US6155247A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
Assignee: Micron Technology Inc
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Filing: 1999-03-17
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Granted: 2000-12-05
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Expires: 2019-03-17
Abstract
Abstract A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.
Inventors
- 👤 Salman Akram
- 👤 Derek J. Gochnour
- 👤 Michael E. Hess
- 👤 David R. Hembree
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 19:14
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0428; B; B28; B28D; B28D5/00; B28D5/02; B28D5/022; B28D5/024; B28D5/029; Y; Y10; Y10T; Y10T83/00; Y10T83/02; Y10T83/0207; Y10T83/0215; Y10T83/0222; Y10T83/0333; Y10T83/0363; Y10T83/04; Y10T83/0524; Y10T83/768; Y10T83/7684; Y10T83/7722; Y10T83/7726; Y10T83/7809; Y10T83/7868
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
68 words
A method of forming differently-dimensioned dice on a single semiconductor substrate, comprising: providing a semiconductor substrate including a plurality of semiconductor devices, at least two of which have at least one different dimension in an X-Y plane; and substantially singulating said semiconductor substrate into a plurality of dice with a saw, selected ones of said plurality of dice corresponding substantially to one of said plurality of semiconductor devices.
Claim 2
Independent Claim
68 words
A method of forming differently-dimensioned dice on a single semiconductor substrate, comprising: providing a semiconductor substrate including a plurality of semiconductor devices, at least two of which have at least one different dimension in an X-Y plane; and substantially singulating said semiconductor substrate into a plurality of dice with a saw, selected ones of said plurality of dice corresponding substantially to one of said plurality of semiconductor devices.
Claim 3
Dependent Claim
22 words
The method of claim 1, wherein each of said selected ones of said plurality of dice includes at least one semiconductor device.
Claim 4
Dependent Claim
39 words
The method of claim 1, wherein said substantially singulating comprises varying a lateral distance between successive parallel cuts of said saw to cause said at least one different dimension between at least two of said plurality of semiconductor devices.
Claim 5
Dependent Claim
26 words
The method of claim 3, wherein said varying includes laterally indexing said saw in multiples of a fixed increment of distance relative to said semiconductor substrate.
Claim 6
Dependent Claim
26 words
The method of claim 3, wherein said varying includes multiple indexing said semiconductor substrate in multiples of a fixed increment of distance relative to said saw.
Claim 7
Dependent Claim
24 words
The method of claim 1, wherein said substantially singulating includes substantially simultaneously cutting said semiconductor substrate with at least two blades of said saw.
Claim 8
Dependent Claim
25 words
The method of claim 6, further including subsequently cutting said semiconductor substrate with fewer blades of said saw than used in said substantially simultaneous cutting.
Claim 9
Independent Claim
107 words
A method of forming substrates having conductive traces thereon, comprising: providing a substrate on which conductive traces may be formed and defining columns of substrate segments to carry groups of said traces on a common substrate surface; forming said groups of traces on said common substrate surface in a manner wherein discrete groups of traces are connected to a common tie bar on said common substrate surface; concurrently severing tie bars from connected groups of traces lying on opposing sides of a street separating two columns of substrate segments carrying said tie bars and trace groups; and severing said two columns of substrate segments along said street.
Claim 10
Independent Claim
107 words
A method of forming substrates having conductive traces thereon, comprising: providing a substrate on which conductive traces may be formed and defining columns of substrate segments to carry groups of said traces on a common substrate surface; forming said groups of traces on said common substrate surface in a manner wherein discrete groups of traces are connected to a common tie bar on said common substrate surface; concurrently severing tie bars from connected groups of traces lying on opposing sides of a street separating two columns of substrate segments carrying said tie bars and trace groups; and severing said two columns of substrate segments along said street.
Claim 11
Dependent Claim
30 words
The method of claim 8, wherein said concurrently severing is effected by cutting through material connecting said tie bars from said groups of traces and into said common substrate surface.
Claim 12
Dependent Claim
19 words
The method of claim 8, wherein said concurrently severing extends to a depth less than that of said substrate.
Claim 13
Dependent Claim
15 words
The method of claim 8, wherein said concurrently severing comprises scribing said common substrate surface.
Claim 14
Dependent Claim
22 words
The method of claim 8, wherein said concurrently severing is performed by two adjacent saw blades carried by a common support structure.
Claim 15
Dependent Claim
42 words
The method of claim 12, wherein said concurrently severing is performed by laterally moving one of said two saw blades to a position aligned with said street, and raising the other of said two saw blades out of contact with said substrate.
Claim 16
Independent Claim
80 words
A method of fabricating an electronic device including a plurality of different components, comprising: forming at least one of each of said different components of said plurality for said electronic device on a single substrate; severing at least one of each of said different components of said plurality from said single substrate; and removing said at least one of each of said different components of said plurality from said single substrate and assembling said removed components into said electronic device.
Claim 17
Independent Claim
80 words
A method of fabricating an electronic device including a plurality of different components, comprising: forming at least one of each of said different components of said plurality for said electronic device on a single substrate; severing at least one of each of said different components of said plurality from said single substrate; and removing said at least one of each of said different components of said plurality from said single substrate and assembling said removed components into said electronic device.
Claim 18
Dependent Claim
13 words
The method of claim 14, wherein said single substrate comprises a semiconductor wafer.
Claim 19
Dependent Claim
16 words
The method of claim 15, further comprising assembling said electronic device as a radio-frequency ID device.
Claim 20
Dependent Claim
23 words
The method of claim 16, wherein said plurality of different components comprises at least a battery, an integrated circuit chip, and an antenna.
Claim 21
Dependent Claim
34 words
The method of claim 14, further including forming linear columns of components on said single substrate, wherein each column comprises a different component type than the component type in at least one adjacent column.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-12-05 | 2004-06-05 | 2004-12-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-12-05 | 2008-06-05 | 2008-12-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-12-05 | 2012-06-05 | 2012-12-05 | $7700.00 | Window Closed / Lapsed |