claim 10
Dependent Claim
23 words
The method of claim 5 wherein dispensing the second encapsulating material having the second viscosity includes having a viscosity less than 500,000 cps.
Claim 11
Dependent Claim
25 words
The method of claim 5 further including gelling both the first and second encapsulating materials prior to curing both the first and second encapsulating materials.
Claim 12
Dependent Claim
17 words
The method of claim 5 wherein dispensing the first encapsulating material includes heating the first encapsulating material.
Claim 13
Dependent Claim
17 words
The method of claim 5 wherein dispensing the second encapsulating material includes heating the second encapsulating material.
Claim 14
Dependent Claim
20 words
The method of claim 1 wherein singulating through the encapsulating material includes sawing through the encapsulating material and the substrate.
Claim 15
Dependent Claim
16 words
The method of claim 1 wherein encapsulating the plurality of package sites includes encapsulating by overmolding.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-07-06 | 2002-01-05 | 2002-07-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-07-06 | 2006-01-05 | 2006-07-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-07-06 | 2010-01-05 | 2010-07-07 | $7700.00 | Window Closed / Lapsed |