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US6289732B1 Expired / Lapsed US ⏱️ 0.0 years remaining

Hermetically sealed semiconductor inertial sensor

Assignee: STMicroelectronics SRL
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Filing: 1997-12-09
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Granted: 2001-09-18
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Expires: 2017-12-09
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Abstract

Abstract An inertial sensor has a sensing element formed on one surface of a chip of semiconductor material and which is movable with respect to the chip. The sensing element is enclosed in a sealed hollow structure, in which the hollow structure includes a metal wall disposed on the surface around the sensing element, and a closure plate fixed to the wall.

Inventors

  • 👤 Bruno Murari
  • 👤 Paolo Ferrari
  • 👤 Benedetto Vigna

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 08:29
CPC Classifications
G; G01; G01P; G01P15/00; G01P15/02; G01P15/08; G01P15/0802; G01P1/00; G01P1/02; G01P1/023

Claims Analysis

Total Claims: 14
Claim 1
Independent Claim 85 words
A monolithic integrated circuit inertial sensor comprising: a monolithic integrated circuit substrate comprising semiconductor material; an inertial sensing element on a surface of said substrate and movable with respect thereto; and a hollow structure enclosing said inertial sensing element, said hollow structure comprising a metal wall disposed on the surface of said substrate around said inertial sensing element, said metal wall having a height at least as great as a height of said inertial sensing element, and a closure plate fixed to said metal wall.
Claim 2
Dependent Claim 85 words
A monolithic integrated circuit inertial sensor comprising: a monolithic integrated circuit substrate comprising semiconductor material; an inertial sensing element on a surface of said substrate and movable with respect thereto; and a hollow structure enclosing said inertial sensing element, said hollow structure comprising a metal wall disposed on the surface of said substrate around said inertial sensing element, said metal wall having a height at least as great as a height of said inertial sensing element, and a closure plate fixed to said metal wall.
Claim 3
Dependent Claim 19 words
A monolithic intergrated circuit inertial sensor according to claim 1 , wherein said metal wall compreses a welding alloy.
Claim 4
Dependent Claim 19 words
A monolithic intergrated circuit inertial sensor according to claim 1 , wherein said closure plate comprises a metal material.
Claim 5
Dependent Claim 19 words
A monolithic intergrated circuit inertial sensor according to claim 1 , wherein said closure plate comprises a polymeric material.
Claim 6
Dependent Claim 20 words
A monolithic intergrated circuit inertial sensor according to claim 1 , further comprising a processing circuit formed in said substrate.
Claim 7
Dependent Claim 26 words
A monolithic intergrated circuit inertial sensor according to claim 1 , further comprising a plastic container encapsulating said substrate, said sensing element, and said hollow structure.
Claim 8
Dependent Claim 82 words
A monolithic integrated circuit inertial sensor comprising: a monolithic integrated circuit substrate comprising semiconductor material; an inertial sensing element on a surface of said substrate and movable with respect thereto; a hollow structure enclosing said inertial sensing element and connected to said substrate, said hollow structure comprising a wall disposed on the surface of said substrate about said inertial sensing element, and a closure plate on said wall; and a processing circuit in said substrate and connected to said inertial sensing element.
Claim 9
Dependent Claim 82 words
A monolithic integrated circuit inertial sensor comprising: a monolithic integrated circuit substrate comprising semiconductor material; an inertial sensing element on a surface of said substrate and movable with respect thereto; a hollow structure enclosing said inertial sensing element and connected to said substrate, said hollow structure comprising a wall disposed on the surface of said substrate about said inertial sensing element, and a closure plate on said wall; and a processing circuit in said substrate and connected to said inertial sensing element.
Claim 10
Dependent Claim 16 words
A monolithic intergrated circuit inertial sensor according to claim 7 , wherein said wall comprises metal.
Claim 11
Dependent Claim 18 words
A monolithic intergrated circuit inertial sensor according to claim 7 , wherein said wall comprises a welding alloy.
Claim 12
Dependent Claim 19 words
A monolithic intergrated circuit inertial sensor according to claim 7 , wherein said closure plate comprises a metal material.
Claim 13
Dependent Claim 19 words
A monolithic intergrated circuit inertial sensor according to claim 7 , wherein said closure plate comprises a polymeric material.
Claim 14
Dependent Claim 26 words
A monolithic intergrated circuit inertial sensor according to claim 7 , further comprising a plastic container encapsulating said substrate, said sensing element, and said hollow structure.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2004-09-17 2005-03-19 2005-09-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2008-09-17 2009-03-19 2009-09-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2012-09-17 2013-03-19 2013-09-18 $7700.00 Window Closed / Lapsed

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