Patent US5584933A successfully refreshed from Google Patents.
← Back to Patent Explorer
US5584933A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for plasma deposition and plasma CVD apparatus

Assignee: Sony Corp
•
Filing: 1995-06-07
•
Granted: 1996-12-17
•
Expires: 2015-06-07
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A process for plasma deposition is disclosed, which permits increasing the plasma deposition processing capacity. In a single substrate processing plasma CVD apparatus, chamber plasma cleaning (II) is done once for every plural deposition cycles (I). If necessary, for each deposition cycle the intensity of the electric field applied between pair electrodes is varied (for instance, increased to an extent corresponding to the deposition capacity reduction).

Inventors

  • 👤 Masaki Saito

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 13:05
CPC Classifications
C; C23; C23C; C23C16/00; C23C16/44; C23C16/50; C23C16/505; C23C16/509; C23C16/5096; C23C16/4401; C23C16/4405

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 65 words
A single substrate processing plasma CVD apparatus comprising: a chamber; a pair of electrodes disposed in said chamber, one of said electrodes supporting a substrate; means for generating an electric field between said pair of electrodes; said means for generating an electric field being controlled to vary the electric field intensity according to a thickness of a layer built up on one of said electrodes.
Claim 2
Dependent Claim 65 words
A single substrate processing plasma CVD apparatus comprising: a chamber; a pair of electrodes disposed in said chamber, one of said electrodes supporting a substrate; means for generating an electric field between said pair of electrodes; said means for generating an electric field being controlled to vary the electric field intensity according to a thickness of a layer built up on one of said electrodes.
Claim 3
Dependent Claim 26 words
The single substrate processing plasma CVD apparatus according to claim 1, wherein said electric field correcting means is for varying the distance between said two electrodes.
Claim 4
Dependent Claim 66 words
A single substrate processing plasma CVD apparatus, comprising: a chamber; a pair of electrodes within said chamber; means for applying an RF power to a space between said pair of electrodes to generate an electric field therebetween; said means for applying an RF power being controlled to vary the electric field intensity according to a thickness of a layer built up on one of said electrodes.
Claim 5
Dependent Claim 66 words
A single substrate processing plasma CVD apparatus, comprising: a chamber; a pair of electrodes within said chamber; means for applying an RF power to a space between said pair of electrodes to generate an electric field therebetween; said means for applying an RF power being controlled to vary the electric field intensity according to a thickness of a layer built up on one of said electrodes.
Claim 6
Dependent Claim 26 words
The single substrate processing plasma CVD apparatus according to claim 3, wherein said means for applying is controlled to vary an output of said RF power.
Claim 7
Dependent Claim 32 words
The single substrate processing plasma CVD apparatus according to claim 4, wherein said output of said RF power is increased with increasing thickness of said built up layer on said one electrode.
Claim 8
Dependent Claim 38 words
The single substrate processing plasma CVD apparatus according to claim 5, wherein a respective other of said electrodes is adapted to hold a substrate and said one electrode is arranged spaced apart and facing said respective other electrode.
Claim 9
Dependent Claim 38 words
The single substrate processing plasma CVD apparatus according to claim 3, wherein a respective other of said electrodes is adapted to hold a substrate and said one electrode is arranged spaced apart and facing said respective other electrode.
Claim 10
Dependent Claim 29 words
The single substrate processing plasma CVD apparatus according to claim 7, wherein said means for applying an RF power comprises an apparatus for adjusting a spacing between said electrodes.
Claim 11
Dependent Claim 29 words
The single substrate processing plasma CVD apparatus according to claim 3, wherein said means for applying an RF power comprises an apparatus for adjusting a spacing between said electrodes.
Claim 12
Dependent Claim 28 words
The single substrate processing plasma CVD apparatus according to claim 9, wherein said spacing is decreased with increasing thickness of said built up layer on said one electrode.
Claim 13
Dependent Claim 38 words
The single substrate processing plasma CVD apparatus according to claim 10, wherein a respective other of said electrodes is adapted to hold a substrate and said one electrode is arranged spaced apart and facing said respective other electrode.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-12-17 2000-06-17 2000-12-17 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-12-17 2004-06-17 2004-12-17 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-12-17 2008-06-17 2008-12-17 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag