Patent US5166773A successfully refreshed from Google Patents.
US5166773A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
Assignee: Silicon Power Corp
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Filing: 1989-07-03
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Granted: 1992-11-24
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Expires: 2009-07-03
Abstract
Abstract A hermetic semiconductor package includes a ceramic lid with the device leads extending vertically through the lid. The leads are mechanically retained within the apertures in the lid and direct bonded to the lid to provide a hermetic seal and a substantial lead density.
Inventors
- 👤 Victor A. K. Temple
- 👤 Donald L. Watrous
- 👤 Constantine A. Neugebauer
- 👤 James F. Burgess
- 👤 II Homer H. Glascock
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 17:47
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/153
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
116 words
A packaged semiconductor chip comprising: a contact pad on a first surface of said chip; a lid including an electrically insulating substrate disposed adjacent to said first surface, said substrate having an aperture extending therethrough; a conductive pellet at least partially disposed within said aperture, configured for mechanical retention in said aperture and bonded to said contact pad on said first surface of said chip; and a conductive member extending across said aperture and bonded to said substrate; wherein the mechanical retention configuration results from said conductive pellet having been compressed in a direction perpendicular to a major surface of said substrate to expand said pellet laterally into intimate contact with the wall of said aperture.
Claim 2
Dependent Claim
116 words
A packaged semiconductor chip comprising: a contact pad on a first surface of said chip; a lid including an electrically insulating substrate disposed adjacent to said first surface, said substrate having an aperture extending therethrough; a conductive pellet at least partially disposed within said aperture, configured for mechanical retention in said aperture and bonded to said contact pad on said first surface of said chip; and a conductive member extending across said aperture and bonded to said substrate; wherein the mechanical retention configuration results from said conductive pellet having been compressed in a direction perpendicular to a major surface of said substrate to expand said pellet laterally into intimate contact with the wall of said aperture.
Claim 3
Dependent Claim
15 words
The packaged chip recited in claim 1 wherein said conductive member comprises a conductive foil.
Claim 4
Dependent Claim
18 words
The packaged chip recited in claim 2 wherein said conductive foil forms a hermetic seal with said substrate.
Claim 5
Dependent Claim
17 words
The packaged chip recited in claim 3 wherein said conductive pellet is bonded to said conductive foil.
Claim 6
Dependent Claim
17 words
The packaged chip recited in claim 3 wherein said conductive pellet is integral with said conductive foil.
Claim 7
Dependent Claim
29 words
The packaged chip recited in claim 3 further comprising: a base sealed to said lid to hermetically seal said chip within a package comprising said lid and said base.
Claim 8
Dependent Claim
27 words
The packaged chip recited in claim 6 further comprising: a frame disposed between said base and said lid and sealed to both said base and said lid.
Claim 9
Dependent Claim
66 words
The packaged chip recited in claim 7 wherein said chip has a further contact pad disposed on a second surface thereof which faces said base and said base comprises: an electrically insulating base substrate having an aperture therein; a conductive pellet at least partially disposed within said aperture in said base substrate and bonded to said further contact pad; and means for hermetically sealing said aperture.
Claim 10
Dependent Claim
23 words
The packaged chip recited in claim 8 wherein: said means for hermetically sealing comprises a conductive foil sealingly adhered to said base substrate.
Claim 11
Dependent Claim
27 words
The packaged chip recited in claim 1 wherein said conductive member comprises a patterned conductive member bonded to said pellet as an external terminal of said package.
Claim 12
Dependent Claim
19 words
The packaged chip recited in claim 10 wherein: said patterned conductive member is also bonded to said insulating lid.
Claim 13
Dependent Claim
28 words
The packaged chip recited in claim 3 wherein: said substrate comprises a ceramic; said conductive foil comprises copper; and said conductive foil is direct bonded to said substrate.
Claim 14
Dependent Claim
29 words
The packaged chip recited in claim 5 wherein: said conductive foil comprises copper; said conductive pellet comprises copper; and said conductive pellet is direct bonded to said conductive foil.
Claim 15
Dependent Claim
21 words
The packaged chip recited in claim 13 wherein: said substrate is ceramic and said pellet is direct bonded to said substrate.
Claim 16
Dependent Claim
49 words
The packaged chip recited in claim 10 wherein: said substrate comprises a ceramic, said conductive pellet comprises copper and said patterned conductive member comprises copper; said patterned conducive member is direct bonded to said pellet and said electrically insulating substrate; and said pellet is direct bonded to said substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-11-24 | 1996-05-25 | 1996-11-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-11-24 | 2000-05-25 | 2000-11-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-11-24 | 2004-05-25 | 2004-11-24 | $7700.00 | Window Closed / Lapsed |