US5727727A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flowing solder in a gap
Assignee: VLT Corp
•
Filing: 1997-05-09
•
Granted: 1998-03-17
•
Expires: 2017-05-09
Abstract
Abstract The invention features a method for flowing solder in a gap between two surfaces. A supply of solder is heated to cause it to reflow and flow in the gap. The solder is directed to flow as a main stream in the gap and to flow as peripheral streams from the main stream toward edges of the gap to reduce formation of voids.
Inventors
- 👤 George J. Ead
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 18:08
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3452; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/255; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09663; H05K2201/09818; H05K2201/099; H05K2201/10; H05K2201/10613; H05K2201/10954; H05K2201/10969; H05K2201/20; H05K2201/2036; H05K2203/00; H05K2203/04; H05K2203/042; H05K3/0058; H05K3/0061; H05K3/3431; H10W72/00; H10W72/01; H10W72/011; H10W72/0113; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12701
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
58 words
A method for flowing solder in a gap between two surfaces, comprising providing a supply of solder, heating the solder to cause it to reflow and flow in the gap, and directing the solder to flow as a main stream in the gap and to flow as peripheral streams from the main stream toward edges of the gap.
Claim 2
Independent Claim
58 words
A method for flowing solder in a gap between two surfaces, comprising providing a supply of solder, heating the solder to cause it to reflow and flow in the gap, and directing the solder to flow as a main stream in the gap and to flow as peripheral streams from the main stream toward edges of the gap.
Claim 3
Dependent Claim
17 words
The method of claim 1 wherein directing comprises providing a solder flow control pattern within the gap.
Claim 4
Dependent Claim
17 words
The method of claim 1 wherein directing comprises causing the main stream to follow a tortuous path.
Claim 5
Dependent Claim
17 words
The method of claim 3 wherein directing comprises causing the main stream to follow a serpentine path.
Claim 6
Dependent Claim
17 words
The method of claim 3 wherein directing comprises causing the main stream to follow a straight path.
Claim 7
Dependent Claim
16 words
The method of claim 1 wherein providing comprises placing solder at an edge of the gap.
Claim 8
Dependent Claim
25 words
The method of claim 6 wherein directing comprises providing an unrestricted portal at the edge of the gap for flow of solder into the gap.
Claim 9
Independent Claim
59 words
A method for aiding flow of solder in a gap between two surfaces comprises forming flow controlling elements to define a pattern including a main solder flow path and peripheral solder flow paths from the main solder flow path, and holding the two surfaces in positions to form a gap between them and with the pattern in the gap.
Claim 10
Independent Claim
59 words
A method for aiding flow of solder in a gap between two surfaces comprises forming flow controlling elements to define a pattern including a main solder flow path and peripheral solder flow paths from the main solder flow path, and holding the two surfaces in positions to form a gap between them and with the pattern in the gap.
Claim 11
Dependent Claim
18 words
The method of claim 8 wherein forming comprises cutting the flow controlling elements into one of the surfaces.
Claim 12
Dependent Claim
16 words
The method of claim 9 wherein the flow controlling elements are milled with a machine tool.
Claim 13
Dependent Claim
17 words
The method of claim 9 wherein the flow controlling elements are cut with a chemical etching process.
Claim 14
Dependent Claim
11 words
The method of claim 8 wherein the surfaces are solder wettable.
Claim 15
Independent Claim
49 words
A method for aiding flow of solder in a gap between two surfaces comprising cutting a pattern of flow controlling elements into one of the surfaces with a laser, and holding the two surfaces in positions to form a gap between them and with the pattern in the gap.
Claim 16
Independent Claim
49 words
A method for aiding flow of solder in a gap between two surfaces comprising cutting a pattern of flow controlling elements into one of the surfaces with a laser, and holding the two surfaces in positions to form a gap between them and with the pattern in the gap.
Claim 17
Independent Claim
47 words
A method for aiding flow of solder in a gap between two surfaces comprising stamping a pattern of flow controlling elements into one of the two surfaces, and holding the two surfaces in positions to form a gap between them and with the pattern in the gap.
Claim 18
Independent Claim
47 words
A method for aiding flow of solder in a gap between two surfaces comprising stamping a pattern of flow controlling elements into one of the two surfaces, and holding the two surfaces in positions to form a gap between them and with the pattern in the gap.
Claim 19
Independent Claim
62 words
A method for aiding flow of solder in a space between two solderable surfaces comprising holding the two surfaces in positions to form a space between them, including dispensing epoxy dots on one of the two surfaces at predetermined points, placing the other of the two surfaces on the epoxy dots, the epoxy dots establishing the space, and curing the epoxy dots.
Claim 20
Independent Claim
62 words
A method for aiding flow of solder in a space between two solderable surfaces comprising holding the two surfaces in positions to form a space between them, including dispensing epoxy dots on one of the two surfaces at predetermined points, placing the other of the two surfaces on the epoxy dots, the epoxy dots establishing the space, and curing the epoxy dots.
Claim 21
Dependent Claim
20 words
The method of claim 15, further comprising forming a pattern of flow controlling elements in one of the two surfaces.
Claim 22
Dependent Claim
15 words
The method of claim 16 wherein the pattern and the epoxy dots establish the space.
Claim 23
Dependent Claim
54 words
A structure comprising two surfaces separated by a gap, a pattern of solder flow control elements in the gap, and a solder joint in the gap, the configuration of the solder joint being defined by the flow control elements to include a main solder path and peripheral solder paths from the main solder path.
Claim 24
Dependent Claim
54 words
A structure comprising two surfaces separated by a gap, a pattern of solder flow control elements in the gap, and a solder joint in the gap, the configuration of the solder joint being defined by the flow control elements to include a main solder path and peripheral solder paths from the main solder path.
Claim 25
Dependent Claim
13 words
The structure of claim 18 wherein the control elements are a solder mask.
Claim 26
Dependent Claim
11 words
The structure of claim 18 wherein the surfaces are thermally conductive.
Claim 27
Dependent Claim
11 words
The structure of claim 18 wherein the surfaces are solder wettable.
Claim 28
Dependent Claim
11 words
The structure of claim 18 wherein the control elements comprise fingers.
Claim 29
Dependent Claim
12 words
The structure of claim 18 wherein the control elements comprise a film.
Claim 30
Dependent Claim
46 words
A structure comprising two surfaces separated by a gap, a film pattern of solder flow control elements in the gap, wherein the film comprises Kapton MT, and a solder joint in the gap, the configuration of the solder joint being defined by the flow control elements.
Claim 31
Dependent Claim
46 words
A structure comprising two surfaces separated by a gap, a film pattern of solder flow control elements in the gap, wherein the film comprises Kapton MT, and a solder joint in the gap, the configuration of the solder joint being defined by the flow control elements.
Claim 32
Independent Claim
48 words
A method for flowing solder in a gap between two surfaces, comprising providing a supply of solder, heating the solder to cause it to reflow and flow in the gap, and directing the solder to flow as a main stream and as peripheral streams from the main stream.
Claim 33
Independent Claim
48 words
A method for flowing solder in a gap between two surfaces, comprising providing a supply of solder, heating the solder to cause it to reflow and flow in the gap, and directing the solder to flow as a main stream and as peripheral streams from the main stream.
Claim 34
Dependent Claim
40 words
A structure comprising two surfaces separated by a gap, a pattern of staggered solder flow control elements in the gap, and a solder joint in the gap, the configuration of the solder joint being defined by the flow control elements.
Claim 35
Dependent Claim
40 words
A structure comprising two surfaces separated by a gap, a pattern of staggered solder flow control elements in the gap, and a solder joint in the gap, the configuration of the solder joint being defined by the flow control elements.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-03-16 | 2001-09-15 | 2002-03-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-03-16 | 2005-09-15 | 2006-03-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-03-16 | 2009-09-15 | 2010-03-17 | $7700.00 | Window Closed / Lapsed |