Patent US4865873A successfully refreshed from Google Patents.
US4865873A
Expired / Lapsed
US
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Electroless deposition employing laser-patterned masking layer
Assignee: General Electric Co
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Filing: 1987-12-07
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Granted: 1989-09-12
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Expires: 2007-12-07
Abstract
Abstract A metal is electrolessly plated on a substrate which is first coated with at least one ablatively-removable layer that is selectively irradiated with laser radiation to obtain a pattern for the deposition of metal on the substrate. The electroless plating solution applied to the substrate after the irradiated substrate is coated with a catalyst also serves to remove the unirradiated portion of the ablatively-removable layer. The method is particularly suited for plating fine lines of metal, especially on non-planar surfaces.
Inventors
- 👤 Herbert S. Cole, Jr.
- 👤 Lionel M. Levinson
- 👤 Yung S. Liu
- 👤 Theresa A. Sitnik
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 13:44
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/184; C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1605; C23C18/1607; C23C18/1608; C23C18/18; C23C18/1803; C23C18/1824; C23C18/1827; C23C18/1831; C23C18/1851; C23C18/1872; C23C18/1875; C23C18/1879; C23C18/20; C23C18/2006; C23C18/2046; C23C18/2053; C23C18/206; C23C18/28; C23C18/30; C23C18/31; H05K2203/00; H05K2203/05; H05K2203/0562; H05K2203/0565; H05K2203/0577; H05K2203/10; H05K2203/107; H05K2203/14; H05K2203/1415; H05K3/0011; H05K3/0017; Y; Y10; Y10S; Y10S430/00; Y10S430/165
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
135 words
A method of electrolessly plating a metal on a substrate comprising: (a) coating the substrate with at least one layer of an ablatively-removable material to form a coated substrate; (b) irradiating at least a portion of the coated substrate with a sufficient amount of laser radiation to thereby ablatively remove the irradiated portion of the layer coated on the substrate; (c) terminating the step of irradiating at least a portion of the coated substrate; (d) coating the resulting irradiated substrate with a catalyst capable of instigating electroless deposition of the metal to be plated when contacted by an electroless plating solution; and (e) contacting the catalyst-coated substrate with an electroless plating solution to thereby plate the metal on the catalyst-coated irradiated portion of the substrate and simultaneously remove the unirradiated portion of the catalyst-coated layer.
Claim 2
Independent Claim
135 words
A method of electrolessly plating a metal on a substrate comprising: (a) coating the substrate with at least one layer of an ablatively-removable material to form a coated substrate; (b) irradiating at least a portion of the coated substrate with a sufficient amount of laser radiation to thereby ablatively remove the irradiated portion of the layer coated on the substrate; (c) terminating the step of irradiating at least a portion of the coated substrate; (d) coating the resulting irradiated substrate with a catalyst capable of instigating electroless deposition of the metal to be plated when contacted by an electroless plating solution; and (e) contacting the catalyst-coated substrate with an electroless plating solution to thereby plate the metal on the catalyst-coated irradiated portion of the substrate and simultaneously remove the unirradiated portion of the catalyst-coated layer.
Claim 3
Dependent Claim
23 words
The method of claim 1 wherein the electrolessly plated metal is selected from the group consisting of copper, palladium, nickel, cobalt and iron.
Claim 4
Dependent Claim
11 words
The method claim 2 wherein the electrolessly plated metal comprises copper.
Claim 5
Dependent Claim
22 words
The method of claim 1 wherein the catalyst is selected from the group consisting of palladium-containing compounds, nickel-containing compounds and platinum-containing compounds.
Claim 6
Dependent Claim
38 words
The method of claim 1 wherein said catalyst is selected from the group consisting of bis benzonitrile palladium chloride, palladium acetate, palladium bromide, palladium chloride, palladium iodide, palladium nitrate, palladium 1,1,1,5,5,5-hexafluoro-2,4-pentanedionate, palladium 2,4-pentanedionate, palladium trifluoroacetate and elemental palladium.
Claim 7
Dependent Claim
13 words
The method of claim 1 wherein the ablatively-removable material comprises a water-soluble polymer.
Claim 8
Dependent Claim
23 words
The method of claim 6 wherein the water-soluble polymer is selected from the group consisting of polyvinylpyrrolidone, polyvinyl alcohol, gelatin and polyalkylene ethers.
Claim 9
Dependent Claim
11 words
The method of claim 6 wherein the water-soluble polymer comprises polyvinylpyrrolidone.
Claim 10
Dependent Claim
40 words
The method of claim 1 wherein step (b) further comprises irradiating at least a portion of the coated substrate with laser radiation in the far to near ultraviolet region at a fluence of at least about 20 mJ/cm 2 .
Claim 11
Dependent Claim
22 words
The method of claim 9 wherein the rate of fluence is from about 20 mJ/cm 2 to about 300 mJ/cm 2 .
Claim 12
Dependent Claim
12 words
The method of claim 9 wherein the laser comprises an excimer laser.
Claim 13
Dependent Claim
28 words
The method of claim 9 wherein the wavelength of the laser radiation is selected from the group of wavelengths consisting of 193 nm, 248 nm and 308 nm.
Claim 14
Dependent Claim
26 words
The method of claim 1 wherein the substrate comprises one of the group consisting of polyimides, alumina, ceramics, silicone-polyimides, polysulfones, silicon, silicone rubbers and silicon dioxide.
Claim 15
Dependent Claim
44 words
The method of claim 1 wherein the substrate includes a metal layer in the irradiated portion of the substrate, the plated metal being deposited on the metal layer to thereby provide a low loss means of electrically interconnecting the substrate and another electronic component.
Claim 16
Dependent Claim
27 words
The method of claim 1 wherein the substrate includes a layer of insulative material thereon and the layer of ablatively-removable material is coated on the insulative layer.
Claim 17
Dependent Claim
53 words
The method of claim 15 wherein step (b) comprises irradiating at least a portion of the ablatively-removable layer and the corresponding portion of the insulative layer in registry therewith, with said laser radiation to thereby ablatively remove the irradiated portion of the coated, ablatively-removable layer and corresponding irradiated portion of the insulative layer.
Claim 18
Dependent Claim
10 words
The method of claim 1 wherein the substrate is non-planar.
Claim 19
Dependent Claim
19 words
The method of claim 1 wherein the at least one layer of ablatively-removable material includes an organic soluble layer.
Claim 20
Dependent Claim
21 words
The method of claim 18 wherein the organic soluble layer comprises one of the group consisting of polyvinylacetate, polystyrene and polymethylmethacrylate.
Claim 21
Dependent Claim
32 words
The method of claim 18 wherein the substrate includes a layer of insulative material thereon and the at least one layer of ablatively-removable material is coated on the layer of insulative material.
Claim 22
Independent Claim
126 words
A method of electrolessly plating copper on a substrate comprising: (a) coating the substrate with a layer consisting essentially of a water-soluble polymer; (b) irradiating at least a portion of the water-soluble polymer layer with a sufficient amount of laser radiation from an excimer laser to thereby ablatively remove said irradiated portions of the water-soluble polymer layer; (c) terminating the step of irradiating at least a portion of the water-soluble polymer layer; (d) coating with a palladium catalyst the surface of the substrate thus ablatively exposed; and (e) contacting the substrate and the water-soluble polymer layer thereon with an electroless copper solution to thereby plate copper on the catalyst-coated portion of the substrate and simultaneously remove the unirradiated portion of the palladium catalyst-coated water-soluble polymer layer.
Claim 23
Independent Claim
126 words
A method of electrolessly plating copper on a substrate comprising: (a) coating the substrate with a layer consisting essentially of a water-soluble polymer; (b) irradiating at least a portion of the water-soluble polymer layer with a sufficient amount of laser radiation from an excimer laser to thereby ablatively remove said irradiated portions of the water-soluble polymer layer; (c) terminating the step of irradiating at least a portion of the water-soluble polymer layer; (d) coating with a palladium catalyst the surface of the substrate thus ablatively exposed; and (e) contacting the substrate and the water-soluble polymer layer thereon with an electroless copper solution to thereby plate copper on the catalyst-coated portion of the substrate and simultaneously remove the unirradiated portion of the palladium catalyst-coated water-soluble polymer layer.
Claim 24
Dependent Claim
12 words
The method of claim 21 wherein said water soluble polymer comprises polyvinylpyrrolidone.
Claim 25
Dependent Claim
34 words
The method of claim 21 wherein the energy fluence of the radiation employed to ablatively remove portions of the water-soluble polymer layer is from about 20 mJ/cm 2 to about 300 mJ/cm 2 .
Claim 26
Dependent Claim
24 words
The method of claim 21 wherein the substrate includes a layer of insulative material thereon and the water-soluble polymer layer overlies the insulative layer.
Claim 27
Dependent Claim
55 words
The method of claim 24 wherein step (b) comprises irradiating with laser radiation at least a portion of the water-soluble polymer layer and the corresponding portion of the insulative layer in registry therewith, to thereby ablatively remove the irradiated portion of the water soluble polymer layer and the corresponding irradiated portion of the insulative layer.
Claim 28
Independent Claim
173 words
A method of electrolessly plating a metal on a substrate, said substrate including thereon a dual layer comprising an organic soluble material and a water-soluble polymer layer, said method comprising: (a) irradiating at least a portion of the water-soluble polymer layer and a corresponding portion of the organic soluble layer in registry therewith, with a sufficient amount of laser radiation to thereby ablatively remove the irradiated portion of the water-soluble polymer layer and the corresponding portion of the organic soluble layer; (b) terminating the step of irradiating at least a portion of the water-soluble polymer layer and a corresponding portion of the organic soluble layer in registry therewith; (c) coating the surface of the substrate, thus ablatively exposed, with a catalyst capable of instigating electroless deposition of the metal to be plated when the ablatively-exposed substrate surface is contacted by an electroless plating solution; and (d) contacting the catalyst-coated substrate with an electroless plating solution to thereby plate the metal on the ablatively-exposed substrate surface and simultaneously remove the unirradiated catalyst-coated dual layer.
Claim 29
Independent Claim
173 words
A method of electrolessly plating a metal on a substrate, said substrate including thereon a dual layer comprising an organic soluble material and a water-soluble polymer layer, said method comprising: (a) irradiating at least a portion of the water-soluble polymer layer and a corresponding portion of the organic soluble layer in registry therewith, with a sufficient amount of laser radiation to thereby ablatively remove the irradiated portion of the water-soluble polymer layer and the corresponding portion of the organic soluble layer; (b) terminating the step of irradiating at least a portion of the water-soluble polymer layer and a corresponding portion of the organic soluble layer in registry therewith; (c) coating the surface of the substrate, thus ablatively exposed, with a catalyst capable of instigating electroless deposition of the metal to be plated when the ablatively-exposed substrate surface is contacted by an electroless plating solution; and (d) contacting the catalyst-coated substrate with an electroless plating solution to thereby plate the metal on the ablatively-exposed substrate surface and simultaneously remove the unirradiated catalyst-coated dual layer.
Claim 30
Dependent Claim
20 words
The method of claim 26 wherein the water-soluble polymer layer is situated between the organic soluble layer and the substrate.
Claim 31
Dependent Claim
20 words
The method of claim 26 wherein the organic soluble layer is situated between the water-soluble polymer layer and the substrate.
Claim 32
Dependent Claim
20 words
The method of claim 14 wherein the metal layer comprises one of the group consisting of aluminum chromium and molybdenum.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-09-11 | 1993-03-13 | 1993-09-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-09-11 | 1997-03-13 | 1997-09-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-09-11 | 2001-03-13 | 2001-09-12 | $7700.00 | Window Closed / Lapsed |