US5906310A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Packaging electrical circuits
Assignee: VLT Corp
•
Filing: 1995-09-05
•
Granted: 1999-05-25
•
Expires: 2015-09-05
Abstract
Abstract A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces. The method further includes reflowing solder within the gap. A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device. A method for use in making a package for electrical circuits includes attaching an electrical insulator within a recess of a first metallic component. The method also includes registering a second metallic component within the recess using a template tool and bonding the second metallic component to the insulator. A third component is soldered to the second metallic component. A structure including an electrical conductor and a sheet of conductive material including a punt soldered to the electrical conductor.
Inventors
- 👤 Patrizio Vinciarelli
- 👤 Robert E. Belland
- 👤 George J. Ead
- 👤 Fred M. Finnemore
- 👤 Lance L. Andrus
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 21:06
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/10; H10W40/20; H10W40/25; H10W40/255; H10W42/00; H10W42/20; H10W42/80; H10W76/00; H10W76/10; H10W76/17; H10W90/00; H10W90/401; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/07337; H10W72/30; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5525; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
57 words
A method for soldering a first component having a solderable surface to a second component having a solderable surface, comprising holding the solderable surface of the first component in a position above a placement area on the solderable surface of the second component to establish a space between the solderable surfaces, and reflowing solder within the space.
Claim 2
Independent Claim
57 words
A method for soldering a first component having a solderable surface to a second component having a solderable surface, comprising holding the solderable surface of the first component in a position above a placement area on the solderable surface of the second component to establish a space between the solderable surfaces, and reflowing solder within the space.
Claim 3
Dependent Claim
18 words
The method of claim 1, further comprising, before reflowing, applying solder in the vicinity of the placement area.
Claim 4
Dependent Claim
19 words
The method of claim 2, wherein applying solder includes dispensing solder paste along a perimeter of the placement area.
Claim 5
Dependent Claim
25 words
The method of claim 2, wherein applying solder includes placing a solder preform on the solderable surface of the second component in the placement area.
Claim 6
Dependent Claim
65 words
The method of claim 4, wherein holding includes dispensing an adhesive pattern on the solderable surface of the second component in the vicinity of the placement area, pressing the first component onto the adhesive pattern, and releasing the first component to allow a portion of the adhesive pattern remaining between the first component and the second component to rebound, the solder preform establishing the space.
Claim 7
Dependent Claim
24 words
The method of claim 5, wherein pressing the first component onto the adhesive pattern registers the first component with respect to the second component.
Claim 8
Dependent Claim
11 words
The method of claim 5, further comprising curing the adhesive pattern.
Claim 9
Dependent Claim
12 words
The method of claim 5, wherein the adhesive pattern comprises epoxy dots.
Claim 10
Dependent Claim
29 words
The method of claim 5, wherein pressing the first component onto the adhesive pattern presses a portion of the solderable surface of the first component onto the adhesive pattern.
Claim 11
Dependent Claim
22 words
The method of claim 1 wherein reflowing includes heating the solderable surface of the second component to cause the solder to reflow.
Claim 12
Dependent Claim
15 words
The method of claim 1, further comprising, before reflowing, dispensing flux within the placement area.
Claim 13
Dependent Claim
30 words
The method of claim 1, further comprising, before holding, applying a solder mask to the solderable surface of the second component to form a corral which surrounds the placement area.
Claim 14
Dependent Claim
14 words
The method of claim 1, wherein the first component is an integrated power device.
Claim 15
Dependent Claim
13 words
The method of claim 1, wherein the second component is a metallic plate.
Claim 16
Dependent Claim
20 words
The method of claim 1, wherein holding includes applying an adhesive pattern between the first component and the second component.
Claim 17
Dependent Claim
11 words
The method of claim 15, further comprising curing the adhesive pattern.
Claim 18
Dependent Claim
12 words
The method of claim 15, wherein the adhesive pattern comprises epoxy dots.
Claim 19
Dependent Claim
18 words
The method of claim 15, wherein the adhesive pattern is applied along a perimeter of the placement area.
Claim 20
Dependent Claim
63 words
The method of claim 1, wherein holding includes dispensing an adhesive pattern on the solderable surface of the second component in the vicinity of the placement area, pressing the first component onto the adhesive pattern, and releasing the first component to allow a portion of the adhesive pattern remaining between the first component and the second component to rebound and establish the space.
Claim 21
Dependent Claim
24 words
The method of claim 19, wherein pressing the first component onto the adhesive pattern registers the first component with respect to the second component.
Claim 22
Dependent Claim
11 words
The method of claim 19, further comprising curing the adhesive pattern.
Claim 23
Dependent Claim
12 words
The method of claim 19, wherein the adhesive pattern comprises epoxy dots.
Claim 24
Dependent Claim
29 words
The method of claim 19, wherein pressing the first component onto the adhesive pattern presses a portion of the solderable surface of the first component onto the adhesive pattern.
Claim 25
Independent Claim
106 words
A method for soldering an integrated power device to a metallic plate, comprising anchoring a surface of a copper layer of the integrated power device above a placement area on a surface of the plate to leave a gap between the surfaces, including dispensing epoxy dots on the surface of the plate at predetermined points along a perimeter of the placement area, placing the integrated power device on the epoxy dots, the epoxy dots establishing the gap, and curing the epoxy dots, dispensing solder paste along the perimeter of the placement area, and heating the plate to cause the solder paste to reflow within the gap.
Claim 26
Independent Claim
106 words
A method for soldering an integrated power device to a metallic plate, comprising anchoring a surface of a copper layer of the integrated power device above a placement area on a surface of the plate to leave a gap between the surfaces, including dispensing epoxy dots on the surface of the plate at predetermined points along a perimeter of the placement area, placing the integrated power device on the epoxy dots, the epoxy dots establishing the gap, and curing the epoxy dots, dispensing solder paste along the perimeter of the placement area, and heating the plate to cause the solder paste to reflow within the gap.
Claim 27
Dependent Claim
17 words
The method of claim 24, further comprising, before dispensing solder paste, dispensing flux within the placement area.
Claim 28
Dependent Claim
28 words
The method of claim 24, further comprising, before anchoring, applying a solder mask to the surface of the plate to form a corral which surrounds the placement area.
Claim 29
Independent Claim
107 words
A method for soldering an integrated power device to a metallic plate, comprising anchoring a surface of a copper layer of the integrated power device above a placement area on a surface of the plate to leave a gap between the surfaces, including placing a solder preform on the placement area, dispensing epoxy dots on the surface of the plate at predetermined points along a perimeter of the placement area, placing the integrated power device on the epoxy dots, the thickness of the solder preform establishing the gap, and curing the epoxy dots, and heating the plate to cause the solder preform to reflow within the gap.
Claim 30
Independent Claim
107 words
A method for soldering an integrated power device to a metallic plate, comprising anchoring a surface of a copper layer of the integrated power device above a placement area on a surface of the plate to leave a gap between the surfaces, including placing a solder preform on the placement area, dispensing epoxy dots on the surface of the plate at predetermined points along a perimeter of the placement area, placing the integrated power device on the epoxy dots, the thickness of the solder preform establishing the gap, and curing the epoxy dots, and heating the plate to cause the solder preform to reflow within the gap.
Claim 31
Dependent Claim
18 words
The method of claim 27, further comprising, before placing the solder preform, dispensing flux within the placement area.
Claim 32
Dependent Claim
28 words
The method of claim 27, further comprising, before anchoring, applying a solder mask to the surface of the plate to form a corral which surrounds the placement area.
References Cited (Backward Citations)
DE1127179B
Cited
US3071854A
Cited
US3429040A
Cited
US3621338A
Cited
US3683241A
Cited
US3737729A
Cited
JPS50103452A
Cited
JPS519459A
Cited
JPS5211769A
Cited
JPS548462A
Cited
US4218724A
Cited
US4278990A
Cited
US4417296A
Cited
US4994215A
Cited
US4531145A
Cited
US4400762A
Cited
JPS5753948A
Cited
JPS57190768A
Cited
US4551747A
Cited
US4551746A
Cited
EP0141582A1
Cited
JPS60260192A
Cited
US4650107A
Cited
JPS61156791A
Cited
US4783697A
Cited
JPS61177762A
Cited
US4985097A
Cited
US4724283A
Cited
US4750089A
Cited
US4793543A
Cited
US4769525A
Cited
US4783695A
Cited
US4918811A
Cited
EP0264122A2
Cited
JPS63114095A
Cited
JPS63119242A
Cited
US4740414A
Cited
US4953005A
Cited
JPS63273398A
Cited
US4879630A
Cited
JPH01161892A
Cited
US4847136A
Cited
US5019946A
Cited
US4872081A
Cited
JPH02192792A
Cited
US5028987A
Cited
US5019941A
Cited
US5006673A
Cited
US4996116A
Cited
US5280850A
Cited
US5176309A
Cited
JPH0434260A
Cited
US5216279A
Cited
JPH0483367A
Cited
US5296735A
Cited
US5328751A
Cited
US5271548A
Cited
JPH0690083A
Cited
US5372295A
Cited
JPH05129515A
Cited
JPH0623534A
Cited
JPH05347475A
Cited
EP0577484A1
Cited
US5365403A
Cited
JPH0648851A
Cited
US5447267A
Cited
US5324890A
Cited
JPH07202475A
Cited
JPH07254781A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-05-24 | 2002-11-23 | 2003-05-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-05-24 | 2006-11-23 | 2007-05-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-05-24 | 2010-11-23 | 2011-05-25 | $7700.00 | Window Closed / Lapsed |