Patent US5417841A successfully refreshed from Google Patents.
US5417841A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Copper plating of gravure rolls
Assignee: Atotech Deutschland GmbH and Co KG
•
Filing: 1994-10-25
•
Granted: 1995-05-23
•
Expires: 2014-10-25
Abstract
Abstract The invention relates to a process for depositing copper on a gravure roll comprising the steps of: immersing a gravure roll in an electroplating bath comprising A) copper, B) sulfuric acid, C) at least one alkoxythio compound, D) at least one sulfonated, sulfurized hydrocarbyl compound and E) at least one grain refining thio compound, and passing electric current through the bath to deposit copper on the gravure roll.
Inventors
- 👤 C. Richard Frisby
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 09:37
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/38
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
60 words
A process for depositing a layer of copper on a gravure roll comprising the steps of partially or completely immersing the gravure roll in an electroplating bath consisting essentially of copper ions, chloride ions, sulfuric acid, an alkoxythio compound, a sulfonated, sulfurized hydrocarbyl compound, and passing electric current through the bath to deposit a copper layer on the gravure roll.
Claim 2
Dependent Claim
60 words
A process for depositing a layer of copper on a gravure roll comprising the steps of partially or completely immersing the gravure roll in an electroplating bath consisting essentially of copper ions, chloride ions, sulfuric acid, an alkoxythio compound, a sulfonated, sulfurized hydrocarbyl compound, and passing electric current through the bath to deposit a copper layer on the gravure roll.
Claim 3
Dependent Claim
17 words
The process according to claim 1 wherein the copper ions are in the form of copper sulfate.
Claim 4
Dependent Claim
65 words
The process of claim 1 wherein the alkoxythio compound represented by one of the formulae H(OR).sub.n S(RO).sub.n H (III) or R.sub.1 S(RO).sub.n H (IV) wherein R is an alkylene group having from 1 to about 8 carbon atoms, each n is independently an average number from 1 to about 20, and R 1 is an alkyl group having from 1 to about 12 carbon atoms.
Claim 5
Dependent Claim
39 words
The process of claim 3 wherein each n is independently an average number from about 7 to about 11, R has from 2 to about 4 carbon atoms, and R 1 has from 1 to about 6 carbon atoms.
Claim 6
Dependent Claim
14 words
The process of claim 3 wherein the alkoxythio compound is represented by formula (III).
Claim 7
Dependent Claim
24 words
The process of claim 5 wherein n is from about 7 to about 11 and R has from 2 to about 4 carbon atoms.
Claim 8
Dependent Claim
13 words
The process of claim 1 wherein the alkoxythio compound is an ethoxylated thiodiglycol.
Claim 9
Dependent Claim
18 words
The process of claim 1 wherein the chloride ion is present from about 20 to about 80 ppm.
Claim 10
Dependent Claim
20 words
The process of claim 1 wherein the electric current is from about 60 to about 450 AMPS per square feet.
Claim 11
Dependent Claim
45 words
The process of claim 1 wherein the sulfuric acid is present from about 35 to about 90 g/l, the alkoxythio compound is present from about 0.01 to about 1.0 g/l, and the sulfonated, sulfurized hydrocarbyl compound is present from about 1 to about 100 mg/l.
Claim 12
Independent Claim
42 words
A method of controlling annealing in electrodeposited copper layers on gravure rolls comprising depositing the copper from an electroplating bath consisting essentially of copper ions, chloride ions, sulfuric acid, an alkoxythio compound and a sulfonated, sulfurized hydrocarbyl compound on the gravure roll.
Claim 13
Independent Claim
42 words
A method of controlling annealing in electrodeposited copper layers on gravure rolls comprising depositing the copper from an electroplating bath consisting essentially of copper ions, chloride ions, sulfuric acid, an alkoxythio compound and a sulfonated, sulfurized hydrocarbyl compound on the gravure roll.
Claim 14
Dependent Claim
84 words
A process for depositing a layer of copper on a gravure roll comprising the steps of partially or completely immersing the gravure roll in an electroplating bath comprising copper ions, chloride ions, sulfuric acid, at least one alkoxythio compound and at least one sulfonated, sulfurized hydrocarbyl compound, wherein the electroplating bath is free of grain refining compounds having the structural unit represented by one of the formulae ##STR2## and passing electric current through the bath to deposit a copper layer on the gravure roll.
Claim 15
Dependent Claim
84 words
A process for depositing a layer of copper on a gravure roll comprising the steps of partially or completely immersing the gravure roll in an electroplating bath comprising copper ions, chloride ions, sulfuric acid, at least one alkoxythio compound and at least one sulfonated, sulfurized hydrocarbyl compound, wherein the electroplating bath is free of grain refining compounds having the structural unit represented by one of the formulae ##STR2## and passing electric current through the bath to deposit a copper layer on the gravure roll.
Claim 16
Dependent Claim
21 words
An electroplating bath, consisting essentially of copper ions, chloride ion, sulfuric acid, an alkoxythio compound, and a sulfonated, sulfurized hydrocarbyl compound.
Claim 17
Dependent Claim
21 words
An electroplating bath, consisting essentially of copper ions, chloride ion, sulfuric acid, an alkoxythio compound, and a sulfonated, sulfurized hydrocarbyl compound.
Claim 18
Dependent Claim
16 words
The bath of claim 13 wherein the copper ions are in the form of copper sulfate.
Claim 19
Dependent Claim
65 words
The bath of claim 13 wherein the alkoxythio compound represented by one of the formulae H(OR).sub.n S(RO).sub.n H (III) or R.sub.1 S(RO).sub.n H (IV) wherein R is an alkylene group having from 1 to about 8 carbon atoms, each n is independently an average number from 1 to about 20, and R 1 is an alkyl group having from 1 to about 12 carbon atoms.
Claim 20
Dependent Claim
39 words
The bath of claim 15 wherein each n is independently an average number from about 7 to about 11, R has from 2 to about 4 carbon atoms, and R 1 has from 1 to about 6 carbon atoms.
Claim 21
Dependent Claim
14 words
The bath of claim 15 wherein the alkoxythio compound is represented by formula (III).
Claim 22
Dependent Claim
24 words
The bath of claim 17 wherein n is from about 7 to about 11 and R has from 2 to about 4 carbon atoms.
Claim 23
Dependent Claim
13 words
The bath of claim 13 wherein the alkoxythio compound is an ethoxylated thiodiglycol.
Claim 24
Dependent Claim
45 words
The bath of claim 13 wherein the sulfuric acid is present from about 35 to about 90 g/l, the alkoxythio compound is present from about 0.01 to about 1.0 g/l, and the sulfonated, sulfurized hydrocarbyl compound is present from about 1 to about 100 mg/l.
Claim 25
Independent Claim
112 words
A method of controlling hardness and brittleness of copper deposits on a gravure roll comprising the steps of: (i) taking a sample from a plating bath consisting essentially of copper ions, chloride ions, sulfuric acid, at least one alkoxythio compound, and at least one sulfonated, sulfurized hydrocarbyl compound and adding the sample to a Hull Cell; (ii) forming a deposit on a panel in a Hull Cell; (iii) determining roughness or brightness of the deposit on the panel; (iv) adding to the bath an amount sufficient to improve the roughness or brightness of the deposit of at least one mixture of (C) an alkoxythio compound and (D) a sulfonated, sulfurized hydrocarbyl compound.
Claim 26
Independent Claim
112 words
A method of controlling hardness and brittleness of copper deposits on a gravure roll comprising the steps of: (i) taking a sample from a plating bath consisting essentially of copper ions, chloride ions, sulfuric acid, at least one alkoxythio compound, and at least one sulfonated, sulfurized hydrocarbyl compound and adding the sample to a Hull Cell; (ii) forming a deposit on a panel in a Hull Cell; (iii) determining roughness or brightness of the deposit on the panel; (iv) adding to the bath an amount sufficient to improve the roughness or brightness of the deposit of at least one mixture of (C) an alkoxythio compound and (D) a sulfonated, sulfurized hydrocarbyl compound.
References Cited (Backward Citations)
US3328273A
Cited
US3542655A
Cited
US3682788A
Cited
US3798138A
Cited
US3751289A
Cited
US4229268A
Cited
US4334966A
Cited
US4384930A
Cited
US4781801A
Cited
US4832802A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-05-22 | 1998-11-21 | 1999-05-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-05-22 | 2002-11-21 | 2003-05-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-05-22 | 2006-11-21 | 2007-05-23 | $7700.00 | Window Closed / Lapsed |