Patent US5684332A successfully refreshed from Google Patents.
US5684332A
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US
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Method of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefrom
Assignee: Advanced Semiconductor Engineering Inc
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Filing: 1995-12-20
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Granted: 1997-11-04
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Expires: 2015-12-20
Abstract
Abstract A package for a semiconductor die having a plurality of bonding pads about its periphery is provided. The package has a plastic molding encapsulating the semiconductor die. The package also has a plurality of conductive leads with leads having inner and outer portions, the inner portions encapsulated in the molding and arranged substantially in a plane and radially about the semiconductor die with ends displaced from and forming a rectangle with four corners about the die. A bonding wire extends from each of the bonding pads to one of the inner portions of the leads. Bonding wire loop heights of approximately 8 mils are made with a specially designed tip of a capillary tool. The package also has a pair of leads with inner portions at opposite corners of the rectangle, each of the inner portions connected to a pair of bonding wires from a pair of contiguous bonding pads on the die. This double wiring arrangement prevents wire sweep during the injection molding step. Bonding pad pitches of 4 mils or less on the semiconductor die are possible.
Inventors
- 👤 C. M. Chen
- 👤 James Chung
- 👤 K. T. Lin
- 👤 Pony Maa
- 👤 Simon Li
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 22:14
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W70/00; H10W70/40; H10W70/464; H10W70/465; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07551; H10W72/07553; H10W72/50; H10W72/531; H10W72/541; H10W72/5449; H10W72/547; H10W72/5473; H10W72/90; H10W72/931; H10W72/932; H10W72/941; H10W72/944; H10W72/9445; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
180 words
A package and semiconductor die having a plurality of edges and a plurality of bonding pads along said edges, said package and semiconductor die comprising a plastic molding encapsulating said semiconductor die; a plurality of conductive leads, said leads having inner and outer portions, said inner portions encapsulated in said molding, said inner portions arranged substantially in a plane and radially about said semiconductor die, said inner portions having ends displaced from and forming a rectangle with four corners about said die; a bonding wire extending from each of said bonding pads to an inner portion of one of said leads, said bonding pads spaced evenly about said semiconductor die edges and having a pitch equal to, or less than, 4 mils, a majority of said leads having a single bonding wire connected to an inner portion thereof to a bonding pad; and only one pair of leads having inner portions at opposite corners of said rectangle, each of said inner portions connected to at least a pair of bonding wires from at least a pair of contiguous bonding pads.
Claim 2
Dependent Claim
180 words
A package and semiconductor die having a plurality of edges and a plurality of bonding pads along said edges, said package and semiconductor die comprising a plastic molding encapsulating said semiconductor die; a plurality of conductive leads, said leads having inner and outer portions, said inner portions encapsulated in said molding, said inner portions arranged substantially in a plane and radially about said semiconductor die, said inner portions having ends displaced from and forming a rectangle with four corners about said die; a bonding wire extending from each of said bonding pads to an inner portion of one of said leads, said bonding pads spaced evenly about said semiconductor die edges and having a pitch equal to, or less than, 4 mils, a majority of said leads having a single bonding wire connected to an inner portion thereof to a bonding pad; and only one pair of leads having inner portions at opposite corners of said rectangle, each of said inner portions connected to at least a pair of bonding wires from at least a pair of contiguous bonding pads.
Claim 3
Dependent Claim
103 words
A packaged device comprising a semiconductor die having a plurality of bonding pads, said bonding pads having a pitch equal to, or less than, 4 mils; a plastic molding encapsulating said semiconductor die; a plurality of conductive leads, said leads having inner and outer portions, said inner portions encapsulated in said molding, said inner portions substantially arranged in a plane and radially about said semiconductor die, said inner portions having ends displaced from and forming a rectangle with four corners about said die; and a bonding wire extending from each of said bonding pads to an inner portion of one of said leads.
Claim 4
Dependent Claim
103 words
A packaged device comprising a semiconductor die having a plurality of bonding pads, said bonding pads having a pitch equal to, or less than, 4 mils; a plastic molding encapsulating said semiconductor die; a plurality of conductive leads, said leads having inner and outer portions, said inner portions encapsulated in said molding, said inner portions substantially arranged in a plane and radially about said semiconductor die, said inner portions having ends displaced from and forming a rectangle with four corners about said die; and a bonding wire extending from each of said bonding pads to an inner portion of one of said leads.
Claim 5
Dependent Claim
18 words
The packaged and semiconductor die of claim 2 wherein said bonding wires have a diameter approximately 1.3 mils.
Claim 6
Dependent Claim
20 words
The packaged and semiconductor die of claim 2 wherein said bonding wires have a loop height of approximately 8 mils.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-11-03 | 2001-05-05 | 2001-11-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-11-03 | 2005-05-05 | 2005-11-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-11-03 | 2009-05-05 | 2009-11-04 | $7700.00 | Window Closed / Lapsed |