Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
181 words
A method of manufacturing a mask programmable array having a multiplicity of dual bit cells, wherein each cell has a channel and two bit storage areas self-aligned to the junctions of the channel and bit lines, and the two bits are read in opposite directions, the method comprising the steps of: depositing a bit line mask on a substrate in columns, said columns defining said channels thereunder and diffusion bit lines therebetween, each of said channels having a left and a right bit line junction with its neighboring said diffusion bit lines; separately programming the bit storage areas at said left and right bit line junctions; and removing said bit line mask, wherein each step of programming includes the steps of: depositing a junction mask over all bit line junctions which are to remain unprogrammed; implanting a self-aligned threshold pocket implant at an angle of 15-45° from vertical on said array, wherein said angle is to the right when programming said left bit line junctions and to the left when programming said right bit line junctions; and removing said junction mask.
Claim 2
Independent Claim
181 words
A method of manufacturing a mask programmable array having a multiplicity of dual bit cells, wherein each cell has a channel and two bit storage areas self-aligned to the junctions of the channel and bit lines, and the two bits are read in opposite directions, the method comprising the steps of: depositing a bit line mask on a substrate in columns, said columns defining said channels thereunder and diffusion bit lines therebetween, each of said channels having a left and a right bit line junction with its neighboring said diffusion bit lines; separately programming the bit storage areas at said left and right bit line junctions; and removing said bit line mask, wherein each step of programming includes the steps of: depositing a junction mask over all bit line junctions which are to remain unprogrammed; implanting a self-aligned threshold pocket implant at an angle of 15-45° from vertical on said array, wherein said angle is to the right when programming said left bit line junctions and to the left when programming said right bit line junctions; and removing said junction mask.
Claim 3
Dependent Claim
19 words
A method according to claim 1 and wherein said bit line mask is a formed of ultraviolet hardened photoresist.
Claim 4
Dependent Claim
17 words
A method according to claim 1 and wherein said bit line mask is formed of thick oxide.
Claim 5
Dependent Claim
22 words
A method according to claim 1 and also comprising the step of implanting said bit lines before said step of separately programming.
Claim 6
Dependent Claim
22 words
A method according to claim 1 and also comprising the step of implanting said bit lines after said step of separately programming.
Claim 7
Dependent Claim
41 words
A method according to claim 1 and also comprising, after said step of removing said bit line mask, the steps of creating a gate oxide layer on said array and depositing rows of polysilicon word lines over said gate oxide layer.
Claim 8
Dependent Claim
39 words
A method according to claim 1 and wherein said step of depositing a bit line mask comprises the steps of depositing a photoresist layer in the locations of the mask and hardening said photoresist layer by exposure to ultraviolet.
Claim 9
Dependent Claim
54 words
A method according to claim 1 and wherein said step of depositing a bit line mask comprises the steps of depositing a thick oxide layer, depositing a photoresist layer in the locations of the mask, etching the thick oxide layer which is found between elements of said photoresist layer, and removing said photoresist layer.
Claim 10
Dependent Claim
30 words
A method according to claim 1 and wherein said step of implanting comprises the steps of implanting a first material and implanting a second material, different than said first material.
Claim 11
Dependent Claim
24 words
A method according to claim 9 wherein said first material is Boron and said second material is one of the following: Arsenic and Phosphorous.