Patent US1708635A successfully refreshed from Google Patents.
Patent US6294059B1 successfully refreshed from Google Patents.
US6294059B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Substrate plating apparatus
Assignee: Ebara Corp
•
Filing: 1998-09-17
•
Granted: 2001-09-25
•
Expires: 2018-09-17
Abstract
Abstract A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit. The first plating unit, the first chemical mechanical polishing unit, the cleaning unit, the drying unit, and the substrate transfer unit are combined into a unitary arrangement.
Inventors
- 👤 Akihisa Hongo
- 👤 Naoaki Ogure
- 👤 Hiroaki Inoue
- 👤 Norio Kimura
- 👤 Fumio Kuriyama
- 👤 Manabu Tsujimura
- 👤 Kenichi Suzuki
- 👤 Atsushi Chono
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 09:31
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0451; H10P72/0452; H10P72/0454; C; C25; C25D; C25D17/00; C25D17/001; H10P14/00; H10P14/40; H10P14/46; H10P14/47; H10P72/0402; H10P72/0406; H10P72/0411; H10P72/0414; H10P72/0456; H10P72/0462; H10P72/0468; H10P72/0472; H10P72/0476; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/032; H10W20/033; H10W20/037; H10W20/056; H10P72/0441; Y; Y10; Y10S; Y10S134/00; Y10S134/902
Claims Analysis
Total Claims: 77
Claim 1
Independent Claim
134 words
An apparatus for plating and then polishing a substrate, comprising: a first plating unit to form a first layer on a surface of a substrate; a first chemical mechanical polishing unit to chemically mechanically polish the substrate to remove unwanted portions of the first layer from the surface of the substrate; a cleaning unit to clean the substrate after the substrate is chemically mechanically polished; a drying unit to dry the substrate after the substrate is cleaned; and a substrate transfer device to transfer the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit; wherein said first plating unit, said first chemical mechanical polishing unit, said cleaning unit, said drying unit, and said substrate transfer device form a unitary arrangement.
Claim 2
Independent Claim
134 words
An apparatus for plating and then polishing a substrate, comprising: a first plating unit to form a first layer on a surface of a substrate; a first chemical mechanical polishing unit to chemically mechanically polish the substrate to remove unwanted portions of the first layer from the surface of the substrate; a cleaning unit to clean the substrate after the substrate is chemically mechanically polished; a drying unit to dry the substrate after the substrate is cleaned; and a substrate transfer device to transfer the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit; wherein said first plating unit, said first chemical mechanical polishing unit, said cleaning unit, said drying unit, and said substrate transfer device form a unitary arrangement.
Claim 3
Dependent Claim
32 words
The apparatus by claim 1 , further comprising: a concentration analyzing device to analyze concentrations of components of a plating solution used by said first plating unit to form the first layer.
Claim 4
Dependent Claim
51 words
The apparatus by claim 2 , wherein said concentration analyzing device includes at least one of: (i) a copper ion concentration analyzer; (ii) an oxidizing agent concentration analyzer; (iii) a reducing agent concentration analyzer; (iv) a pH measuring unit; (v) an oxygen concentration analyzer; and (vi) a plating additive concentration analyzer.
Claim 5
Dependent Claim
23 words
The apparatus by claim 3 , wherein said first plating unit is to electroplate a copper layer on the surface of the substrate.
Claim 6
Dependent Claim
24 words
The apparatus by claim 3 , wherein said first plating unit is to electrolessly form a copper layer on the surface of the substrate.
Claim 7
Dependent Claim
28 words
The apparatus by claim 2 , further comprising: a plating solution preparing device to prepare a plating solution based on the concentrations analyzed by the concentration analyzing device.
Claim 8
Dependent Claim
24 words
The apparatus by claim 6 , wherein said concentration analyzing device and said plating solution preparing device form a part of said unitary arrangement.
Claim 9
Dependent Claim
17 words
The apparatus by claim 2 , wherein said concentration analyzing device forms part of said unitary arrangement.
Claim 10
Dependent Claim
23 words
The apparatus by claim 1 , further comprising: a second plating unit, wherein said second plating unit forms part of said unitary arrangement.
Claim 11
Dependent Claim
20 words
The apparatus by claim 9 , wherein said plating unit is to form a second layer on the first layer.
Claim 12
Dependent Claim
31 words
The apparatus by claim 10 , wherein said second plating unit is to form the second layer on the first layer after the unwanted portions of the first layer are removed.
Claim 13
Dependent Claim
31 words
The apparatus by claim 10 , wherein said second plating unit is to form the second layer on the first layer by forming a Ni—B protective layer on the first layer.
Claim 14
Dependent Claim
21 words
The apparatus by claim 9 , wherein said second plating unit is to form a second layer on the first layer.
Claim 15
Dependent Claim
24 words
The apparatus by claim 1 , wherein said first plating unit is to electrolessly form a copper layer on the surface of the substrate.
Claim 16
Dependent Claim
16 words
The apparatus by claim 14 , wherein said cleaning unit is to water clean the substrate.
Claim 17
Dependent Claim
23 words
The apparatus by claim 1 , wherein said first plating unit is to electroplate a copper layer on the surface of the substrate.
Claim 18
Dependent Claim
16 words
The apparatus by claim 16 , wherein said cleaning unit is to water clean the substrate.
Claim 19
Dependent Claim
31 words
The apparatus by claim 1 , further comprising: a discharging facility to discharge a cleaning solution used by said cleaning unit, wherein said discharging facility forms part of said unitary arrangement.
Claim 20
Dependent Claim
34 words
The apparatus by claim 1 , further comprising: a waste fluid treating facility for treating waste fluid of a solution used in said first chemical mechanical polishing unit for chemically mechanically polishing the substrate.
Claim 21
Dependent Claim
84 words
The apparatus by claim 1 , further comprising: a loading and unloading area to transfer a cassette which stores a substrate; and a first partition disposed between said loading and unloading area and said plating unit, said first partition having a passage defined therethrough to transfer the substrate between said loading and unloading area and said plating unit, wherein said apparatus is installed in a clean room, and wherein air pressure in said clean room is higher than air pressure in said plating unit.
Claim 22
Dependent Claim
34 words
The apparatus by claim 1 , further comprising: a second chemical mechanical polishing unit to chemically mechanically polish the polished substrate, wherein said second chemical mechanical polishing unit forms part of said unitary arrangement.
Claim 23
Independent Claim
169 words
An apparatus for plating and then polishing a substrate, comprising: a first plating unit to form a first layer on a surface of a substrate; a first chemical mechanical polishing unit to chemically mechanically polish the substrate to remove unwanted portions of the first layer from the surface of the substrate; a cleaning unit to clean the substrate after the substrate is chemically mechanically polished; a drying unit to dry the substrate after the substrate is cleaned; and a substrate transfer device to transfer the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit; wherein said first plating unit, said first chemical mechanical polishing unit, said cleaning unit, said drying unit, and said substrate transfer device form a unitary arrangement, and wherein said substrate transfer device comprises a robot having an arm, with said first plating unit, said first chemical mechanical polishing unit, said cleaning unit, and said drying unit being accessible by said arm.
Claim 24
Independent Claim
169 words
An apparatus for plating and then polishing a substrate, comprising: a first plating unit to form a first layer on a surface of a substrate; a first chemical mechanical polishing unit to chemically mechanically polish the substrate to remove unwanted portions of the first layer from the surface of the substrate; a cleaning unit to clean the substrate after the substrate is chemically mechanically polished; a drying unit to dry the substrate after the substrate is cleaned; and a substrate transfer device to transfer the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit; wherein said first plating unit, said first chemical mechanical polishing unit, said cleaning unit, said drying unit, and said substrate transfer device form a unitary arrangement, and wherein said substrate transfer device comprises a robot having an arm, with said first plating unit, said first chemical mechanical polishing unit, said cleaning unit, and said drying unit being accessible by said arm.
Claim 25
Independent Claim
108 words
An apparatus for forming a layer on a substrate, comprising: a loading and unloading area to transfer a cassette which stores a substrate; a plating area to form a layer on the substrate; and a cleaning and drying area to clean and dry the substrate; and a first partition disposed between said loading and unloading area and said plating area, said first partition having a passage defined therethrough to transfer the substrate between said loading and unloading area and said plating area, wherein said apparatus is installed in a clean room, and wherein air pressure in said clean room is higher than air pressure in said plating area.
Claim 26
Independent Claim
108 words
An apparatus for forming a layer on a substrate, comprising: a loading and unloading area to transfer a cassette which stores a substrate; a plating area to form a layer on the substrate; and a cleaning and drying area to clean and dry the substrate; and a first partition disposed between said loading and unloading area and said plating area, said first partition having a passage defined therethrough to transfer the substrate between said loading and unloading area and said plating area, wherein said apparatus is installed in a clean room, and wherein air pressure in said clean room is higher than air pressure in said plating area.
Claim 27
Dependent Claim
24 words
The apparatus by claim 23 , wherein said cleaning and drying area is disposed between said loading and unloading area and said plating area.
Claim 28
Dependent Claim
48 words
The apparatus by claim 24 , further comprising a second partition disposed between said loading and unloading area and said cleaning and drying area, said second partition having a passage defined therethrough to transfer the substrate between said loading and unloading area and said cleaning and drying area.
Claim 29
Dependent Claim
41 words
The apparatus by claim 25 , further comprising: a first shutter movably mounted to open and close said passage defined through said first partition; and a second shutter movably mounted to open and close said passage defined through said second partition.
Claim 30
Dependent Claim
44 words
The apparatus by claim 25 , wherein said apparatus is installed in a clean room, and wherein air pressure in said clean room is higher than air pressure in said cleaning and drying area, which is higher than air pressure in said plating area.
Claim 31
Dependent Claim
30 words
The apparatus by claim 23 , further comprising: a concentration analyzing device to analyze concentrations of components of a plating solution used by said plating area to form the layer.
Claim 32
Dependent Claim
51 words
The apparatus by claim 28 , wherein said concentration analyzing device includes at least one of: (i) a copper ion concentration analyzer; (ii) an oxidizing agent concentration analyzer; (iii) a reducing agent concentration analyzer; (iv) a pH measuring unit; (v) an oxygen concentration analyzer; and (vi) a plating additive concentration analyzer.
Claim 33
Dependent Claim
28 words
The apparatus by claim 28 , further comprising: a plating solution preparing device to prepare a plating solution based on the concentrations analyzed by the concentration analyzing device.
Claim 34
Dependent Claim
25 words
The apparatus by claim 23 , wherein said plating area includes a plating unit to electroplate a copper layer on the surface of the substrate.
Claim 35
Dependent Claim
26 words
The apparatus by claim 23 , wherein said plating area includes a plating unit to electrolessly form a copper layer on the surface of the substrate.
Claim 36
Dependent Claim
26 words
The apparatus by claim 23 , wherein said cleaning and drying area includes a first cleaning and drying arrangement and a second cleaning and drying arrangement.
Claim 37
Dependent Claim
18 words
The apparatus by claim 23 , wherein said plating area includes at least first and second plating units.
Claim 38
Dependent Claim
85 words
The apparatus by claim 34 , wherein said apparatus includes a generally longitudinally extending line passing through said loading and unloading area, said cleaning and drying area and said plating area, and wherein said first and second cleaning and drying arrangements are positioned on opposite sides of said generally longitudinally extending line, and at least one of said first and second plating units and at least another of said first and second plating units are positioned on opposite sides of said generally longitudinally extending line.
Claim 39
Dependent Claim
33 words
The apparatus by claim 35 , wherein said cleaning and drying area is disposed between said loading and unloading area and said plating area in a direction of said generally longitudinally extending line.
Claim 40
Dependent Claim
25 words
The apparatus by claim 23 , further comprising a transfer device to transfer the substrate from said plating area to said loading and unloading area.
Claim 41
Dependent Claim
13 words
The apparatus by claim 37 , wherein said transfer device comprises a robot.
Claim 42
Dependent Claim
20 words
The apparatus by claim 37 , wherein said transfer device comprises a first transfer unit and a second transfer unit.
Claim 43
Dependent Claim
48 words
The apparatus by claim 39 , wherein said first transfer unit is to transfer the substrate between said loading and unloading area and said cleaning and drying area and said second transfer unit is to transfer the substrate between said cleaning and drying area and said plating area.
Claim 44
Dependent Claim
14 words
The apparatus by claim 23 , wherein said plating area includes a transfer device.
Claim 45
Dependent Claim
13 words
The apparatus by claim 41 , wherein said transfer device comprises a robot.
Claim 46
Dependent Claim
24 words
The apparatus by claim 23 , further comprising: a first shutter movably mounted to open and close said passage defined through said first partition.
Claim 47
Dependent Claim
17 words
The apparatus by claim 23 , further comprising: airflow ducts for forming airflows in said plating area.
Claim 48
Dependent Claim
16 words
The apparatus by claim 23 , wherein said plating area is to electroplate a copper layer.
Claim 49
Dependent Claim
18 words
The apparatus by claim 23 , wherein said plating area includes at least first and second plating units.
Claim 50
Dependent Claim
36 words
The apparatus by claim 46 , wherein one of said first and second plating units is for electrolessly forming a layer and the other of said first and second plating units is for electroplating a layer.
Claim 51
Dependent Claim
46 words
The apparatus by claim 47 , wherein one of said first and second plating units is to form a first layer on the surface of the substrate, and the other of said first and second plating units is to form a layer on the first layer.
Claim 52
Dependent Claim
32 words
The apparatus by claim 23 , wherein said plating area includes at least one pretreatment chamber containing a pretreatment solution bath and at least one plating chamber containing a plating solution bath.
Claim 53
Dependent Claim
45 words
The apparatus by claim 23 , wherein said cleaning and drying area includes at least one water cleaning unit to clean the substrate after the layer has been formed thereon, at least one drying unit to dry the substrate after the substrate has been cleaned.
Claim 54
Independent Claim
134 words
An apparatus for plating and then polishing a substrate, comprising: a first plating unit to form a first layer on a surface of a substrate; a first chemical mechanical polishing unit to chemically mechanically polish the substrate to remove unwanted portions of the first layer from the surface of the substrate; a cleaning unit to clean the substrate after the substrate is chemically mechanically polished; a spin-drying unit to spin-dry the substrate after the substrate is cleaned; and a substrate transfer robot to transfer the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the spin-drying unit; wherein said first plating unit, said first chemical mechanical polishing unit, said cleaning unit, said spin-drying unit, and said substrate transfer robot form a unitary arrangement.
Claim 55
Independent Claim
134 words
An apparatus for plating and then polishing a substrate, comprising: a first plating unit to form a first layer on a surface of a substrate; a first chemical mechanical polishing unit to chemically mechanically polish the substrate to remove unwanted portions of the first layer from the surface of the substrate; a cleaning unit to clean the substrate after the substrate is chemically mechanically polished; a spin-drying unit to spin-dry the substrate after the substrate is cleaned; and a substrate transfer robot to transfer the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the spin-drying unit; wherein said first plating unit, said first chemical mechanical polishing unit, said cleaning unit, said spin-drying unit, and said substrate transfer robot form a unitary arrangement.
Claim 56
Dependent Claim
32 words
The apparatus by claim 51 , further comprising: a concentration analyzing device to analyze concentrations of components of a plating solution used by said first plating unit to form the first layer.
Claim 57
Dependent Claim
51 words
The apparatus by claim 52 , wherein said concentration analyzing device includes at least one of: (i) a copper ion concentration analyzer; (ii) an oxidizing agent concentration analyzer; (iii) a reducing agent concentration analyzer; (iv) a pH measuring unit; (v) an oxygen concentration analyzer; and (vi) a plating additive concentration analyzer.
Claim 58
Dependent Claim
28 words
The apparatus by claim 52 , further comprising: a plating solution preparing device to prepare a plating solution based on the concentrations analyzed by the concentration analyzing device.
Claim 59
Dependent Claim
23 words
The apparatus by claim 51 , further comprising: a second plating unit, wherein said second plating unit forms part of said unitary arrangement.
Claim 60
Dependent Claim
21 words
The apparatus by claim 55 , wherein said second plating unit is to form a second layer on the first layer.
Claim 61
Dependent Claim
23 words
The apparatus by claim 52 , wherein said first plating unit is to electroplate a copper layer on the surface of the substrate.
Claim 62
Dependent Claim
84 words
The apparatus by claim 51 , further comprising: a loading and unloading area to transfer a cassette which stores a substrate; and a first partition disposed between said loading and unloading area and said plating unit, said first partition having a passage defined therethrough to transfer the substrate between said loading and unloading area and said plating unit, wherein said apparatus is installed in a clean room, and wherein air pressure in said clean room is higher than air pressure in said plating unit.
Claim 63
Independent Claim
128 words
An apparatus for forming a layer on a substrate, comprising: a loading and unloading area to transfer a cassette which stores a substrate; a plating area with a plating chamber to form a layer on the substrate; a cleaning and drying area to clean and spin dry the substrate; a transfer robot to transfer the substrate from said plating area to said cleaning and drying area; a first partition disposed between said loading and unloading area and said plating area, said first partition having a passage defined therethrough to transfer the substrate between said loading and unloading area and said plating area, wherein said apparatus is installed in a clean room, and wherein air pressure in said clean room is higher than air pressure in said plating area.
Claim 64
Independent Claim
128 words
An apparatus for forming a layer on a substrate, comprising: a loading and unloading area to transfer a cassette which stores a substrate; a plating area with a plating chamber to form a layer on the substrate; a cleaning and drying area to clean and spin dry the substrate; a transfer robot to transfer the substrate from said plating area to said cleaning and drying area; a first partition disposed between said loading and unloading area and said plating area, said first partition having a passage defined therethrough to transfer the substrate between said loading and unloading area and said plating area, wherein said apparatus is installed in a clean room, and wherein air pressure in said clean room is higher than air pressure in said plating area.
Claim 65
Dependent Claim
24 words
The apparatus by claim 59 , wherein said cleaning and drying area is disposed between said loading and unloading area and said plating area.
Claim 66
Dependent Claim
48 words
The apparatus by claim 60 , further comprising a second partition disposed between said loading and unloading area and said cleaning and drying area, said second partition having a passage defined therethrough to transfer the substrate between said loading and unloading area and said cleaning and drying area.
Claim 67
Dependent Claim
44 words
The apparatus by claim 60 , wherein said apparatus is installed in a clean room, and wherein air pressure in said clean room is higher than air pressure in said cleaning and drying area, which is higher than air pressure in said plating area.
Claim 68
Dependent Claim
30 words
The apparatus by claim 60 , further comprising: a concentration analyzing device to analyze concentrations of components of a plating solution used by said plating area to form the layer.
Claim 69
Dependent Claim
52 words
The apparatus by claim 63 , wherein said concentration analyzing device includes at least one of: (i) a copper ion concentration on analyzer; (ii) an oxidizing agent concentration analyzer; (iii) a reducing agent concentration analyzer; (iv) a pH measuring unit; (v) an oxygen concentration analyzer; and (vi) a plating additive concentration analyzer.
Claim 70
Dependent Claim
28 words
The apparatus by claim 63 , further comprising: a plating solution preparing device to prepare a plating solution based on the concentrations analyzed by the concentration analyzing device.
Claim 71
Dependent Claim
25 words
The apparatus by claim 59 , wherein said plating area includes a plating unit to electroplate a copper layer on the surface of the substrate.
Claim 72
Dependent Claim
26 words
The apparatus by claim 59 , wherein said plating area includes a plating unit to electrolessly form a copper layer on the surface of the substrate.
Claim 73
Dependent Claim
18 words
The apparatus by claim 59 , wherein said plating area includes at least first and second plating units.
Claim 74
Dependent Claim
31 words
The apparatus by claim 59 , wherein said apparatus includes a generally longitudinally extending line passing through said loading and unloading area, said cleaning and drying area, and said plating area.
Claim 75
Dependent Claim
33 words
The apparatus by claim 69 , wherein said cleaning and drying area is disposed between said loading and unloading area and said plating area in a direction of said generally longitudinally extending line.
Claim 76
Dependent Claim
20 words
The apparatus by claim 59 , wherein said transfer robot comprises a first transfer unit and a second transfer unit.
Claim 77
Dependent Claim
48 words
The apparatus by claim 71 , wherein said first transfer unit is to transfer the substrate between said loading and unloading area and said cleaning and drying area and said second transfer unit is to transfer the substrate between said cleaning and drying area and said plating area.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-09-24 | 2005-03-26 | 2005-09-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-09-24 | 2009-03-26 | 2009-09-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-09-24 | 2013-03-26 | 2013-09-25 | $7700.00 | Window Closed / Lapsed |