US5912809A — Printed circuit board (PCB) including channeled c…

Claim 1

Independent Claim 149 words

A printed circuit board comprising: a plurality of planar conductive layers arranged in a mutually parallel sequence; and a plurality of planar insulative layers separating the plurality of planar conductive layers, the planar insulative layers having variable and controlled widths; the plurality of planar conductive layers including a power plane layer for supplying operating power throughout the planar conductive layers; the power plane layer including a plurality of separated segments in selected geometric patterns; the plurality of planar conductive layers including a plurality of signal plane layers for communicating operational signals throughout the planar conductive layers; the plurality of signal plane layers including a plurality of separated channeled capacitive plane segments in selected geometric patterns; and the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width being controlled to control VHF electrical currents in three dimensions.

Claim 2

Dependent Claim 149 words

A printed circuit board comprising: a plurality of planar conductive layers arranged in a mutually parallel sequence; and a plurality of planar insulative layers separating the plurality of planar conductive layers, the planar insulative layers having variable and controlled widths; the plurality of planar conductive layers including a power plane layer for supplying operating power throughout the planar conductive layers; the power plane layer including a plurality of separated segments in selected geometric patterns; the plurality of planar conductive layers including a plurality of signal plane layers for communicating operational signals throughout the planar conductive layers; the plurality of signal plane layers including a plurality of separated channeled capacitive plane segments in selected geometric patterns; and the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width being controlled to control VHF electrical currents in three dimensions.

Claim 3

Dependent Claim 37 words

A printed circuit board according to claim 1, further comprising: a plurality of vias interconnecting layers of the plurality of planar conductive layers, the plurality of vias being interconnected to control VHF electrical currents in three dimensions.

Claim 4

Dependent Claim 37 words

A printed circuit board according to claim 1, further comprising: a plurality of vias interconnecting layers of the plurality of planar conductive layers, the plurality of vias being interconnected to control VHF electrical currents in three dimensions.

Claim 5

Dependent Claim 32 words

A printed circuit board according to claim 1, wherein: the plurality of planar conductive layers includes: a power plane; a plurality of signal plane layers; and a plurality of ground plane layers.

Claim 6

Dependent Claim 67 words

A printed circuit board according to claim 1, wherein: the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width are selected to control voltages and currents by channeling a capacitance capacity for usage directed to a particular integrated circuit or circuits, isolated to a particular integrated circuit or circuits, or shared between integrated circuits.

Claim 7

Dependent Claim 80 words

A printed circuit board according to claim 1, wherein: the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width are selected to form a plurality of potential capacitive planes on a plurality of layers in a single multiple layer or printed circuit board (PCB) design and direction of the EMI fluxes includes an effect of channeling EMI fluxes from layer to layer within the printed circuit board.

Claim 8

Dependent Claim 77 words

A printed circuit board according to claim 1, wherein: the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width are selected to form a plurality of individual power planes in a printed circuit board whereby EMI fluxes of the individual power planes are channeled or directed within a single capacitive plane pair to improve electromagnetic field suppression and stabilize voltages applied to integrated circuits.

Claim 9

Dependent Claim 45 words

A printed circuit board according to claim 1, wherein: the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width are selected to control mutual inductance and frequency response of a capacitive plane.

Claim 10

Dependent Claim 63 words

A printed circuit board according to claim 1, wherein: the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width are selected to reduce power plane radio frequency (RF) crosstalk at the interface between a processor and an audio interface within a computer system, thereby improving signal-to-noise ratio of the system.

Claim 11

Dependent Claim 67 words

A printed circuit board according to claim 1, wherein: the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width are selected to form capacitive planes that are smaller in area than the printed circuit board to share usage of a layer or layers among other interconnections including buses, slow logic, and clock microstrip systems.

Claim 12

Dependent Claim 42 words

A printed circuit board according to claim 1, wherein: the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width are selected to control usage of radio frequency (RF) power.

Claim 13

Independent Claim 197 words

A method of fabricating a printed circuit board comprising the steps of: laying out a plurality of planar conductive layers including a power plane layer for supplying operating power throughout the planar conductive layers; laying out a power plane layer including a plurality of separated segments in selected geometric patterns; laying out a plurality of planar insulative layers having variable and controlled widths; controlling the geometric patterns and the insulative layer variable width to control VHF electrical currents in three dimensions; forming a plurality of planar conductive layers arranged in a mutually parallel sequence; forming a plurality of planar insulative layers separating the plurality of planar conductive layers, the planar insulative layers having the variable and controlled widths; laying out the plurality of planar conductive layers to include a plurality of signal plane layers for communicating operational signals throughout the planar conductive layers; laying out the plurality of signal plane layers to include a plurality of separated channeled capacitive plane segments in selected geometric patterns; and controlling the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width to determine electrical currents in three dimensions.

Claim 14

Independent Claim 197 words

A method of fabricating a printed circuit board comprising the steps of: laying out a plurality of planar conductive layers including a power plane layer for supplying operating power throughout the planar conductive layers; laying out a power plane layer including a plurality of separated segments in selected geometric patterns; laying out a plurality of planar insulative layers having variable and controlled widths; controlling the geometric patterns and the insulative layer variable width to control VHF electrical currents in three dimensions; forming a plurality of planar conductive layers arranged in a mutually parallel sequence; forming a plurality of planar insulative layers separating the plurality of planar conductive layers, the planar insulative layers having the variable and controlled widths; laying out the plurality of planar conductive layers to include a plurality of signal plane layers for communicating operational signals throughout the planar conductive layers; laying out the plurality of signal plane layers to include a plurality of separated channeled capacitive plane segments in selected geometric patterns; and controlling the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width to determine electrical currents in three dimensions.

Claim 15

Dependent Claim 33 words

A method according to claim 12, further comprising the steps of: interconnecting a plurality of vias interconnecting layers of the plurality of planar conductive layers to control VHF electrical currents in three dimensions.

Claim 16

Dependent Claim 33 words

A method according to claim 12, further comprising the steps of: interconnecting a plurality of vias interconnecting layers of the plurality of planar conductive layers to control VHF electrical currents in three dimensions.

Claim 17

Dependent Claim 41 words

A method according to claim 12, further comprising the steps of: forming the plurality of planar conductive layers including the steps of: forming a power plane; forming a plurality of signal plane layers; and forming a plurality of ground plane layers.

Claim 18

Dependent Claim 68 words

A method according to claim 12, further comprising the steps of: selecting the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width to control voltages and currents by channeling a capacitance capacity for usage directed to a particular integrated circuit or circuits, isolated to a particular integrated circuit or circuits, or shared between integrated circuits.

Claim 19

Dependent Claim 81 words

A method according to claim 12, further comprising the steps of: selecting the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width to form a plurality of potential capacitive planes on a plurality of layers in a single multiple layer or printed circuit board (PCB) design and direction of the EMI fluxes includes an effect of channeling EMI fluxes from layer to layer within the printed circuit board.

Claim 20

Dependent Claim 96 words

A method according to claim 12, further comprising the steps of: selecting the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width to form a plurality of individual power planes in a printed circuit board with EMI fluxes of the individual power planes are channeled or directed within a single capacitive plane pair to allow a plurality of potentials and integrated circuits which form loads applied to the plurality of potentials to improve electromagnetic field suppression and stabilize voltages applied to integrated circuits.

Claim 21

Dependent Claim 46 words

A method according to claim 12, further comprising the steps of: selecting the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width to control mutual inductance and frequency response of a capacitive plane.

Claim 22

Dependent Claim 64 words

A method according to claim 12, further comprising the steps of: selecting the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width to reduce power plane radio frequency (RF) crosstalk at the interface between a processor and an audio interface within a computer system, thereby improving signal-to-noise ratio of the system.

Claim 23

Dependent Claim 68 words

A method according to claim 12, further comprising the steps of: selecting the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width to form capacitive planes that are smaller in area than the printed circuit board to share usage of a layer or layers among other interconnections including buses, slow logic, and clock microstrip systems.

Claim 24

Dependent Claim 43 words

A method according to claim 12, further comprising the steps of: selecting the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width to control usage of radio frequency (RF) power.

Claim 25

Dependent Claim 178 words

A computer system comprising: a plurality of integrated circuit chips including a processor; a printed circuit board for mounting at least some of the plurality of integrated circuit chips, the printed circuit board including: a plurality of planar conductive layers arranged in a mutually parallel sequence; and a plurality of planar insulative layers separating the plurality of planar conductive layers, the planar insulative layers having variable and controlled widths; the plurality of planar conductive layers including a power plane layer for supplying operating power throughout the planar conductive layers; the power plane layer including a plurality of separated segments in selected geometric patterns; the plurality of planar conductive layers including a plurality of signal plane layers for communicating operational signals throughout the planar conductive layers; the plurality of signal plane layers including a plurality of separated channeled capacitive plane segments in selected geometric patterns; and the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width being controlled to control VHF electrical currents in three dimensions.

Claim 26

Dependent Claim 178 words

A computer system comprising: a plurality of integrated circuit chips including a processor; a printed circuit board for mounting at least some of the plurality of integrated circuit chips, the printed circuit board including: a plurality of planar conductive layers arranged in a mutually parallel sequence; and a plurality of planar insulative layers separating the plurality of planar conductive layers, the planar insulative layers having variable and controlled widths; the plurality of planar conductive layers including a power plane layer for supplying operating power throughout the planar conductive layers; the power plane layer including a plurality of separated segments in selected geometric patterns; the plurality of planar conductive layers including a plurality of signal plane layers for communicating operational signals throughout the planar conductive layers; the plurality of signal plane layers including a plurality of separated channeled capacitive plane segments in selected geometric patterns; and the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width being controlled to control VHF electrical currents in three dimensions.

Claim 27

Dependent Claim 31 words

A computer system according to claim 23 wherein: placement of the at least some of the plurality of integrated circuit chips is controlled to control VHF electrical currents in three dimensions.

Claim 28

Dependent Claim 36 words

A computer system according to claim 23, further comprising: a plurality of vias interconnecting layers of the plurality of planar conductive layers, the plurality of vias being interconnected to control VHF electrical currents in three dimensions.

Claim 29

Dependent Claim 36 words

A computer system according to claim 23, further comprising: a plurality of vias interconnecting layers of the plurality of planar conductive layers, the plurality of vias being interconnected to control VHF electrical currents in three dimensions.

Claim 30

Dependent Claim 31 words

A computer system according to claim 23, wherein: the plurality of planar conductive layers includes: a power plane; a plurality of signal plane layers; and a plurality of ground plane layers.

Claim 31

Dependent Claim 66 words

A computer system according to claim 23, wherein: the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width are selected to control voltages and currents by channeling a capacitance capacity for usage directed to a particular integrated circuit or circuits, isolated to a particular integrated circuit or circuits, or shared between integrated circuits.

Claim 32

Dependent Claim 79 words

A computer system according to claim 23, wherein: the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width are selected to form a plurality of potential capacitive planes on a plurality of layers in a single multiple layer or printed circuit board (PCB) design and direction of the EMI fluxes includes an effect of channeling EMI fluxes from layer to layer within the printed circuit board.

Claim 33

Dependent Claim 76 words

A computer system according to claim 23, wherein: the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width are selected to form a plurality of individual power planes in a printed circuit board whereby EMI fluxes of the individual power planes are channeled or directed within a single capacitive plane pair to improve electromagnetic field suppression and stabilize voltages applied to integrated circuits.

Claim 34

Dependent Claim 44 words

A computer system according to claim 23, wherein: the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width are selected to control mutual inductance and frequency response of a capacitive plane.

Claim 35

Dependent Claim 62 words

A computer system according to claim 23, wherein: the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width are selected to reduce power plane radio frequency (RF) crosstalk at the interface between a processor and an audio interface within a computer system, thereby improving signal-to-noise ratio of the system.

Claim 36

Dependent Claim 66 words

A computer system according to claim 23, wherein: the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width are selected to form capacitive planes that are smaller in area than the printed circuit board to share usage of a layer or layers among other interconnections including buses, slow logic, and clock microstrip systems.

Claim 37

Dependent Claim 41 words

A computer system according to claim 23, wherein: the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width are selected to control usage of radio frequency (RF) power.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2002-06-14	2002-12-14	2003-06-15	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2006-06-14	2006-12-14	2007-06-15	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2010-06-14	2010-12-14	2011-06-15	$7700.00	Window Closed / Lapsed

Printed circuit board (PCB) including channeled capacitive plane structure

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