Apparatus and method for testing for defects between memory cells in packaged semiconductor memory devices

Claim 2

A semiconductor device capable of receiving external power comprising: a semiconductor circuit having a plurality of circuit cells addressable by electrically conductive row and column lines, and having a power altering circuit for receiving the external power and providing an altered power signal to the semiconductor circuit, the altered power signal capable of being provided by an electrically conductive bus to the plurality of circuit cells through the plurality of row lines or the plurality of column lines; a die having the semiconductor circuit and a plurality of input terminals formed thereon, a first input terminal being electrically coupled to the electrically conductive bus, a first set of input terminals being coupled to and providing power signals to the semiconductor circuit, a second set of input terminals being coupled to and providing address signals to access circuit cells in the semiconductor circuit through the row and column lines, and a third set of input terminals being coupled to and providing input signals to and output signals from the semiconductor circuit; a plurality of electrically conductive leads each having an externally accessible end and a free end, the free ends of first, second and third sets of leads being electrically coupled to at least some of the input terminals in the first, second and third sets of input terminals, respectively, and at least one of the plurality of leads being a superfluous lead capable of being unused during operation of the semiconductor circuit; an electrical conductor coupled between the first input terminal and the free end of the superfluous lead, the superfluous lead capable of providing supplementary external power as the altered power signal during testing of the semiconductor circuit to the plurality of circuit cells through the electrical conductor, the first input terminal and the plurality of row or column lines; and an encapsulating material that encapsulates the semiconductor circuit, the die, the free ends of the leads and the electrical conductor as a packaged chip.

Claim 3

The semiconductor device of claim 1, further comprising a test mode circuit formed on the die that receives predetermined signals from at least some of the input terminals in one of the second and third sets of input terminals to initiate a test mode for the semiconductor device and allow the plurality of row lines to receive the altered power signal through the electrical conductor.

Claim 4

The semiconductor device of claim 1 wherein the encapsulating material forms the packaged chip as an automatically manipulatable packaged chip.

Claim 5

The semiconductor device of claim 1 wherein the power altering circuit is a voltage boosting circuit that boosts the external power to provide a boosted voltage to the plurality of row lines.

Claim 6

The semiconductor device of claim 1 wherein the each of leads is assigned to receive one the power, address, input and output signals, and wherein the superfluous lead is redundantly assigned to receive the power signal.

Claim 7

The semiconductor device of claim 1 wherein the each of leads is assigned to receive one of the power, address, input and output signals, and wherein the superfluous lead has an unused assignment so as to be unconnected to the semiconductor circuit in the absence of the electrical conductor.

Claim 8

The semiconductor device of claim 1 wherein alternate row lines in the plurality of row lines are capable of simultaneously receiving the altered power signal through the electrical conductor and of providing the altered power signal to approximately half of the plurality of circuit cells in a checkerboard pattern.

Claim 9

The semiconductor device of claim 1, further comprising a test mode circuit formed on the die that receives enable signals from the at least some of the input terminals in one of the second and third sets of input terminals to initiate a test mode for the semiconductor device and allows alternate row lines in the plurality of row lines to receive the altered power through the electrical conductor to thereby stress test the circuit cells for short circuit failures therebetween.

Claim 10

The semiconductor device of claim 1, further comprising at least one diode coupled between the first input terminal and the semiconductor circuit.

Claim 11

A semiconductor memory device capable of receiving external power comprising: a semiconductor memory circuit having an array of memory cells addressable by electrically conductive row and column lines, and having a voltage boosting circuit for providing boosted voltage from a supply voltage provided to the semiconductor memory circuit, the boosted voltage capable of being provided to the array of memory cells through the plurality of row lines; a die having the semiconductor memory circuit and a plurality of pads formed thereon, a first pad being electrically coupled to the voltage boosting circuit, a first set of pads being coupled to and providing power signals to the semiconductor memory circuit, a second set of pads being coupled to and providing address signals to access memory cells in the semiconductor memory circuit through the row and column lines, and a third set of pads being coupled to and providing input signals to and output signals from the semiconductor memory circuit; a plurality of electrically conductive leads each having a pin end assigned to receive one of the power, address, input and output signals and a free end, the free ends of first, second and third sets of leads being electrically coupled to at least some of the pads in the first, second and third sets of pads, respectively, and at least one of the leads being a selected lead capable of being unused during standard operation of the array of memory cells; an electrical conductor coupled between the first pad and the free end of the superfluous lead, the selected lead capable of providing supplementary external power as the boosted voltage to the array of memory cells through the electrical conductor, the first pad and at least some of the plurality of row and column lines during stress testing of the semiconductor memory circuit; and an encapsulating material that encapsulates the semiconductor memory circuit, the die, the free ends of the leads and the electrical conductor as a packaged chip.

Claim 12

A semiconductor memory device capable of receiving external power comprising: a semiconductor memory circuit having an array of memory cells addressable by electrically conductive row and column lines, and having a voltage boosting circuit for providing boosted voltage from a supply voltage provided to the semiconductor memory circuit, the boosted voltage capable of being provided to the array of memory cells through the plurality of row lines; a die having the semiconductor memory circuit and a plurality of pads formed thereon, a first pad being electrically coupled to the voltage boosting circuit, a first set of pads being coupled to and providing power signals to the semiconductor memory circuit, a second set of pads being coupled to and providing address signals to access memory cells in the semiconductor memory circuit through the row and column lines, and a third set of pads being coupled to and providing input signals to and output signals from the semiconductor memory circuit; a plurality of electrically conductive leads each having a pin end assigned to receive one of the power, address, input and output signals and a free end, the free ends of first, second and third sets of leads being electrically coupled to at least some of the pads in the first, second and third sets of pads, respectively, and at least one of the leads being a selected lead capable of being unused during standard operation of the array of memory cells; an electrical conductor coupled between the first pad and the free end of the superfluous lead, the selected lead capable of providing supplementary external power as the boosted voltage to the array of memory cells through the electrical conductor, the first pad and at least some of the plurality of row and column lines during stress testing of the semiconductor memory circuit; and an encapsulating material that encapsulates the semiconductor memory circuit, the die, the free ends of the leads and the electrical conductor as a packaged chip.

Claim 13

The semiconductor memory device of claim 10 wherein the selected lead is redundantly assigned to receive the power signal.

Claim 14

The semiconductor memory device of claim 10 wherein the selected lead has an unused assignment so as to be unconnected to the semiconductor memory circuit in the absence oft he electrical conductor.

Claim 15

The semiconductor memory device of claim 10 wherein alternate row lines in the plurality of row lines are capable of simultaneously receiving the altered power signal through the electrical conductor and of providing the altered power signal to approximately half of the array of memory cells in a checkerboard pattern.

Claim 16

The semiconductor memory device, of claim 10, further comprising a test mode circuit formed on the die that receives enable signals from the at least some of the pads in one of the second and third sets of pads to initiate a test mode for the semiconductor memory device and allows alternate row lines in the plurality of row lines to receive the boosted voltage through the electrical conductor to thereby stress test memory cells for short circuit failures therebetween.

Claim 17

The semiconductor memory device of claim 10, further comprising at least one diode coupled between the first pad and the semiconductor memory circuit.

Claim 18

A semiconductor memory device testing apparatus comprising: a semiconductor memory circuit having a plurality of memory cells addressable by electrically conductive row and column lines, and having a voltage boosting circuit for providing boosted voltage from a supply voltage provided to the semiconductor memory circuit, the boosted voltage capable of being provided to the plurality of memory cells through the plurality of row lines; a die having the semiconductor memory circuit and a plurality of pads formed thereon, a first pad being electrically coupled to the voltage boosting circuit, a first set of pads being coupled to and providing power signals to the semiconductor memory circuit, a second set of pads being coupled to and providing address signals to access memory cells in the semiconductor memory circuit through the row and column lines, and a third set of pads being coupled to and providing input signals to and output signals from the semiconductor memory circuit; a plurality of electrically conductive leads each having an externally accessible end assigned to receive one of the power, address, input and output signals and a free end, the free ends of first, second and third sets of leads being electrically coupled to at least some of the pads in the first, second and third sets of pads, respectively, at least one lead being a redundant or unused lead as specified under a semiconductor industry standard for the semiconductor memory device; an electrical conductor coupled between the first pad and the free end of the superfluous lead, the at least one lead capable of providing supplementary external power as the boosted voltage to the plurality of memory cells through the electrical conductor, the first pad and at least one of the plurality of row and column lines during testing of the semiconductor memory circuit; an encapsulating material that encapsulates the semiconductor memory circuit, the die, the free ends of the leads and the electrical conductor as a packaged chip; a testing circuit for applying the power, address and input signals to the packaged chip under direction of a test routine and analyzing the output signals therefrom; an external power source for supplying the supply voltage to the at least one lead; and a socket for releasably holding the packaged chip and electrically coupling the first, second and third sets of leads to the testing circuit and the at least one lead to the external power source during testing of the packaged chip.

Claim 19

A semiconductor memory device testing apparatus comprising: a semiconductor memory circuit having a plurality of memory cells addressable by electrically conductive row and column lines, and having a voltage boosting circuit for providing boosted voltage from a supply voltage provided to the semiconductor memory circuit, the boosted voltage capable of being provided to the plurality of memory cells through the plurality of row lines; a die having the semiconductor memory circuit and a plurality of pads formed thereon, a first pad being electrically coupled to the voltage boosting circuit, a first set of pads being coupled to and providing power signals to the semiconductor memory circuit, a second set of pads being coupled to and providing address signals to access memory cells in the semiconductor memory circuit through the row and column lines, and a third set of pads being coupled to and providing input signals to and output signals from the semiconductor memory circuit; a plurality of electrically conductive leads each having an externally accessible end assigned to receive one of the power, address, input and output signals and a free end, the free ends of first, second and third sets of leads being electrically coupled to at least some of the pads in the first, second and third sets of pads, respectively, at least one lead being a redundant or unused lead as specified under a semiconductor industry standard for the semiconductor memory device; an electrical conductor coupled between the first pad and the free end of the superfluous lead, the at least one lead capable of providing supplementary external power as the boosted voltage to the plurality of memory cells through the electrical conductor, the first pad and at least one of the plurality of row and column lines during testing of the semiconductor memory circuit; an encapsulating material that encapsulates the semiconductor memory circuit, the die, the free ends of the leads and the electrical conductor as a packaged chip; a testing circuit for applying the power, address and input signals to the packaged chip under direction of a test routine and analyzing the output signals therefrom; an external power source for supplying the supply voltage to the at least one lead; and a socket for releasably holding the packaged chip and electrically coupling the first, second and third sets of leads to the testing circuit and the at least one lead to the external power source during testing of the packaged chip.

Claim 22

The method of claim 17, further comprising the step of forming a protection diode coupled between the first pad and the voltage pump circuit.

Claim 23

The method of claim 17, further comprising the step of forming a test mode circuit on the die that receives signals from the at least some of the pads in one of the second and third sets of pads to initiate a test mode for the semiconductor memory device and allows alternate row lines in the plurality of row lines to receive the supplementary external power to thereby stress test memory cells for short circuit failures between memory cells.

Claim 24

The method of claim 17 wherein the steps of forming a voltage pump circuit and forming a semiconductor memory circuit form alternate row lines in the plurality of row lines that are capable of simultaneously receiving the altered power signal through the electrical conductor and of providing the altered power signal to approximately half of the plurality of memory cells in a checkerboard pattern.