US5854534A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Controlled impedence interposer substrate
Assignee: Fujitsu Ltd
•
Filing: 1995-11-16
•
Granted: 1998-12-29
•
Expires: 2015-11-16
Abstract
Abstract An interposer substrate for mounting an integrated circuit chip to a substrate, and method of making the same, are shown. The interposer substrate comprises power supply paths and controlled impedance signal paths that are substantially isolated from each other. Power supply is routed though rigid segments and signals are routed though a thin film flexible connector that runs from the upper surface of the interposer substrate to the lower surface. Bypass capacitance is incorporated into the interposer substrate and connected to the power supply so that it is positioned very close to the integrated circuit chip. The interposer may be fabricated by forming a multilayered thin film structure including the signal paths over a rigid substrate having vias formed therein, removing the central portion of the substrate leaving the two end segments, and folding and joining the end segments such that the vias are connected. In another embodiment of the invention, a separate power plate is provided for carrying the power lines. Portions of the power plate, with a multilayered thin film structure thereon, are cut and folded to form interposers. Methods of making single-chip interposers are also disclosed.
Inventors
- 👤 Solomon I. Beilin
- 👤 William T. Chou
- 👤 David Kudzuma
- 👤 Michael G. Lee
- 👤 Michael G. Peters
- 👤 James J. Roman
- 👤 Som S. Swamy
- 👤 Wen-chou Vincent Wang
- 👤 Larry L. Moresco
- 👤 Teruo Murase
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 09:55
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/144; H10; H10W; H10W44/00; H10W44/20; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W70/65; H10W70/67; H10W70/688; H10W90/00; H10W90/401; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10378; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
131 words
An interposer substrate for coupling an integrated circuit chip to a multichip module substrate, comprising: a rigid member having a first surface for mounting to said multichip module substrate and a second surface for receiving said integrated circuit chip, power distribution means for coupling power from said multichip module substrate to said integrated circuit chip, said power distribution means having a plurality of vias formed through said rigid member from said first surface to said second surface and wherein power is routed through said rigid member from said first surface to said second surface; and, controlled impedance signal path means for coupling signals from said multichip module substrate to said integrated circuit chip; wherein said power distribution means and said controlled impedance signal path means are substantially isolated from each other.
Claim 2
Dependent Claim
131 words
An interposer substrate for coupling an integrated circuit chip to a multichip module substrate, comprising: a rigid member having a first surface for mounting to said multichip module substrate and a second surface for receiving said integrated circuit chip, power distribution means for coupling power from said multichip module substrate to said integrated circuit chip, said power distribution means having a plurality of vias formed through said rigid member from said first surface to said second surface and wherein power is routed through said rigid member from said first surface to said second surface; and, controlled impedance signal path means for coupling signals from said multichip module substrate to said integrated circuit chip; wherein said power distribution means and said controlled impedance signal path means are substantially isolated from each other.
Claim 3
Dependent Claim
58 words
The interposer of claim 1 further comprising: a flexible, controlled impedance thin film connector, said thin film connector being mounted at one end thereof on said first surface and at a second end thereof on said second surface, wherein said signals are routed through said flexible, controlled impedance connector without passing through the body of said rigid member.
Claim 4
Dependent Claim
16 words
The interposer of claim 1 comprising an integral bypass capacitor coupled to said power distribution means.
Claim 5
Dependent Claim
16 words
The interposer of claim 1 comprising an integral terminal resistor coupled to said signal path means.
Claim 6
Dependent Claim
16 words
The interposer of claim 1 wherein said controlled impedance signal path means comprises a strip line.
Claim 7
Dependent Claim
62 words
The interposer of claim 2 wherein said rigid member comprises first and second segments, wherein said power distribution means comprises a plurality of vias formed through said first and second segments, and wherein said first and second segments are joined together by interconnecting ends of the vias formed in said first segment with ends of the vias formed in said second segment.
Claim 8
Dependent Claim
66 words
The interposer of claim 6 wherein said flexible connector comprises a first conductive layer, a first dielectric layer formed on said first conductive layer, a second conductive layer comprising a plurality of evenly spaced apart, substantially parallel signal lines formed on said first dielectric layer, a second dielectric layer formed on said second conductive layer, and a third conductive layer formed on said second dielectric layer.
Claim 9
Dependent Claim
13 words
The interposer of claim 6 wherein said vias are joined by solder bumps.
Claim 10
Dependent Claim
13 words
The interposer of claim 6 wherein said vias are joined by wire interconnects.
Claim 11
Dependent Claim
216 words
An interposer substrate for coupling an integrated circuit chip to a multichip module substrate, comprising: a first rigid member having coplanar first and second faces, said first rigid member having a plurality of vias formed therein, said vias providing electrical connection between said first and second faces; a second rigid member having coplanar first and second faces, said second rigid member having a plurality of vias formed therein, said vias providing electrical connection between said first and second faces; wherein the first face of said second rigid member is mounted on the first face of said first rigid member, and wherein electrical connection is made between vias in each of said rigid member such that the second face of said first rigid member is electrically coupled to the second face of said second rigid member; a bypass capacitor formed on the second face of said first rigid member, the plates of said capacitor being electrically connected to at least some of said vias; and, a controlled impedance flexible connector containing a plurality of signal paths linking opposite ends thereof, the first end of said flexible connector being attached to said second surface of said first rigid member and the second end of said flexible connector being attached to said second surface of said second rigid member.
Claim 12
Dependent Claim
216 words
An interposer substrate for coupling an integrated circuit chip to a multichip module substrate, comprising: a first rigid member having coplanar first and second faces, said first rigid member having a plurality of vias formed therein, said vias providing electrical connection between said first and second faces; a second rigid member having coplanar first and second faces, said second rigid member having a plurality of vias formed therein, said vias providing electrical connection between said first and second faces; wherein the first face of said second rigid member is mounted on the first face of said first rigid member, and wherein electrical connection is made between vias in each of said rigid member such that the second face of said first rigid member is electrically coupled to the second face of said second rigid member; a bypass capacitor formed on the second face of said first rigid member, the plates of said capacitor being electrically connected to at least some of said vias; and, a controlled impedance flexible connector containing a plurality of signal paths linking opposite ends thereof, the first end of said flexible connector being attached to said second surface of said first rigid member and the second end of said flexible connector being attached to said second surface of said second rigid member.
Claim 13
Dependent Claim
29 words
The interposer of claim 10 further comprising a terminal resistor formed on a face of one of said rigid members and electrically coupled to one of said signal paths.
Claim 14
Dependent Claim
22 words
The interposer of claim 10 wherein said flexible connector comprises a thin film multilayered structure comprising plurality of polyimide and metal layers.
Claim 15
Dependent Claim
20 words
The interposer of claim 10 wherein said comprises a thin film multilayered structure comprising plurality of benzocyclobutene and metal layers.
Claim 16
Dependent Claim
13 words
The interposer of claim 10 wherein said rigid members comprise silicon or ceramic.
Claim 17
Dependent Claim
133 words
A power plate for carrying a plurality of IC chips and for coupling signals from the chips to a signal module substrate, the signal module substrate having a plurality of signal lines formed thereon, said power plate comprising: a substrate having a plurality of first substrate parts at which IC chips may be mounted, a plurality of power lines which route power to said first parts, and a plurality of second substrate parts underlying said first substrate parts, said first parts comprising a plurality of first interconnectors for coupling to integrated circuit chips, second parts having a plurality of second interconnectors for coupled to the signal lines of a signal module; and a plurality of flexible thin film connectors interconnecting said first and second interconnectors of said first and second substrate parts, respectively.
Claim 18
Dependent Claim
133 words
A power plate for carrying a plurality of IC chips and for coupling signals from the chips to a signal module substrate, the signal module substrate having a plurality of signal lines formed thereon, said power plate comprising: a substrate having a plurality of first substrate parts at which IC chips may be mounted, a plurality of power lines which route power to said first parts, and a plurality of second substrate parts underlying said first substrate parts, said first parts comprising a plurality of first interconnectors for coupling to integrated circuit chips, second parts having a plurality of second interconnectors for coupled to the signal lines of a signal module; and a plurality of flexible thin film connectors interconnecting said first and second interconnectors of said first and second substrate parts, respectively.
Claim 19
Dependent Claim
37 words
The power plate of claim 15 wherein said substrate comprises a plurality of openings, each opening being adjacent to a first substrate part; and wherein at least one opening has a thin film connector passes through it.
Claim 20
Dependent Claim
21 words
The power plate of claim 15, in which said thin film connectors are integrally formed with said first and second interconnectors.
Claim 21
Dependent Claim
23 words
The module of claim 15, in which said power lines are coupled to said chips by vias extending through said first substrate parts.
Claim 22
Dependent Claim
39 words
The power plate of claim 15, in which said second substrate parts are formed by cutting said second substrate parts out of said power plate and folding them under said first parts, thereby forming openings in said power plate.
Claim 23
Dependent Claim
34 words
The module of claim 15, in which a capacitive layer providing bypass capacitance for said power lines is formed on said substrate between said first interconnectors on said first substrate parts and said chips.
Claim 24
Dependent Claim
171 words
A multichip module for integrated circuit chips, comprising: a) a signal module having a first plurality of signal lines formed thereon for interconnecting said integrated circuit chips; b) a power plate having a substrate, said substrate having a plurality of power lines for powering said integrated circuit chips; and c) means for connecting said first signal lines of said signal module to said integrated circuit chips, said connecting means including: first parts of said substrate having formed thereon a plurality of second signal lines adapted to be connected to integrated circuit chips affixed to said parts; second substrate parts underlying first parts and having formed thereon a plurality of third signal lines adapted to be connected to said first signal lines formed on said signal module; and a plurality of flexible, controlled impedance thin film connectors interconnecting said second and third signal lines of said first and second substrate parts, respectively, and d) wherein said power plate and said signal module are spaced from one another by said second substrate parts.
Claim 25
Dependent Claim
171 words
A multichip module for integrated circuit chips, comprising: a) a signal module having a first plurality of signal lines formed thereon for interconnecting said integrated circuit chips; b) a power plate having a substrate, said substrate having a plurality of power lines for powering said integrated circuit chips; and c) means for connecting said first signal lines of said signal module to said integrated circuit chips, said connecting means including: first parts of said substrate having formed thereon a plurality of second signal lines adapted to be connected to integrated circuit chips affixed to said parts; second substrate parts underlying first parts and having formed thereon a plurality of third signal lines adapted to be connected to said first signal lines formed on said signal module; and a plurality of flexible, controlled impedance thin film connectors interconnecting said second and third signal lines of said first and second substrate parts, respectively, and d) wherein said power plate and said signal module are spaced from one another by said second substrate parts.
Claim 26
Dependent Claim
84 words
The multichip module of claim 21 wherein said substrate of said power plate comprises a plurality of openings, each opening being adjacent to a first substrate part of said power plate, wherein at least one said opening has a thin film connector passing through it, and wherein said multichip module is multilayered by stacking sets of said signal modules and power plates over each other, and spacing said signal modules from one another by substantially interposers extending through said openings in said power plates.
Claim 27
Dependent Claim
39 words
The module of claim 22, in which said second substrate parts are formed by cutting said second substrate parts out of said power plate and folding them under said first parts, thereby forming said openings in said power plate.
References Cited (Backward Citations)
US3611317A
Cited
US3629787A
Cited
US3643135A
Cited
FR2096541B1
Cited
US3949274A
Cited
US4371744A
Cited
US4271588A
Cited
US4202007A
Cited
US4249302A
Cited
US4289922A
Cited
US4509099A
Cited
US4502098A
Cited
US4525921A
Cited
US4453176A
Cited
US4718163A
Cited
US4638348A
Cited
US4499607A
Cited
US4480288A
Cited
US4547834A
Cited
US4489363A
Cited
US5102828A
Cited
US4581679A
Cited
US4574331A
Cited
US5007841A
Cited
US5019945A
Cited
US4770640A
Cited
US4648179A
Cited
DD216826A1
Cited
US4601526A
Cited
US4727410A
Cited
US4631636A
Cited
US5237204A
Cited
US4679118A
Cited
US4733461A
Cited
US4716259A
Cited
US4894706A
Cited
US4640010A
Cited
US4739444A
Cited
US5051865A
Cited
US4774630A
Cited
US4902637A
Cited
US4807021A
Cited
US4688151A
Cited
US4939568A
Cited
US4695872A
Cited
US5031072A
Cited
US4922378A
Cited
US4866508A
Cited
US4781969A
Cited
US4811082A
Cited
US4803595A
Cited
US4801992A
Cited
US4858073A
Cited
US5204806A
Cited
US4721831A
Cited
US4868712A
Cited
US4855871A
Cited
US5006920A
Cited
US4930002A
Cited
US4953005A
Cited
US4862249A
Cited
US4771366A
Cited
US4901136A
Cited
US4743568A
Cited
US5061990A
Cited
US5016138A
Cited
US4983533A
Cited
US4800461A
Cited
US4937659A
Cited
US4884167A
Cited
US4956749A
Cited
US4855809A
Cited
US4871317A
Cited
US5010448A
Cited
US4958258A
Cited
US4873764A
Cited
US4841355A
Cited
US4963697A
Cited
US4970577A
Cited
US4937707A
Cited
US4910643A
Cited
US5025306A
Cited
US4984132A
Cited
US4922059A
Cited
US5055907A
Cited
US5003376A
Cited
US4956746A
Cited
US4996587A
Cited
US5034569A
Cited
US4953060A
Cited
US4956695A
Cited
US5089880A
Cited
US4899439A
Cited
US4965702A
Cited
US4992908A
Cited
US5049982A
Cited
US4931134A
Cited
US4991000A
Cited
US5032896A
Cited
US5006925A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-12-28 | 2002-06-29 | 2002-12-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-12-28 | 2006-06-29 | 2006-12-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-12-28 | 2010-06-29 | 2010-12-29 | $7700.00 | Window Closed / Lapsed |