US6687990B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby
Assignee: Micron Technology Inc
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Filing: 2002-08-20
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Granted: 2004-02-10
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Expires: 2022-08-20
Abstract
Abstract A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades are disclosed. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices. The wafer saw may also be used to simultaneously sever and electrically isolate conductive traces that extend over adjacent semiconductor devices from connective lines therefor.
Inventors
- 👤 Salman Akram
- 👤 Derek J. Gochnour
- 👤 Michael E. Hess
- 👤 David R. Hembree
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 13:16
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0428; B; B28; B28D; B28D5/00; B28D5/02; B28D5/022; B28D5/024; B28D5/029; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/4913; Y10T29/49147; Y10T29/49149; Y10T29/49151; Y10T29/49155; Y10T29/49156; Y10T29/49789; Y10T29/49798; Y10T83/00; Y10T83/02; Y10T83/0259; Y10T83/04; Y10T83/0524; Y10T83/768; Y10T83/7809; Y10T83/7868
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
139 words
A method for forming discrete electronic devices comprising conductive traces, said method comprising: providing a substrate comprising a plurality of electronic components arranged in a plurality of columns, each adjacent pair of columns of said plurality of columns being separated from one another by a street located therebetween; disposing a plurality of groups of conductive traces on a surface of said substrate, at least two groups of conductive traces of said plurality of groups being disposed at least partially over different, adjacent electronic components, each group of conductive traces comprising a plurality of distinct conductive traces connected to one another by a common conductive trace; and substantially concurrently severing, from one another and from said common conductive trace, said plurality of distinct conductive traces of said at least two groups of conductive traces disposed over different, adjacent electronic components.
Claim 2
Independent Claim
139 words
A method for forming discrete electronic devices comprising conductive traces, said method comprising: providing a substrate comprising a plurality of electronic components arranged in a plurality of columns, each adjacent pair of columns of said plurality of columns being separated from one another by a street located therebetween; disposing a plurality of groups of conductive traces on a surface of said substrate, at least two groups of conductive traces of said plurality of groups being disposed at least partially over different, adjacent electronic components, each group of conductive traces comprising a plurality of distinct conductive traces connected to one another by a common conductive trace; and substantially concurrently severing, from one another and from said common conductive trace, said plurality of distinct conductive traces of said at least two groups of conductive traces disposed over different, adjacent electronic components.
Claim 3
Dependent Claim
17 words
The method according to claim 1 , further comprising severing said adjacent electronic components along said street.
Claim 4
Dependent Claim
21 words
The method according to claim 1 , wherein at least one of said plurality of electronic components comprises a semiconductor device.
Claim 5
Dependent Claim
27 words
The method of claim 1 , wherein said substantially concurrently severing comprises cutting through said at least two groups of conductive traces disposed on adjacent electronic components.
Claim 6
Dependent Claim
20 words
The method according to claim 4 , wherein said substantially concurrently severing comprises cutting at least partially through said substrate.
Claim 7
Dependent Claim
23 words
The method according to claim 5 , wherein said cutting at least partially through said substrate comprises scribing said surface of said substrate.
Claim 8
Dependent Claim
28 words
The method according to claim 1 , wherein said disposing said plurality of groups of conductive traces comprises positioning preformed conductive traces on said surface of said substrate.
Claim 9
Dependent Claim
27 words
The method according to claim 7 , wherein said positioning comprises positioning at least one group of conductive traces held together with at least one tie bar.
Claim 10
Dependent Claim
29 words
The method according to claim 8 , wherein said substantially concurrently severing comprises severing said at least one tie bar from said at least one group of conductive traces.
Claim 11
Dependent Claim
18 words
The method according to claim 1 , wherein said substantially concurrently severing is effected with a wafer saw.
Claim 12
Dependent Claim
17 words
The method according to claim 10 , wherein said wafer saw comprises at least two parallel blades.
Claim 13
Dependent Claim
17 words
The method according to claim 11 , further comprising severing said adjacent electronic components along said street.
Claim 14
Dependent Claim
46 words
The method according to claim 12 , wherein said severing said adjacent electronic components is effected by aligning one of said at least two parallel blades with said street and raising the other of said at least two parallel blades out of contact with said substrate.
Claim 15
Dependent Claim
31 words
The method according to claim 1 , wherein said disposing said plurality of groups of conductive traces comprises depositing material of said plurality of groups of conductive traces on said substrate.
Claim 16
Dependent Claim
12 words
The method according to claim 14 , wherein said depositing comprises electrodeposition.
Claim 17
Dependent Claim
44 words
The method according to claim 1 , wherein said substantially concurrently severing is effected at two discrete locations between said adjacent electronic components on opposite sides of an element by which said at least two groups of conductive traces are connected to one another.
Claim 18
Dependent Claim
25 words
The method according to claim 16 , wherein said substantially concurrently severing is effected with two blades of a saw comprising at least two blades.
Claim 19
Dependent Claim
18 words
The method according to claim 1 , further comprising substantially severing said adjacent electronic components from one another.
Claim 20
Dependent Claim
32 words
The method according to claim 1 , wherein said substantially concurrently severing comprises substantially concurrently severing said at least two groups of conductive traces from opposite sides of said common conductive trace.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-02-09 | 2007-08-11 | 2008-02-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-02-09 | 2011-08-11 | 2012-02-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-02-09 | 2015-08-11 | 2016-02-10 | $7700.00 | Window Closed / Lapsed |